• Design & Manufacturing
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• v.10 no.1
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• pp.7-11
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• 2016

Sinks occurring in the rib portion of the testing product for the unpainteds are fatal defects at surface quality. In this study, we carried out moldflow analyses for several factors that affect the sinks. The result tells us large important effective factors on sinks by analyzing sink marks estimate. We expect practical use as reference for performing analysis or manufacturing products with rib designs and injection moldings which minimize sink-marks surrounded ribs.

• JSTS:Journal of Semiconductor Technology and Science
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• v.4 no.3
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• pp.196-203
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• 2004

A three-dimensional (3D) IC technology platform is presented for high-performance, low-cost heterogeneous integration of silicon ICs. The platform uses dielectric adhesive bonding of fully-processed wafer-to-wafer aligned ICs, followed by a three-step thinning process and copper damascene patterning to form inter-wafer interconnects. Daisy-chain inter-wafer via test structures and compatibility of the process steps with 130 nm CMOS sal devices and circuits indicate the viability of the process flow. Such 3D integration with through-die vias enables high functionality in intelligent wireless terminals, as vertical integration of processor, large memory, image sensors and RF/microwave transceivers can be achieved with silicon-based ICs (Si CMOS and/or SiGe BiCMOS). Two examples of such capability are highlighted: memory-intensive Si CMOS digital processors with large L2 caches and SiGe BiCMOS pipelined A/D converters. A comparison of wafer-level 3D integration 'lith system-on-a-chip (SoC) and system-in-a-package (SiP) implementations is presented.

• Journal of Powder Materials
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• v.24 no.5
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• pp.400-405
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• 2017

The addition of a large amount of alloying elements reduces the compactibility and increases the compacting pressure, thereby shortening the life of the compacting die and increasing the process cost of commercial PM steel. In this study, the characteristic changes of Fe-Mo-P, Fe-Mn-P, and Fe-Mo-Mn-P alloys are investigated according to the Si contents to replace the expensive elements, such as Ni. All compacts with different Si contents are fabricated with the same green densities of 7.0 and $7.2g/cm^3$. The transverse rupture strength (TRS) and sintered density are measured using the specimens obtained through the sintering process. The sintered density tends to decrease, whereas the TRS increases as the Si content increases. The TRS of the sintered specimen compacted with $7.2g/cm^3$ is twice as high as that compacted with $7.0g/cm^3$.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.72-72
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• 2009

