• 제목/요약/키워드: SiC Paper

검색결과 943건 처리시간 0.026초

MoN 하지층을 이용한 스핀밸브의 자기저항 특성 (Magnetoresistance Properties of Spin Valves Using MoN Underlayer)

  • 김지원;조순철;김상윤;고훈;이창우
    • 한국자기학회지
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    • 제16권5호
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    • pp.240-244
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    • 2006
  • 본 연구에서는 하지층으로 사용한 Mo(MoN)의 두께 변화에 따른 스핀밸브 구조의 자기적 특성과 열처리 결과를 비교 검토하였다. 사용된 스핀밸브는 Si기판/$SiO_2/Mo(MoN)(t{\AA})/NiFe(21\;{\AA})/CoFe(28\;{\AA})/Cu(22\;{\AA})/CoFe(18\;{\AA})/IrMn(65\;{\AA})/Ta(25\;{\AA})$ 구조이다. 또한 본 연구에서는 MoN 하지층을 Si기판에 증착하여 열처리후 특성을 분석하였다. MoN 박막의 질소량이 증가(5 sccm까지)할수록 비저항은 증가하였다. $600^{\circ}C$에서 열처리 후 측정한 XRD 결과를 보면 Si/Mo(MoN) 박막에서 규소화합물을 발견할 수 없었다. MoN을 하지층으로 사용할 경우 $300^{\circ}C$에서 열처리 후 측정한 XPS 결과를 보면 질소 유입량이 5 sccm인 경우가 질소 유입량이 1 sccm인 경우보다 안정적임을 알았다. Mo(MoN) 하지층을 사용한 경우 하지층 두께 변화($45{\AA}$)에 따라 자기저항비와 교환결합력의 변화는 소폭이었다. Mo 하지층의 열처리 온도별 자기저항비는 열처리 전 상온에서 7.0%이었고, $220^{\circ}C$ 열처리 때 7.5%로 증가하였다. 이후 열처리 온도를 $300^{\circ}C$까지 증가 시키면 자기저항비는 7.5%에서 3.5%로 감소하였고, 질소유입량이 변화(5 sccm까지)하여도 유사한 경향을 보였다.

SiC SBD 적용한 고효율 Bridgeless PFC 컨버터에 대한 연구 (A Study on high efficiency Bridgeless PFC Converter applied SiC SBD)

  • 전준혁;김형식;김희준;안준선
    • 한국정보전자통신기술학회논문지
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    • 제12권4호
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    • pp.449-455
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    • 2019
  • 본 논문은 Bridgeless PFC Converter의 환류 다이오드를 SiC SBD(Schottky Barrier Diode)로 제안하여 고효율화를 달성하였다. 또한 Bridgeless PFC Converter의 동작원리에 대한 설명을 통해 Bridgeless PFC Converter에서 환류 다이오드의 도통 구간을 나타내어 환류 다이오드의 손실에 따른 시스템 손실의 기여도를 검증하였고, SiC SBD 소자의 물성 및 역 회복 특성에 따른 장점을 설명하였으며 턴 온 손실과 턴 오프 손실을 측정하여 효율을 비교 분석하고, 소자 단품 특성을 확인하기 위한 다이오드의 역회복 파형 분석을 통하여 소자의 역회복 손실을 계산하였다. 소자 특성을 고려한 시뮬레이션 결과 값을 도출해내어 실제 시스템의 파형 분석 및 비교를 통해 그 결과 값을 검증하였다. 소자 특성을 고려하기 위하여 PSIM의 Thermal Module을 사용하여 시뮬레이션을 진행하였으며, 그 결과로 턴온 손실 0.6W, 턴 오프 손실 20.6W로 전체 스위칭 손실은 22.2W로 나타났다. 시작품 실험을 통하여 분석한 결과 턴온 손실 0.608W, 턴 오프 손실 21.62W로 전체 스위칭 손실 22.228W의 결과 값을 도출하였고, 두 결과 값의 비교로 실험 방법의 타당성을 입증하였다. 또한 최대 효율 94.58%의 고효율을 달성하였다.

