• Title/Summary/Keyword: Si-C bond

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A Study on the Properties of SiC Nanotubes: Molecular Dynamics Simulation (탄화규소 나노튜브의 특성에 관한 연구: 분자동역학 전산모사)

  • 문원하;함정국;황호정
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.16 no.6
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    • pp.454-459
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    • 2003
  • We investigate the structure and properties of SiC (Silicon Carbide) nanotubes using molecular dynamics simulation based on the Tersoff bond-order potential. For small diameter tubes, the Si-C bond distance of SiC nanotubes decreases as the nanotube diameter is decreased, due to curvature of the nanotube surface. We find that Young's modulus of SiC nanotubes is somewhat smaller than that of the other nanotubes considered so far. However, Young's modulus for SiC nanotubes is larger than that of ${\beta}$-SiC and almost equal to the experimental value for SiC nanorod and SiC whisker. The strain energy of the SiC nanotubes is also lower than that of the other nanotubes. The lower strain energy of SiC nanotubes raises the possibility of synthesis of SiC nanotubes.

EFFECT OF CUTTING INSTRUMENTS ON THE DENTIN BOND STRENGTH OF A SELF-ETCH ADHESIVE (상아질 삭제기구가 자가부식 접착제의 결합강도에 미치는 효과)

  • Lee, Young-Gon;Moon, So-Ra;Cho, Young-Gon
    • Restorative Dentistry and Endodontics
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    • v.35 no.1
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    • pp.13-19
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    • 2010
  • The purpose of this study was to compare the microshear bond strength of a self-etching primer adhesive to dentin prepared with different diamond points, carbide burs and SiC papers, and also to determine which SiC paper yield similar strength to that of dentinal surface prepared with points or burs. Fifty-six human molar were sectioned to expose the occlusal dentinal surfaces of crowns and slabs of 1.2 mm thick were made. Dentinal surfaces were removed with three diamond points, two carbide burs, and three SiC papers. They were divided into one of eight equal groups (n = 7); Group 1: standard diamond point(TF-12), Group 2: fine diamond point (TF-12F), Group 3: extrafine diamond point (TF-12EF), Group 4: plain-cut carbide bur (no. 245), Group 5: cross-cut carbide bur (no. 557), Group 6 : P 120-grade SiC paper, Group 7: P 220-grade SiC paper, Group 8: P 800-grade SiC paper. Clearfil SE Bond was applied on dentinal surface and Clearfil AP-X was placed on dentinal surface using Tygon tubes. After the bonded specimens were subjected to uSBS testing, the mean uSBS (n = 20 for each group) was statistically compared using one-way ANOV A and Tukey HSD test. In conclusion, the use of extrafine diamond point is recommended for improved bonding of Clearfil SE Bond to dentin. Also the use of P 220-grade SiC paper in vitro will be yield the results closer to dentinal surface prepared with fine diamond point or carbide burs in vivo.

Structural Evolution and Electrical Properties of Highly Active Plasma Process on 4H-SiC

  • Kim, Dae-Kyoung;Cho, Mann-Ho
    • Applied Science and Convergence Technology
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    • v.26 no.5
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    • pp.133-138
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    • 2017
  • We investigated the interface defect engineering and reaction mechanism of reduced transition layer and nitride layer in the active plasma process on 4H-SiC by the plasma reaction with the rapid processing time at the room temperature. Through the combination of experiment and theoretical studies, we clearly observed that advanced active plasma process on 4H-SiC of oxidation and nitridation have improved electrical properties by the stable bond structure and decrease of the interfacial defects. In the plasma oxidation system, we showed that plasma oxide on SiC has enhanced electrical characteristics than the thermally oxidation and suppressed generation of the interface trap density. The decrease of the defect states in transition layer and stress induced leakage current (SILC) clearly showed that plasma process enhances quality of $SiO_2$ by the reduction of transition layer due to the controlled interstitial C atoms. And in another processes, the Plasma Nitridation (PN) system, we investigated the modification in bond structure in the nitride SiC surface by the rapid PN process. We observed that converted N reacted through spontaneous incorporation the SiC sub-surface, resulting in N atoms converted to C-site by the low bond energy. In particular, electrical properties exhibited that the generated trap states was suppressed with the nitrided layer. The results of active plasma oxidation and nitridation system suggest plasma processes on SiC of rapid and low temperature process, compare with the traditional gas annealing process with high temperature and long process time.

Effects of Carbon-coated SiC Whiskers on the Mechanical Properties of SiC Whisker Reinforced Silicon Nitride Ceramic Composite (SiC 휘스커 강화 질화규소 복합재료의 기계작 성질에 미치는 카본 코팅 SiC 휘스커의 영향)

  • 배인경;이영규;조원승;최상욱;장병국;임실묵
    • Journal of the Korean Ceramic Society
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    • v.36 no.10
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    • pp.1007-1015
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    • 1999
  • The Si3N4 composites reinforced with carbon-coated SiC whiskers were fabricated by hot-pressing at 180$0^{\circ}C$ for 2 hours to examine the effects of carbon-coated whiskers on the mechanical properties of SiC whisker reinforced Si3N4 composites. The flexural strength of the Si3N4 composites and Si3N4 monolith respectively. The weak interfacial bond between carbon-coated SiC whiskers and Si3N4 matrix which enhances the crack deflection and whisker pull-out could contribute to the improvement of mechanical properties of the composites.

