• Journal of the Korean Crystal Growth and Crystal Technology
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• v.4 no.2
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• pp.131-133
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• 1994

Deposition of silicon on pretreated sapphire substrates has been investigated by the liquid phase epitaxy method at low temperatures. An average 14 $\mu\textrm{m}$ thickness of silicon was grown over a large area on sapphire substrate originally coated with a much thinner silicon layer $[0.5 \mu\textrm{m} (100) Si/(1102) sapphire]$ at low temperatures from $(380^{\circ}C to 460^{\circ}C)$.

• Journal of the Korean Vacuum Society
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• v.4 no.3
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• pp.275-282
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• 1995

III족 원료 가스로 triethylgallium(TEGa)과 trimethylindium(TMIn)을 사용하고 V족 원료 가스로 사전 열 분해하지 않은 arsine(AsH3)과 monoethylarsine(MEAs)을 사용하여 ultrahigh vacuum chemical vapor deposition(UHVCVD)법으로 Si3N4로 패턴된 GaAs(100)기판 위에 GaAs와 InGaAsqkr막을 선택적으로 에피택시 성장을 하였다. V족 원료 가스를 사전 열 분해하지 않으므로 넓은 성장 온도 구간과 V/lll 비율에서도 선택적으로 박막이 성장되었다. 또한 선택 에피택시의 성장 메카니즘을 규명하기 위하여 다양한 filling factor(전체면적중 opening된 면적의 비율)를 가지는 기판을 제작하여 성장에 사용하였다. UHVCVD법에서는 마스크에 면적중 opening된 면적의 비율)를 가지는 기판을 제작하여 성장에 사용하였다. UHVCVD법에서는 마스크에 입사된 분자 상태의 원료 기체가 탈착된 후 표면 이동이나 가스 상태의 확산과정 없이 마스크로부터 제거되므로 패턴의 크기와 모양에 따른 성장 속도의 변화나 조성의 변화가 없을 뿐만 아니라 chemical beam epitaxy(CBE)/metalorganic molecular beam epitaxy(MOMBE)법에서 알려진 한계 성장온도 이하에서 선택 에피택시 성장이 이루어졌다.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.29 no.4
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• pp.143-148
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• 2019

We have successfully fabricated high aspect-ratio GaN-based nanowires on Si substrates using molecular beam epitaxy (MBE) system for high-efficiency hydrogen generation of photoelectrochemical water splitting. Scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDX) demonstrated that p-GaN:Mg and p-InGaN nanowires were grown vertically on the substrate with high density. Furthermore, it was also confirmed that the emission wavelength of p-InGaN nanowire can be adjusted from 552 nm to 590 nm. Such high-aspect ratio p-InGaN nanowire structure will be a solid foundation for the realization of ultrahigh-efficiency photoelectrochemical water splitting through sunlight.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.34 no.4
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• pp.139-142
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• 2024

Along with the use of wide bandgap energy materials such as SiC and GaN in power semiconductors and the development trend of devices, many research results have been reported, including the success of research on AlN single crystals with higher energy gaps and the development of 2-inch single crystal wafers. However, AlN single crystals grown using chemical vapor deposition have been developed into thin films less than a few micrometers thick, but there are almost no results with thicknesses greater than that. Therefore, in this study, we attempted to grow by applying HVPE (Hydride vapor phase epitaxy), one of the chemical vapor deposition methods. The grown AlN single crystal was manufactured using self-designed equipment, and we attempted to establish the conditions for manufacturing AlN single crystals on sapphire wafer. We would like to characterize the growth behavior through an optical microscope observation.

• Proceedings of the Materials Research Society of Korea Conference
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• 1998.11a
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• pp.143-143
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• 1998

• Journal of the Korean Vacuum Society
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• v.4 no.3
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• pp.319-326
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• 1995

초고진공에서 Si(100)-2X1 기판 위에 Pt를 약 100$\AA$의 두께로 증착한 후 in-situ로 열처리하는 고상에피택셜 성장법으로 PtSi 박막을 형성시켰다. XRD와 XPS 분석 결과 $200^{\circ}C$로 열처리한 시료에서는 Pt3Si, Pt2Si와 PtSi의 상이 섞여 있었으나 50$0^{\circ}C$로 열처리한 시료에서는 PtSi의 단일상만 확인되었으며, 형성된 PtSi 박막은 주상구조와 판상구조의 이중구조를 나타내었다. 기판 온도를 $500^{\circ}C$로 유지하면서 Pt를 증착한 후 $750^{\circ}C$에서 열처리한 경우에는 판상구조를 갖는 양질의 PtSi 박막이 에피택셜 성장되었다. HRTEM분석 결과 에피텍셜 성장된 PtSi와 기판 Si(100)의 계면은 PtSi[110]//Si[110], ptSi(110)//Si(100)의 정합성을 가졌다. 판상구조를 갖는 PtSi상의 에피택셜 방향은 기판과 열처리 온도에는 의존하나 열처리 시간에는 무관한 것으로 나타났다.

