• 제목/요약/키워드: Si CMOS

검색결과 260건 처리시간 0.024초

GHz BiCMOS 저 잡음 증폭기를 위한 바이어스 회로 설계 (Design of Bias Circuit for GHz BiCMOS Low Noise Amplifier)

  • 최근호;성명우;;김신곤;;;길근필;류지열;노석호;윤민
    • 한국정보통신학회:학술대회논문집
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    • 한국정보통신학회 2016년도 춘계학술대회
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    • pp.696-697
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    • 2016
  • 본 논문은 5.25-GHz BiCMOS 저 잡음 증폭기를 위한 바이어스 회로를 제안한다. 이러한 회로는 1볼트 전원에서 동작하며, 저전압 및 저전력으로 동작하도록 설계되어 있다. 제안한 회로는 $0.18{\mu}m$ SiGe HBT BiCMOS로 설계하였다. 이러한 회로는 밴드 갭 참조회로 (band-gap reference circuit)를 사용하였다.

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A Readout IC Design for the FPN Reduction of the Bolometer in an IR Image Sensor

  • Shin, Ho-Hyun;Hwang, Sang-Joon;Jung, Eun-Sik;Yu, Seung-Woo;Sung, Man-Young
    • Transactions on Electrical and Electronic Materials
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    • 제8권5호
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    • pp.196-200
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    • 2007
  • In this paper, we propose and discuss the design using a simple method that reduces the fixed pattern noise(FPN) generated on the amorphous Si($\alpha-Si$) bolometer. This method is applicable to an IR image sensor. This method can also minimize the size of the reference resistor in the readout integrated circuit(ROIC) which processes the signal of an IR image sensor. By connecting four bolometer cells in parallel and averaging the resistances of the bolometer cells, the fixed pattern noise generated in the bolometer cell due to process variations is remarkably reduced. Moreover an $\alpha-Si$ bolometer cell, which is made by a MEMS process, has a large resistance value to guarantee an accurate resistance value. This makes the reference resistor be large. In the proposed cell structure, because the bolometer cells connected in parallel have a quarter of the original bolometer's resistance, a reference resistor, which is made by poly-Si in a CMOS process chip, is implemented to be the size of a quarter. We designed a ROIC with the proposed cell structure and implemented the circuit using a 0.35 um CMOS process.

Evanescent-Mode를 이용한 MOSFET의 단채널 효과 분석 (Evanescent-Mode Analysis of Short-Channel Effects in MOSFETs)

  • 이지영;신형순
    • 대한전자공학회논문지SD
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    • 제40권10호
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    • pp.24-31
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    • 2003
  • Super-steep retrograded channel (SSR)을 갖는 bulk MOSFET, fully-depleted SOI, double-gate MOSFET 구조에 대하여 단채널 효과를 비교 분석하였다. Evanescent-mode를 이용하여, 각 소자 구조에 대한 characteristics scaling-length (λ)를 추출할 수 있는 수식을 유도하고 추출된 λ의 정확도를 소자 시뮬레이션 결과와 비교하여 검증하였다. 70 nm CMOS 기술에 사용 가능하도록 단채널 효과를 효과적으로 제어하기 위해서는 최소 게이트 길이가 5λ 이상이어야 하며 SSR 소자의 공핍층 두께는 약 30 nm 정도로 스케일링되어야 한다. High-κ 절연막은 equivalent SiO2 두께를 매우 작게 유지하지 않을 경우 절연막을 통한 드레인 전계의 침투 때문에 소자를 스케일링하는데 제한을 갖는다.

반도체 노광 공정의 DI 세정과 Oxide의 HF 식각 과정이 실리콘 표면에 미치는 영향 (Effects of DI Rinse and Oxide HF Wet Etch Processes on Silicon Substrate During Photolithography)

  • 백정헌;최선규;박형호
    • 한국재료학회지
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    • 제20권8호
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    • pp.423-428
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    • 2010
  • This study shows the effects of deionized (DI) rinse and oxide HF wet etch processes on silicon substrate during a photolithography process. We found a fail at the wafer center after DI rinse step, called Si pits, during the fabrication of a complementary metal-oxide-semiconductor (CMOS) device. We tried to find out the mechanism of the Si pits by using the silicon wafer on CMOS fabrication and analyzing the effects of the friction charge induced by the DI rinsing. The key parameters of this experiment were revolution per minute (rpm) and time. An incubation time of above 10 sec was observed for the formation of Si pits and the rinsing time was more effective than rpm on the formation of the Si pits. The formation mechanism of the Si pits and optimized rinsing process parameters were investigated by measuring the charging level using a plasma density monitor. The DI rinse could affect the oxide substrate by a friction charging phenomenon on the photolithography process. Si pits were found to be formed on the micro structural defective site on the Si substrate under acceleration by developed and accumulated charges during DI rinsing. The optimum process conditions of DI rinse time and rpm could be established through a systematic study of various rinsing conditions.

