• Title/Summary/Keyword: Si-Si coupling

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Silicon Substrate Coupling Modeling, Analysis, and Substrate Parameter Extraction Method for RF Circuit Design (RF 회로 설계를 위한 실리콘 기판 커플링 모델링, 해석 및 기판 파라미터 추출)

  • Jin, Woo-Jin;Eo, Yung-Seon;Shim, Jong-In
    • Journal of the Institute of Electronics Engineers of Korea TC
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    • v.38 no.12
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    • pp.49-57
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    • 2001
  • In this paper, equivalent circuit model and novel model parameter extraction method of a silicon(Si) substrate are presented. Substrate coupling through Si-substrate is quantitatively investigated by analyzing equivalent circuit with operating frequency and characteristic frequencies (i.e., pole and zero frequency) of a system. For the experimental verification of the equivalent circuit and parameter extraction method, test patterns are designed and fabricated in standard CMOS technology with various isolation distances, substrate resistivity, and guard-ring structures. Then, these are measured in l00MHz-20GHz frequency range by using vector network analyzer. It is shown that the equivalent-circuit-based HSPICE simulation results using extracted parameters have excellent agreement with the experimental results. Thus, the proposed equivalent circuit and parameter extraction methodology can be usefully employed in mixed-signal circuit design and verification of a circuit performance.

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Preparation and Characterization of Hard Coating Materials Based on Silane Modified Boehmite Hybrid Materials (Bohemite 나노졸을 이용한 내구성 코팅재료의 제조와 특성에 관한 연구)

  • Jeon, Seong Je;Kim, Woong;Lee, Jai Joon;Koo, Sang Man
    • Applied Chemistry for Engineering
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    • v.17 no.6
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    • pp.580-585
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    • 2006
  • UV-thermal dually curable coating materials were prepared by the sol-gel method. Nano-sized colloidal boehmite was treated with various organo silane coupling agents. These materials could be well dispersed in various alcohols and relatively polar organic solvents such as tetrahydrofuran and acetonitrile. The coating films were prepared by a spin coating method on various substrates, which were characterized by FT-IR, Si/Al CP MAS NMR spectra, UV-Vis spectrophotometer, FE-SEM, Taber abraser, haze meter, and pencil hardness tester. The effects of molar ratio and types of silane coupling agents, curing method and ion-shower treatment were investigated. Dually curable coating method offered an optimally good quality film in both hardness and transmittance. The transparency and the hardness of the prepared films were increased with amounts of 3-(trimethoxysilyl)propylmethacrylate, and (3-glycidyloxypropyl)trimethoxysilane, respectively. The adhesion between coated layer and substrate could be enhanced by ion-shower treatment.

Interfacial Charge Transport Anisotropy of Organic Field-Effect Transistors Based on Pentacene Derivative Single Crystals with Cofacial Molecular Stack (코페이셜 적층 구조를 가진 펜타센 유도체 단결정기반 유기트랜지스터의 계면 전하이동 이방성에 관한 연구)

  • Choi, Hyun Ho
    • Journal of Adhesion and Interface
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    • v.20 no.4
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    • pp.155-161
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    • 2019
  • Understanding charge transport anisotropy at the interface of conjugated nanostructures basically gives insight into structure-property relationship in organic field-effect transistors (OFET). Here, the anisotropy of the field-effect mobility at the interface between 6,13-bis(triisopropylsilylethynyl) pentacene (TIPS-pentacene) single crystal with cofacial molecular stacks in a-b basal plane and SiO gate dielectric was investigated. A solvent exchange method has been used in order for TIPS-pentacene single crystals to be grown on the surface of SiO2 thin film, corresponding to the charge accumulation at the interface in OFET structure. In TIPS-pentacene OFET, the anisotropy ratio between the highest and lowest measured mobility is revealed to be 5.2. By analyzing the interaction of a conjugated unit in TIPS-pentacene with the nearest neighbor units, the mobility anisotropy can be rationalized by differences in HOMO-level coupling and hopping routes of charge carriers. The theoretical estimation of anisotropy based on HOMO-level coupling is also consistent with the experimental result.

