• 한국세라믹학회지
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• 제50권6호
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• pp.410-415
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• 2013

$ZrB_2$-SiC ceramics are fabricated via hot pressing with different ratios of submicron or nano-sized SiC in a $ZrB_2$-20 vol%SiC system, in order to examine the effect of the SiC size ratio on the microstructures and physical properties, such as thermal conductivity, hardness, and flexural strength, of $ZrB_2$-SiC ceramics. Five different $ZrB_2$-SiC ceramics ($ZrB_2$-20 vol%[(1-x)SiC + xnanoSiC] where x = 0.0, 0.2, 0.5, 0.8, 1.0) are prepared in this study. The mean SiC particle sizes in the sintered bodies are highly dependent on the ratio of nano-sized SiC. The thermal conductivities of the $ZrB_2$-SiC ceramics increase with the ratio of nano-sized SiC, which is consistent with the percolation behavior. In addition, the $ZrB_2$-SiC ceramics with smaller mean SiC particle sizes exhibit enhanced mechanical properties, such as hardness and flexural strength, which can be explained using the Hall-Petch relation.

• 한국산학기술학회논문지
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• 제14권12호
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• pp.6106-6113
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• 2013

가솔린 엔진 차량용 삼원촉매담체는 주로 코제라이트 세라믹으로 제작되는 다공성 부품으로 엔진의 혼합기가 농후한 경우 삼원촉매의 열적 내구성이 급격히 떨어져 설계 내구 수명을 제대로 만족시키지 못하고 있다. 따라서 본 연구에서는 SiC 세라믹 촉매 담체의 내구성 평가에 사용할 기계적 물성치를 유한요소해석으로 구하기 위하여 등가물성평가방법을 이용하여 SiC 세라믹 하니컴 담체의 기계적 물성치를 유한요소해석용 시험편으로 구하였다. MOR과 탄성계수는 코제라이트 세라믹 하니컴 담체에 비하여 SiC 세라믹 하니컴 담체가 최소 2배와 9.3배 정도 크게 평가되고 있어 SiC 세라믹 하니컴 담체는 코제라이트 세라믹 하니컴 담체에 비하여 높은 구조 강도를 가지고 있다.

• 한국세라믹학회지
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• 제37권8호
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• pp.805-810
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• 2000

The formation, microstructure and properties of MoSi2/SiC ceramic composites by polymer pyrolysis were investigated for the application of heating element material. Polymethylsiloxanes were mixed with Si, SiC, MoSi2 as filler and ceramic composites prepared by pyrolysis in N2 atmosphere at 1320~145$0^{\circ}C$ were studied. Dimensional change, density variation and phases were analyzed and correlated to the resulting material properties. Microstructures of ceramic composite prepared by polymer pyrolysis were composed of MoSi2, SiC and silicon oxycarbide glass matrix. Depending on the pyrolysis conditions, ceramic composites with a density of 86~90 TD%, a fracture strength of 213~284 MPa, a thermal expansion coefficient of 4~7$\times$10-6 were obtained. The electrical resistivity of the specimen decreased with increasing of temperature up to 50$0^{\circ}C$.

• 한국분말재료학회지
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• 제19권5호
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• pp.379-384
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• 2012

This paper reports the microstructures and thermal conductivities of $ZrB_2$-SiC composite ceramics with size and amount of SiC. We fabricated sintered bodies of $ZrB_2$-x vol.% SiC (x=10, 20, 30) with submicron and nanosized SiC densified by spark plasma sintering. Microstructure retained the initial powder size of especially SiC, except the agglomeration of nanosized SiC. For sintered bodies, thermal conductivities were examined. The observed thermal conductivity values are 40~60 W/mK, which is slightly lower than the reported values. The relation between microstructural parameter and thermal conductivity was also discussed.