Power 소자 기술

  • 이상기
    • 전자공학회지
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    • 제42권7호
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    • pp.45-53
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    • 2015
  • Power 소자 기술은 digital & mixed signal device와 on-chip 구현을 위해서 CMOS 공정에 대한 기본 이해가 필요하다. CMOS 공정 기반 위에 power device 공정을 추가하면서 다양한 operation voltage의 power 소자를 구현하고, passive device 들을 동일 공정에서 구현하여 다양한 components 들로 power IC 제품을 design 할 수 있도록 modular process를 제공하는 것이 중요하다. 또한 power device로 주로 사용되는 LDMOS 소자에 대한 performance 개선을 위해 simulation을 통해 key device parameter들의 특성을 예측하고, 구조를 설계하는 것이 Si process 전에 중요한 일 중의 하나이다. 아울러 power management가 potable power, consumer electronics 및 green energy에서 가장 빠르게 성장하는 분야이므로, 차별화된 power 소자 기술을 확보하여 급변하는 시장 환경에 대응하는 것이 필요하다.

INTEGRATED MAGNETIC SENSORS: AN OVER VIEW

  • Cristolovenau, Sorin
    • 전자공학회지
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    • 제13권1호
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    • pp.86-95
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    • 1986
  • The basic physical principles involved in the operation of monolithic magnetic sensors are reviewed and technological aspects outlined. More or less conventional devices based on Hall effect, magnetoresistance or current path deflection are described. It is shown that such sensors with 2, 3, 4 or 5 terminal contacts are achievable with standard silicon integrated circuit process. Several kinds of magnetodiodes (p+nn+,p+n, Schottky, MOS, memory, CMOS) have been fabricated on Si and on SOS films and present attractive properties. Finally, the magneto-transistor family is discussed with emphasis to split-terminals, CMOS, unijunction and fila-mentary devices.

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새로운 $TiSi_2$ 형성방법과 STI를 이용한 초박막 게이트 산화막의 특성 개선 연구 (Study of Improvement of Gate Oxide Quality by Using an Advanced, $TiSi_2$ process & STI)

  • 엄금용;오환술
    • 대한전자공학회:학술대회논문집
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    • 대한전자공학회 2000년도 추계종합학술대회 논문집(2)
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    • pp.41-44
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    • 2000
  • Ultra large scale integrated circuit(ULSI) & complementary metal oxide semiconductor(CMOS) circuits require gate electrode materials such as meta] silicides, titanium-silicide for gate oxides. Many previous authors have researched the improvements sub-micron gate oxide quality. However, little has been done on the electrical quality and reliability of ultra thin gates. In this research, we recommend novel shallow trench isolation structure and two step TiSi$_{2}$ formation for sub 0.1${\mu}{\textrm}{m}$ gate oxide.

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4.75 GHz WLAN 용 SiGe BiCMOS MMIC 차동 전압제어 발진기 (A SiGe BiCMOS MMIC differential VCO for 4.75 GHz WLAN Applications)

  • 배정형;김현수;오재현;김영기
    • 대한전자공학회:학술대회논문집
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    • 대한전자공학회 2003년도 하계종합학술대회 논문집 I
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    • pp.270-273
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    • 2003
  • The design, fabrication, and measured result of a 4.7 GHz differential VCO (Voltage Controlled Oscillator) for a 5.2 GHz WLAN (Wireless Local Area Network) applications is presented. The circuit is designed in a 0.35 mm technology employing three metal layers. The design is based on a fully integrated LC tank using spiral inductors. Measured tuning range is 10% of oscillation frequency with a control voltage from 0 to 3.0 V. Oscillation power of $\square$ 2.3 dBm at 4.63 GHz is measured with 21 mA DC current at 3V supply. The phase noise is $\square$ 104.17 dBc/Hz at 1 MHz offset.

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SiGe BiCMOS 기술

  • 심규환;송영주;민봉기;강진영
    • 전자공학회지
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    • 제29권9호
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    • pp.1070-1070
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    • 2002