Anisotropy Control of Highly Magnetostrictive Films by Bias Stress (바이어스 응력에 의한 고자왜 아몰퍼스 박막의 자기이방성 제어)

  • Shin, Kwang-Ho;Kim, Young-Hak;Park, Kyung-Il;Sa-Gong, Geon
    • Journal of the Korean Magnetics Society
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    • v.13 no.5
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    • pp.193-197
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    • 2003
  • To materialize the magnetoelastic devices, such as a highly functional sensor and a signal processing device, using the Fe base amorphous film which has both excellent soft magnetic and magnetostrictive properties, in this study, a new method to control the magnetic anisotropy of a highly magnetostrictive film using bias stress has been proposed and tested. The film pattern, which was stressed by its substrate bending, was subjected to annealing for relieving its stress. Successively, the compressive stress occurred by flattening the substrate was formed in the pattern. With the introduction of the residual compressive stress, the magnetization of the film pattern was aligned in the transverse direction through magnetoelasic coupling. The magnetic domain structure and magnetization curve of the film pattern of which magnetic anisotropy was controlled by the proposed method were presented to verify the availability of the method.

Feasible approach of contactless power transfer technology combined with HTS coils based on electromagnetic resonance coupling

  • Chung, Yoon Do;Yim, Seong Woo;Hwang, Si Dole
    • Progress in Superconductivity and Cryogenics
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    • v.15 no.1
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    • pp.40-44
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    • 2013
  • The contactless power transfer (CPT) systems have been recently gaining popularity widely since it is an available option to realize the power delivery and storage with connector-free devices across a large air gap. Especially, the CPT with electromagnetic resonance coupling method is possible to exchange energy within 2 m efficiently. However, the power transfer efficiency of CPT in commercialized products has been limited because the impedance matching of coupled coils is sensitive. As a reasonable approach, we combined the CPT system with HTS wire technology and called as, superconducting contactless power transfer (SUCPT) system. Since the superconducting coils have an enough current density, the superconducting antenna and receiver coils at CPT system have a merit to deliver and receive a mass amount of electric energy. In this paper, we present the feasibility of the SUCPT system and examine the transmission properties of SUCPT phenomenon between room temperature and very low temperature at 77 K as long as the receiver is within 1.0 m distance.

Solution-processible corrugated structure and scattering layer for enhanced light extraction from organic light-emitting diodes

  • Hyun, Woo Jin;Im, Sang Hyuk;Park, O Ok;Chin, Byung Doo
    • Journal of Information Display
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    • v.13 no.4
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    • pp.151-157
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    • 2012
  • A simple method of fabricating out-coupling structures was demonstrated via solution-processing to enhance light extraction from organic light-emitting diodes (OLEDs). Scattering layers were easily obtained by spin-coating an $SiO_2$ sol solution that contained $TiO_2$ particles. By introducing the scattering layer and the solution-processible corrugated structure as internal and external extraction layers, the OLEDs showed increased external quantum efficiency without a change in the electroluminescence spectrum compared to conventional devices. Using these solution-processible out-coupling structures, nearly all-solution-processed OLEDs with enhanced light extraction could be fabricated. The light extraction enhancement is attributed to the suppression by the out-coupling structures of the light-trapping that arose at the interface of the glass substrate and the air.

Calculation and measurement of optical coupling coefficient for bi-directional tancceiver module (양방향 송수신모듈 제작을 위한 광결합계수의 계산 및 측정)

  • Kim, J. D.;Choi, J. S.;Lee, S. H.;Cho, H. S.;Kim, J. S.;Kang, S. G.;Lee, H. T.;Hwang, N.;Joo, G. C.;Song, M. K.
    • Korean Journal of Optics and Photonics
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    • v.10 no.6
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    • pp.500-506
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    • 1999
  • We designed and fabricated a bidirectional optical transceiver module for low cost access network. An integrated chip forming a pin-PD on an 1.3 urn FP-LD was assembled by flip-chip bonding on a Si optical bench, a single mode fiber with an angled end facet was aligned passively with the integrated chip on V-groove of Si-optical bench. Gaussian beam theory was applied to evaluate the coupling coefficients as a function of some parameters such as alignment distance, angle of fiber end facet, vertical alignment error. The theory is also used to search the bottle-neck between transmittance and receiving coupling efficiency in the bi-directional optical system. Tn this paper, we confirmed that reduction of coupling efficiency by the vertical alignment error between laser beam and fiber core axis can be compensated by controlling the fiber facet angle. In the fabrication of sub-module, a'||'&'||' we made such that the fiber facet have a corn shape with an angled facet only core part, the reflection of transmitted laser beam from the fiber facet could be minimized below -35 dE in alignment distance of 2: 30 /J.m. In the same condition, transmitted output power of -12.1 dEm and responsivity of 0.2. AIW were obtained.