전자부품의 내부접속 및 파워반도체의 다이본딩과 같은 1차실장에는 고온환경에서의 사용과 2차실장에서의 재용융방지를 위해 높은 액상선온도 및 고상선온도를 필요로 하여, Pb-5wt%Sn, Pb-2.5wt%Ag로 대표되는 납성분 85%이상의 고온솔더가 널리 사용되고 있다. 생태계와 인체에 대한 납의 유해성이 보고된 이래, 무연솔더에 대한 연구가 활발히 진행되어 왔으나, Sn-Ag-Cu계로 대표되는 Sn계 합금으로 대체 중인 중온용 솔더와는 달리, 고온용 솔더에 대해서는 대체합금에 대한 연구가 미흡한 실정이다. 대체재의 부재로 인해 기존의 납을 다량함유한 솔더로 1차실장이 지속됨으로서, 2차실장의 무연화에도 불구하고 전자부품 및 기기의 재활용에 큰 어려움을 겪고 있다. 지금까지 고온용 무연솔더로서는 융점에 근거해 Au-(Sn, Ge, Si)계, Bi-Ag계, Zn-(Al, Sn)계의 극히 제한된 합금계만이 보고되어 왔다. Au계 솔더는 현재 플럭스를 사용하지 않는 광학, 디스플레이 분야 등 고부가가치 공정에 사용되고 있으나, 합금가격이 매우 비싸며 가공성이 나빠 대체재료로서는 적합하지 않다. Bi-Ag계 솔더 또한 취성합금으로 와이어 및 박판으로 가공하는데 어려움이 크며, 솔더로서 중요한 특성중 하나인 전기전도도 및 열전도도가 나쁜 편이다. 이에 비해, Zn계 합금은 비교적 낮은 합금가격, 적절한 가공성과 뛰어난 인장강도, 우수한 전기전도도 및 열전도도를 지녀, 고온용솔더 대체재료의 유력한 후보로 생각된다.이전 연구에서, 필자의 연구그룹은 Zn-Sn계 합금을 고온용 무연솔더로서 제안한 바 있다. Zn-Sn계 합금은 충분히 높은 융점과 함께, 금속간화합물이 없는 미세조직, 우수한 기계적 특성, 높은 전기전도도 및 열전도도 등의 장점을 나타내었다. 본 연구에서는 기초합금특성상 고온솔더로서 다양한 장점을 지닌 Zn-30wt%Sn합금을 고온용 솔더의 대표적인 적용의 하나인 다이본딩에 적용하여, 접합부의 강도 및 미세조직, 열피로 신뢰성에 대해 분석을 함으로서 실제 공정에의 적용가능성에 대해 검토하였다. Zn-30wt%Sn을 이용해 Au/TiN(Titanium nitride) 코팅한 Si다이를 AlN-DBC(aluminum nitride-direct bonded copper)기판에 접합한 결과, 양측에 완전히 젖은 기공이 없는 양호한 다이접합부를 얻었으며, 솔더내부에는 금속간화합물을 형성하지 않았다. Si다이와의 계면에는 TiN만이 존재하였으며, Cu와의 계면에는 Cu로부터 $Cu_5Zn_8,\;CuZn_5$의 반응층을 형성하였다. 온도사이클시험을 통한 열피로특성평가에서, Zn-30wt%Sn를 이용한 다이접합부는 1500사이클 지점에서 Cu와 Cu-Zn금속간화합물의 사이에서 피로균열이 형성되며, 접합강도가 크게 감소하였다. 열피로특성 향상을 위해 Cu표면에 TiN코팅을 하여 Zn-30wt%Sn 솔더로 다이접합한 결과, Si다이와 기판 양측에 TiN만으로 구성된 계면을 형성하였으며, TEM관찰을 통해 Zn-30wt%Sn과 극히 미세한 접합계면이 형성하고 있음을 확인하였다. Zn-wt%30Sn솔더와 TiN층의 병용으로 2000사이클까지 미세조직의 변화 및 강도저하가 없는 극히 안정된 고신뢰성의 다이접합부를 얻을 수가 있었다.

• Journal of Korea Foundry Society
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• v.36 no.6
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• pp.202-207
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• 2016

The effects of Fe and Si additions on the microstructures and mechanical properties of aluminum bronze have been investigated. In a bar-type specimen cast in a die mold, the addition of Fe promoted the dendritic solidification of the ${\alpha}$ phase. The hardness values increased slightly in the Fe-added specimen with heat treatment, while these values was increased significantly in the specimens with Si or with combined additions of Fe and Si. When a centrifugal casting bush with combined addition of Fe and Si was heat treated, the FeSi compound within the matrix was finely dispersed, and was observed to be the origin of cup-cone type conical dimple failure in the tensile fracture surface. The mechanical properties of the heat treated centrifugal casting bushes, whose nominal alloy compositions were (Cu-7.0Al-0.8Fe-3.0Si)wt%, exhibited tensile strength of $703-781N/mm^2$, elongation of 6.6-11.7% and hardness of Hv 222.6-249.2. These high values of strength and elongation were attributed to the strengthening of the matrix due to the combined addition of Fe and Si, and to precipitation of fine the FeSi compound.