• Journal of the Korean Vacuum Society
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• v.5 no.3
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• pp.199-205
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• 1996

InGaAs eqitaxial layers have been selectively grown on patterned GaAs(100) substrates by chemical beam epitaxy (CBE) using triethylgallium (TEGa), trimethylindium (TMIn), and unprecracked monoethylarsine (MEAs). Facet growth of InGaAs epilayers has also been investigated at the various growth temperatures and Si4N4 dielectric pattern directions. In [011] jirection of mask, the change from (311), (377) and (111) facets to (311) facet with increasing growth temperature was observed. In [011] direction, however, the change from (011) and (111) facets to (111) facet with increasing growth temperature was observed. These results are attributed to the sidewall growth caused by different surface migration lengths of reactants. The formation of U-shaped (100) top surface is also discussed in terms of dangling bond model.

• Korean Journal of Materials Research
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• v.8 no.2
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• pp.165-172
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• 1998

Epitaxial ultrathin films of $CoSi_2$ and double heteroepitaxial structure of Si/$CoSi_2$/Si(lll) were prepared on Si(111)-$7\times{7}$ substrate by in situ solid-phase epitaxy in a ultrahigh vacuum(LHV). The phase, chemical composition, crystallinity, and the microsructure of the Si/$CoSi_2$/Si(lll) interface were investigated by 2-MeV $^4He^{++}$ ion backscattering spectrometry, X-ray diffraction, and high-resolution transmission electron microscopy. The growth mode of the Co film was the Stransky-Krastanov type with texture when the substrate temperature was room temperature. A-type $CoSi_2$ ultrathin film was grown by deposition of about 50A Co on Si(ll1)-$7\times{7}$ substrate followed by in situ annealing at $700^{\circ}C$ for 10 min. The matching face relationships were $CoSi_2$[110]//Si[110] and $CoSi_2$(002)//Si(002) with no misorientation angle. The A-type $CoSi_2$/Si(lll) interface was abrupt and coherent. The best epi-Si/epi-$CoSi_2$2(A-type)/Si(lll) structure was obtained by deposition of Si film on the CoSii at $500^{\circ}C$ followed by in situ annealing at $700^{\circ}C$ for 10 min in UHV.

• Journal of the Korean Institute of Telematics and Electronics
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• v.22 no.1
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• pp.34-40
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• 1985

An investigation has been made on the growth phenomena of epitaxial layer and polysilicon from SiH2 Cl2 in H2 and the etch phenomena of them from HCI in H2, at the system pressures of 1.0 atm (atmospheric process) and 0.1 attn (reduced pressure process). From the experimental equations for the growth rates and etch rates. the relevant process conditions for the selective epitaxy are predicted for the case of using mixtures of SiH2Cl2 and HCI in H2. As a result, it is found that selective epitaxial growth region exists in the concentration range investigated for the reduced pressure process but it does not for the atmospheric Process. This is due to the differences in the growth rates and etch rates at atmospheric and reduced pressure.

• Journal of the Korean Vacuum Society
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• v.8 no.2
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• pp.148-152
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• 1999

the low temperature magnetoresistance effect, electron mobilities, and 2 Dimensional electron Gases (2DEG) properties were investigated in $Si/Si_{1-x}Ge_x$ quantum well devices. N-type $Si/Si_{1-x}Ge_x$ structures were fabricated by utilizing a gas source Molecular Beam Epitaxy (GSMBE). Thermal oxidation was carried out in a dry O atmosphere at $700^{\circ}C$ for 7 hours. Electron mobilities were measured by using a Hall effect and a magnetoresistant effect at low temperatures down to 0.4K. Pronounced Shubnikov-de Haas (SdH) oscillations were observed at a low temperature showing two dimensional electron gases (2DEG) in s tensile strained Si quantum well. The electron sheet density (ns) of $1.5\times10^{12}[\textrm{cm}^{-2}]$ and corresponding electron mobility of 14200 $[\textrm{cm}^2V^{-1}s^{-1}]$ were obtained at a low temperature of 0.4K from $Si/Si_{1-x}Ge_x$ structures with thermally grown oxides.