온도변화에 따른 백금 실리사이드-엔 실리콘 접합의 전자 터널링 특성 (Electron Tunneling Characteristics of PtSi-nSi Junctions according to Temperature Variations)

  • 장창덕;이정석;이광우;이용재
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 1998년도 춘계학술대회 논문집
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    • pp.87-91
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    • 1998
  • In this paper, We analyzed the current-voltage characteristics with n-type silicon substrates concentration and temperature variations (Room temperature, 50$^{\circ}C$, 75$^{\circ}C$) in platinum silicide and silicon junction. The electrical parameters of measurement are turn-on voltage, saturation current, ideality factor, barrier height, dynamic resistance in forward bias and reverse breakdown voltage according to variations of junction concentration of substrates and measurement temperature variations. As a result, the forward turn-on voltage, reverse breakdown voltage, barrier height and dynamic resistance were decreased but saturation currents and ideality factor were increased by substrates increased concentration variations in platinum silicide and n-silicon junction. In increased measurement temperature (RT, 50$^{\circ}C$, 75$^{\circ}C$), the extracted electrical parameter values of characteristics were rises by increased temperature variations according to the forward and reverse bias.

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용탕단조법에 의하여 제조한 $SiC_p$/Al 복합재료의 2차 성형공정이 기계적 성질에 미치는 영향 (Effects of Secondary Forming Process on Mechanical Properties of $SiC_p$/Al Composites Fabricated by Squeeze Casting)

  • 서영호;강충길
    • 대한기계학회논문집A
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    • 제20권11호
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    • pp.3474-3490
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    • 1996
  • A metal matrix composites(MMCs) for A16061 reinforced with silicon carbide particles is fabricated by melt-stirring method. The primary products of MMCs billets are prepared by volume fractions 5 vol% to 20 vol% and particle size $13\mu m$ to $22\mu m$.This paper will be made to examine the microstructure and mechanical properties of fabricated $SiC_p$/Al 6061 composite by melt-stirring and squeeze casting method. The MMC billets is extruded at $500^{\circ}C$ under the constant extrusion velocity $V_e$=2mm/min using curved shape die. Extrusion force, particle rearrangement, micro structure and mechanical properties of extruded composites will be investigated. The mechanical properties of primary billets manufactured by melt-stirring and squeeze casting method will be compared with extrusion specimen. The effect of volume fraction and size of the reinforcements will be studied. The increase in uniformity of particle dispersion is the major reason for an improvement in reliability due to hot extrusion with optimal shape die. Experimental Young's modulus and 0.2% offset yield strength for the extruded MMCs will be compared with theretical values calculated by the Eshelby method. A method will be proposed for the prediction of Young's modulus and yield strength in $SiC_p$ reinforced MMCs.

실리콘-탄소-그래핀 복합체 제조 및 리튬이온 이차전지 응용 (Preparation of Silicon-Carbon-Graphene Composites and their Application to Lithium Ion Secondary Battery)

  • 김선경;김찬미;장한권;장희동
    • 한국입자에어로졸학회지
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    • 제15권4호
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    • pp.127-137
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    • 2019
  • Recently, high electrochemical performance anode materials for lithium ion secondary batteries are of interest. Here, we present silicon-carbon-graphene (Si-C-GR) composites for high performance anode materials of lithium ion secondary battery (LIB). Aerosol process and heat-treatment were employed to prepare the Si-C-GR composites using a colloidal mixture of silicon, glucose, and graphene oxide precursor. The effects of the size of the silicon particles in Si-C-GR composites on the material properties including the morphology and crystal structure were investigated. Silicon particles ranged from 50 nm to 1 ㎛ in average diameter were employed while concentration of silicon, graphene oxide and glucose was fixed in the aerosol precursor. Morphology of as-fabricated Si-C-GR composites was generally the shape of a crumpled paper ball and the Si particles were well wrapped in carbon and graphene. The size range of composites was about from 2.2 to 2.9 ㎛. The composites including silicon particles larger than 200 nm in size exhibited higher performance as LIB anodes such as capacity and coulombic efficiency than silicon particles less than 100 nm, which were about 1500 mAh/g at 100 cycles in capacity and 99% in coulombic efficiency, respectively.

FRP 선박 외판재의 연삭마모 특성에 관한 연구 (A study on abrasive wear characteristics of side plate of FRP ship)

  • 김병탁;고성위
    • 수산해양기술연구
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    • 제44권3호
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    • pp.250-256
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    • 2008
  • Generally the side plate materials of FRP ship are composed of glass fiber and unsaturated polyester resin composites(GFRP composites). In this study, the effect of applied load and sliding speed on friction and wear characteristics of these materials were investigated at ambient temperature by pin-on-disc friction test. The cumulative wear volume, friction coefficient and wear rate of these materials for SiC abrasive paper were determined experimentally. The cumulative wear volume showed a tendency to increase nonlinearly with increase of sliding distance and was dependent on applied load and sliding speed for these composites. The friction coefficient of GFRP composites was increased as applied load increased at same sliding speed in wear test. It was verified by SEM photograph of worn surface that major failure mechanisms were microfracture, deformation of resin, cutting and cracking.