• Journal of electromagnetic engineering and science
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• v.8 no.3
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• pp.129-133
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• 2008

An integrated passive device(IPD) technology by semi-insulating(SI)-GaAs-based fabrication has been developed to meet the ever increasing needs of size and cost reduction in wireless applications. This technology includes reliable NiCr thin film resistor, thick plated Cu/Au metal process to reduce resistive loss, high breakdown voltage metal-insulator-metal(MIM) capacitor due to a thinner dielectric thickness, lowest parasitic effect by multi air-bridged metal layers, air-bridges for inductor underpass and capacitor pick-up, and low chip cost by only 6 process layers. This paper presents the Wilkinson power divider with excellent performance for digital cellular system(DCS). The insertion loss of this power divider is - 0.43 dB and the port isolation greater than - 22 dB over the entire band. Return loss in input and output ports are - 23.4 dB and - 25.4 dB, respectively. The Wilkinson power divider based on SI-GaAs substrates is designed within die size of $1.42\;mm^2$.

• Korean Journal of Materials Research
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• v.31 no.6
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• pp.331-338
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• 2021

Ti-Al-Si target and Cr-Si target are sputtered alternately to develop a multi-layered nitride coating on a steel mold to improve die-casting lifetime. Prior to the multi-layer deposition, a CrN layer is developed as a buffer layer on the mold to suppress the diffusion of reactive elements and enhance the cohesive strength of the multi-layer deposition. Approximately 50 nm CrSiN and TiAlSiN layers are deposited layer by layer, and form about three ㎛-thickness of multi-layered coating. From the observation of the uncoated and coated steel molds after the acceleration experiment of liquid metal injection casting, the uncoated mold is severely eroded by the adhesion of molten metallic glass. On the other hand, the multi-layer coating on the mold prevents element diffusion from the metallic glass and mold erosion during the experiment. The multi-layer structure of the coating transforms the nano-composite structured coating during the acceleration test. Since the nano-composite structure disrupts element diffusion to molten metallic glass, despite microstructure changes, the coating is not eroded by the 1,050 ℃ molten metallic glass.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2014.11a
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• pp.283-284
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• 2014

알루미늄 압출은 오랜 기간 산업화가 이루어져 왔으나, 최근 자동차 및 항공기의 경량화 관련하여 고력 알루미늄 압출의 필요성이 높아지고 있다. 이에 따라 고력 알루미늄의 압출을 위한 압출 공정기술과 금형 표면처리기술이 매우 필요하게 되었다. 본 연구에서는 기존의 염욕 질화 샘플과 본 연구에서 개발한 스퍼터링 증착 기술이 적용된 샘플간의 마모시험을 통한 마찰 계수를 비교하였다.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.3
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• pp.147-154
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• 2018

This paper focuses on the development of a support system that can rapidly generate the design data of a hot-form die with cooling channels, commonly known as hot stamping technology. We propose a new process for designing hot-form dies based on our (automated) system, whose main features are derived from the analysis of the design requirements and design process in the current industry. Our design support system consists of two modules, which allow for the generation of a 3D geometry model and its 2D drawings. The module for 3D modeling automation is implemented as a type of CATIA template model based on CATIA V5 Knowledgeware. This module automatically creates a 3D model of a hot-form die, including the cooling channels, that depends on the shape of the forming surface and the number of STEELs (subsets of die product) and cooling channels. It also allows for both the editing of the positions and orientations of the cooling channels and testing for the purpose of satisfying the constraints on the distance between the forming surface and cooling channels. Another module for the auto-generation of the 2D drawings is being developed as a plug-in using CAA (CATIA SDK) and Visual C++. Our system was evaluated using the S/W test based on a user defined scenario. As a result, it was shown that it can generate a 3D model of a hot form die and its 2D drawings with hole tables about 29 times faster than the conventional manual method without any design errors.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.408-409
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• 2008

In this paper the power divider is realized using the IPD processes for 900/1800 MHz; the designed power divider achieved the isolation of more than -24 dB. the insertion loss of nearly -3.5 dB, and the return loss of about -25 dB. The simple dual-band power divider based on SI-GaAs substrate is realized within the die size of about $2.5\times2mm^2$.