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Study on the Generation of Leakage Current by the Fourier Transform Infrared Analysis (푸리에변환 적외선분광분석법에 의한 누설전류의 발생 원인에 대한 연구)

  • Oh, Teresa
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.20 no.6
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    • pp.514-519
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    • 2007
  • The surfaces of $SiO_2$ films were treated by PMMA diluted solutions, and analyzed the chemical shift from Fourier Transform Infrared Spectrometer. The $SiO_2$ film treated by PMMA diluted solution changed the properties of the surface, and showed the blue and red shift according to the concentration of PMMA. The C-H bond elongation effect due to the high electro-negative atom chlorine showed the red shift, and makes the final material with the cross-link structure. The leakage current was efficiently reduced at the sample No 7 with the red shift, witch depends on the electron deficient group.

Optical Properties of Transparent Electrode ZnO Thin Film Grown on Carbon Doped Silicon Oxide Film (탄소주입 실리콘 산화막 위에 성장한 투명전극 ZnO 박막의 광학적 특성)

  • Oh, Teresa
    • Journal of the Semiconductor & Display Technology
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    • v.11 no.2
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    • pp.13-16
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    • 2012
  • Zinc oxide (ZnO) films were deposited by an RF magnetron sputtering system with the RF power of 200W and 300W and flow rate of oxygen gases of 20 and 30 sccm, in order to research the growth of ZnO on carbon doped silicon oxide (SiOC) thin film. The reflectance of SiOC film on Si film deposited by the sputtering decreased with increasing the oxygen flow rate in the range of long wavelength. In comparison between ZnO/Si and ZnO/SiOC/Si thin film, the reflectance of ZnO/SiOC/Si film was inversed that of ZnO/Si film in the rage of 200~1000 nm. The transmittance of ZnO film increased with increasing the oxygen gas flow rate because of the transition from conduction band to oxygen interstitial band due to the oxygen interstitial (Oi) sites. The low reflectance and the high transmittance of ZnO film was suitable properties to use for the front electrode in the display or solar cell.

Interaction of DEMS with H-terminated Si (001) Surface: A First Principles Study (DEMS와 H-terminated Si (001) 표면의 상호작용: 제일원리연구)

  • Kim, Dae-Hyun;Kim, Dae-Hee;Park, So-Yeon;Seo, Hwa-Il;Lee, Do-Hyoung;Kim, Yeong-Cheol
    • Journal of the Korean Ceramic Society
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    • v.46 no.4
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    • pp.425-428
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    • 2009
  • We performed a density functional theory study to investigate the interaction of DEMS (diethoxymethylsilane) with the H-terminated Si (001) surface. The optimum structure of DEMS was first calculated by a first principles study. The dissociation probability of the O-C bond of DEMS was higher than the other seven bonds based on the bond energy calculation. When the fragmented DEMS groups reacted with the H-terminated Si (001) surface, it was the most favorable among the eight reactions to form a bond between the Si atom on the surface and the O atom of a fragmented DEMS group (($C_2H_5O$)Si($CH_3$)(H)-O-) by forming a $C_2H_6$ as by-product.

Characteristics of TiO2 Thin Films Fabricated by R.E, Magnetron Sputtering (R.F Magnetron Sputtering법으로 제조한 TiO2 박막의 특성)

  • Chu Y. H.;Choi D. K.
    • Korean Journal of Materials Research
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    • v.14 no.11
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    • pp.821-827
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    • 2004
  • Titanium oxide thin films were prepared on Si(100) substrates by R.F. magnetron reactive sputtering at $30\sim200watt$ R.F power range, and annealed at $600^{\circ}C\sim800^{\circ}C$ for 1 hour. The properties of $TiO_2$ thin films were analyzed using x-ray, ${\alpha}-step$, ellipsometer, scanning electron microscopy, and FT-IR spectrometer. Upon in-situ depositions, the initial phase of $TiO_2$ thin film showed non-crystalline phase at R.F. power $30\sim100$ watt. The crosssection of $TiO_2$ thin films were sbserved to be the columnar structure. With the increasing R.F power and annealing temperature, the grain size, crystallinity, refractive index, and void size of titanium oxides showed a tended to increase. The FT-IR transmittance spectra of titanium oxide thin films have the obsorption band of Ti-O bond, Si-O bond, Si-O-Ti bond and O-H bond. With the increase of R.F. power and annealing temperature, these films have the stronger bond structures. It is considered that such a phenomena is due to phase transition and good crystallinity

A Study on the Structure Properties of Plasma Silicon Oxynitride Film (플라즈마 실리콘 OXYNITRIDE막의 구조적 특성에 관한 고찰)

  • 성영권;이철진;최복길
    • The Transactions of the Korean Institute of Electrical Engineers
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    • v.41 no.5
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    • pp.483-491
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    • 1992
  • Plasma silicon oxynitride film has been applied as a final passivation layer for semiconductor devices, because it has high resistance to humidity and prevents from alkali ion's penetration, and has low film stress. Structure properties of plasma silicon oxynitride film have been studied experimentally by the use of FT-IR, AES, stress gauge and ellipsometry. In this experiment,Si-N bonds increase as NS12TO/(NS12TO+NHS13T) gas ratio increases. Peaks of Si-N bond, Si-H bond and N-H bond were shifted to high wavenumber according to NS12TO/(NS12TO+NHS13T) gas ratio increase. Absorption peaks of Si-H bond were decreased by furnace anneal at 90$0^{\circ}C$. The atomic composition of film represents that oxygen atoms increase as NS12TO/(NS12TO+NHS13T) gas ratio increases, to the contrary, nitrogen atoms decrease.

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