초고온 MEMS용 SiCN 미세구조물 제조 (Fabrication of SiCN Microstructures for Super-Temperature MEMS applications)

  • 우형순;김규현;노상수;정귀상
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2004년도 춘계학술대회 논문집 반도체 재료 센서 박막재료 전자세라믹스
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    • pp.125-128
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    • 2004
  • In this paper, a novel processing technique for fabrication of high-temperature MEMS based on polymer-derived SiCN microstructures is described. PDMS molds are fabricated on SU-8 photoresist using standard UV-photolithographic processes. Liquid precursors are injected into the PDMS mold. And then, the resulting solid polymer structures are crosslinked under isostatic pressure, and pyrolyzed to form a ceramic capable of withstanding over $1500^{\circ}C$. These fabricated SiCN structures would be applied for high-temperature applications, such as heat exchanger and combustion chamber.

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평면도파로형 광증폭기 제작을 위한 $Er^+$이 첨가된 $SiO_2$ 박막 특성 (The Characteristics $Er^+$ Doped $SiO_2$ Thin Film for the Fabrication of the Planar Light Waveguide Amplifier)

  • 최영복;문동찬
    • 한국전기전자재료학회논문지
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    • 제11권9호
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    • pp.739-745
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    • 1998
  • The objective of this paper is to provide experimental data of Er(rare- earth)doped $SiO_2$thin film made by sputtering methods. The deposition rate of silica glass by sputtering method was 55$\AA$/min. In EDD measurements, the average Er concentration in the deposited film was 0.77(wt%). After annealing at $900^{\circ}C$, the Cl concentration decreased from 3.79(wt%) to 1.52(wt%). The refractive indices of the core $n_1$, cladding $n_2$ were 1.458, 1.558 respectively at 632.8 nm. The refractive index difference between core and cladding, $\Delta$n was 0.1. The refractive index profile of core and cladding interface shows step profile. In the study, $SiO_2$ glass films of Si wafer were successfully doped with active erbium. Therefore, this experimental data will be applicable for fabrications of Er doped planar integrated optical device.

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PDMS 몰드를 이용한 초고온용 SiCN 구조물의 제작 (Fabrication of SiCN structures using PDMS mold for high-temperature applications)

  • 우형순;김규현;정귀상
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2003년도 추계학술대회 논문집 Vol.16
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    • pp.376-379
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    • 2003
  • In this paper, a novel processing technique for fabrication of high-temperature MEMS based on polymer-derived SiCN microstructures is described. PDMS molds are fabricated on SU-8 photoresist using standard UV-photolithographic processes. Liquid precursors are injected into the PDMS mold. And then, the resulting solid polymer structures are crosslinked under isostatic pressure, and pyrolyzed to form a ceramic capable of withstanding over $1500^{\circ}C$. These fabricated SiCN structures would be applied for high-temperature applications, such as heat exchanger and combustion chamber.

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GaN FET를 적용한 인터리브 CRM PFC의 효율특성에 관한 연구 (A Study on the Efficiency Characteristics of the Interleaved CRM PFC using GaN FET)

  • 안태영;장진행;길용만
    • 전력전자학회논문지
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    • 제20권1호
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    • pp.65-71
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    • 2015
  • This paper presents the efficiency analysis of a critical current mode interleaved PFC rectifier, in which each of three different semiconductor switches is employed as the active switch. The Si FET, SiC FET, and GaN FET are consecutively used with the prototype PFC rectifier, and the efficiency of the PFC rectifier with each different semiconductor switch is analyzed. An equivalent circuit model of the PFC rectifier, which incorporates all the internal losses of the PFC rectifier, is developed. The rms values of the current waveforms main circuit components are calculated. By adapting the rms current waveforms to the equivalent model, all the losses are broken down and individually analyzed to assess the conduction loss, switching loss, and magnetic loss in the PFC rectifier. This study revealed that the GaN FET offers the highest overall efficiency with the least loss among the three switching devices. The GaN FET yields 96% efficiency at 90 V input and 97.6% efficiency at 240 V, under full load condition. This paper also confirmed that the efficiency of the three switching devices largely depends on the turn-on resistance and parasitic capacitance of the respective switching devices.