• 한국세라믹학회지
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• 제49권4호
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• pp.328-332
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• 2012

Etch rates of Si and high purity SiC have been compared for various fluorocarbon plasmas. The relative plasma resistance of SiC, which is defined as the etch rate ratio of Si to SiC, varied between 1.4 and 4.1, showing generally higher plasma resistance of SiC. High resolution X-ray photoelectron analysis revealed that etched SiC has a surface carbon content higher than that of etched Si, resulting in a thicker fluorocarbon polymer layer on the SiC surface. The plasma resistance of SiC was correlated with this thick fluorocarbon polymer layer, which reduced the reaction probability of fluorine-containing species in the plasma with silicon from the SiC substrate. The remnant carbon after the removal of Si as volatile etch products augments the surface carbon, and seems to be the origin of the higher plasma resistance of SiC.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2000년도 추계학술대회 논문집
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• pp.898-901
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• 2000

It is known that Si3N4 ceramic insert has less hardness than Al2O3 ceramic insert. But Si3N4 ceramic insert has not only high toughness and strength but also low thermal expansion coefficient, which makes it has longer tool life under thermal stress condition. In this study, commercial Si3N4 ceramic insert and home-made SiC-Si3N4 ceramic insert which has different sintering time and chemical composition is tested under various cutting conditions. The experimental result is compared in terms of tool life and cutting force. Generally, As the cutting speed and the feed rate increased, the cutting force and the flank wear increased too. The performance of SiC-Si3N4 ceramic insert shows the possibility to be a new ceramic tool.

• 대한기계학회논문집A
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• 제25권12호
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• pp.1944-1949
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• 2001

Four SiC-Si$_3$N$_4$ceramic cutting tools with different composition have been fabricated by hot-pressing. Correlations among the annealing time, the corresponding microstructure and the mechanical properties of resulting ceramics have been investigated. The fracture toughness and the grain size of both SiC and Si$_3$N$_4$in SiC-Si$_3$N$_4$composites increased with the annealing time. 1\`he hardness of SiC-Si$_3$N$_4$composites was relatively independent of the grain size and the sintered density. These ceramic cutting tools were tested under various cutting conditions and compared with the commercial Si$_3$N$_4$ceramic cutting tools. The experimental results were compared in terms of tool life and cutting force. The performance of SiC-Si$_3$N$_4$ceramic cutting tool shows the possibility to be a new ceramic tool.

• 한국표면공학회지
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• 제52권6호
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• pp.310-315
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• 2019

The use of a silicon carbide (SiC)-based composite ceramic layer for the mold of a curved cover glass was demonstrated. The stress of SiC/VDR/graphite-based mold structure was evaluated via finite element analysis. The results revealed that the maximum tensile stress primarly occured at the edge region. Moreover, the stress can be reduced by employing a relatively thick SiC coating layer and, therefore, layers of various thicknesses were deposited by means of chemical vapor deposition. During growth of the layer, the orientation of the facets comprising the SiC grain became dominant with additional intense SiC(220) and SiC(004). However, the roughness of the SiC layer increased with increasing thickness of the layer and. Hence, the thickness of the SiC layer needs to be adjusted by values lower than the tolerance band of the curved cover glass mold.

• 한국산학기술학회:학술대회논문집
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• 한국산학기술학회 2009년도 춘계학술발표논문집
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• pp.450-453
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• 2009

Compositional design and optimization of processing parameters are key factors for controlling and improving the properties of SiC-based electroconductive ceramic composites. Compare economic estimation of SiC ceramic heater with sheathe heater are as followings. (1) Temperature rising time of sheath heater is 1.1 times faster than SiC ceramic heater. (2) Heating insulation of SiC ceramic heater is 2.7 times larger than sheath heater. If SiC ceramic heater is one body type of a product application, contact resistance will decrease. I think that temperature initial rising time is faster than now. The more SiC ceramic heater is used for a long time, the more economic benefit is larger in the view point of heat insulation.

• 한국정밀공학회지
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• 제18권9호
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• pp.82-88
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• 2001

In order to fulfil the requirements of the various performance profiles of ceramic cutting tools, six different SiC-based ceramics have been fabricated by hot-pressing (SiC--${Si}_3 {N}_4$composites) or by hot-pressing and subsequent annealing (monolithic SiC and SiC-TiC composites). Correlation between the annealing time and the corresponding microstructure and the mechanical properties of resulting ceramics have been investigated. The grain size of both ${Si}_3 {N}_4$and SiC in SiC-${Si}_3 {N}_4$composites increased with the annealing time. Monolithic SiC has the highest hardness, SiC-TiC composite the highest toughness, and the SiC-${Si}_3 {N}_4$composite the highest strength among the ceramics investigated. The hardness of SiC-${Si}_3 {N}_4$composites was relatively independent of the grain size, but dependent on the sintered density. The cutting performance of the newly developed SiC-based ceramic cutting tools will be described in Part 2 of this paper.