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The Effects of Coupling Agent and Crosslinking Agent in the Synthesis of Acrylic Pressure Sensitive Adhesive for Polarizer Film (편광필름용 아크릴 점착제의 합성에서 커플링제와 가교제의 효과)

  • Lim, Chang-Hyuk;Ryu, Hoon;Cho, Ur-Ryong
    • Polymer(Korea)
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    • v.33 no.4
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    • pp.319-325
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    • 2009
  • The solution polymerization was conducted to synthesize pressure sensitive adhesive for polarizer film using acrylic monomers. 2-Ethylhexylacrylate, butylacrylate, acrylic acid were used as acrylic monomers. The ratio was 2-ethylliexylacrylate:butylacrylate:acrylic acid=25:50:3.6 by reflecting $-40^{\circ}C$ of glass transition temperature in the pressure sensitive adhesive. When 1 wt% of coupling agent was added to the polymerized pressure sensitive adhesive, the light transmissivity was significantly increased. This result is due to the enhancement of adhesive power against liquid crystal cell by Si-O bond of coupling agents. Cross-linking agent was added by 0.5, 1.0, and 1.5 wt% with respect to the synthesized polymer. Initial tackiness decreased, while cohesion increased with increasing crosslinking agent. In the analysis of contact angle, the increase of crosslinking agents yielded the enhancement of surface energy, resulting in the decrease of contact angle. From the measurement of heat resistance, the acrylic pressure sensitive adhesive showed excellent heat resistance regardless of change in temperature and contents in crosslinking agent. In the observation of a cutting plane, the increased crosslinking agent represented a smoother and cleaner section. Comprehensively, the optimum additive amount of crosslinking agent was determined to be 1.0 wt% to monomer.

A Low Phase Noise 5.5-GHz SiGe VCO Having 10% Bandwidth

  • Lee Ja-Yol;Park Chan Woo;Bae Hyun-Cheol;Kang Jin-Young;Kim Bo-Woo;Oh Seung-Hyeub
    • Journal of electromagnetic engineering and science
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    • v.4 no.4
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    • pp.168-174
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    • 2004
  • A bandwidth-enhanced and phase noise-improved differential LC-tank VCO is proposed in this paper. By connecting the varactors to the bases of the cross-coupled transistors of the proposed LC-tank VCO, its input negative resistance has been widened. Also, the feedback capacitor Cc in the cross-coupling path of the proposed LC-tank VCO attenuates the output common-mode level modulated by the low-frequency noise because the modulated common-mode level jitters the varactor bias point and degrades phase noise. Compared with the fabricated conventional LC-tank VCO, the proposed LC-tank VCO demonstrates $200\;\%$ enhancement in tuning range, and 6 - dB improvement in phase noise at 6 MHz offset frequency from 5.4-GHz carrier. We achieved the phase noise of - 106 dBc/Hz at 6 MHz offset, and $10\;\%$ tuning range from the proposed LC-tank VCO. The proposed LC-tank VCO consumes 12 mA at 2.5 V supply voltage.

Development of High-Quality LTCC Solenoid Inductor using Solder ball and Air Cavity for 3-D SiP

  • Bae, Hyun-Cheol;Choi, Kwang-Seong;Eom, Yong-Sung;Kim, Sung-Chan;Lee, Jong-Hyun;Moon, Jong-Tae
    • Journal of the Microelectronics and Packaging Society
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    • v.16 no.4
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    • pp.5-8
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    • 2009
  • In this paper, a high-quality low-temperature co-fired ceramic (LTCC) solenoid inductor using a solder ball and an air cavity on a silicon wafer for three-dimensional (3-D) system-in-package (SiP) is proposed. The LTCC multi-layer solenoid inductor is attached using Ag paste and solder ball on a silicon wafer with the air cavity structure. The air cavity is formed on a silicon wafer through an anisotropic wet-etching technology and is able to isolate the LTCC dielectric loss which is equivalent to a low k material effect. The electrical coupling between the metal layer and the LTCC dielectric layer is decreased by adopting the air cavity. The LTCC solenoid inductor using the solder ball and the air cavity on silicon wafer has an improved Q factor and self-resonant frequency (SRF) by reducing the LTCC dielectric resistance and parasitic capacitance. Also, 3-D device stacking technologies provide an effective path to the miniaturization of electronic systems.

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