• Title/Summary/Keyword: Si 기판

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XRR 박막 두께 표준물질 제작조건에 따른 구조적특성 연구

  • Yu, Byeong-Yun;Bin, Seok-Min;O, Byeong-Seong;Kim, Chang-Su
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.08a
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    • pp.283-283
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    • 2011
  • 본 연구에서는 XRR 측정에 있어 박막두께 표준보급을 하기 위하여 표준물질을 이온빔 스퍼터링 증착법을 이용하여 제작하였다. 시편제작 시 공기 중 노출에 의해 산화가 되지 않는 산화물 박막과 산화물 기판을 선택하였다. 기판 및 타겟물질 등을 변화시키면서 제작된 시편의 특성을 살펴보았다. 사용된 타겟 물질로는 HfO2, Ta2O5, Cr2O3를 사용하였으며, 기판으로는 glass, sapphire, quartz, SiO2(1 ${\mu}m$-thermal oxidation)를 사용하였다. 산화물 타겟을 사용하여 증착 시 타겟 주위로 생기는 전하들의 charge build-up 되는 현상은 neutralizer를 사용함으로써 문제를 해결하였다. 제작된 시편은 XRR을 이용하여 측정하였고, XRR simulation과 curve fitting을 통하여 박막의 두께, 표면 및 계면의 거칠기, 밀도를 평가하였다. 기판으로 사용된 glass, quartz는 타겟 물질과 관계없이 표면 거칠기가 좋지 않아 XRR 반사율이 급격히 떨어지면서 측정되는 각도의 영역이 작아졌다. sapphire로 제작한 시편에서는 측정된 데이터와 simulation의 curve fitting이 양호하지 않았다. 이 문제는 현재 조사중에 있다. SiO2 기판으로 제작한 시편의 경우 타겟 물질과 관계없이 XRR curve fitting 결과가 양호 하였다. 그 중 Cr2O3의 결과가 다른 타겟 물질에 비해 x 2 값이 작았고 반사율 곡선에서의 거칠기와 진폭도 양호하였다. 위 연구결과로써 SiO2 기판을 사용한 Cr2O3 타겟 물질로 제작된 시편이 XRR 박막 두께 표준물질로써 적합한 것으로 판단된다.

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ZnO 나노 입자가 분산 된 Resin을 이용한 굴절률 조절 및 광 산란 패턴 형성을 통한 비정질 실리콘 박막태양전지의 효율 향상

  • Ko, Bit-Na;Kim, Jae-Hyeon;Kim, Gyu-Tae;Sin, Ju-Hyeon;Jeong, Pil-Hun;Chu, So-Yeong;Choe, Hak-Jong;Hyeon, Seok;Lee, Heon
    • Proceedings of the Korean Vacuum Society Conference
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    • 2014.02a
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    • pp.295-295
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    • 2014
  • 일반적으로 박막 태양전지의 효율은 박막 종류에 따른 광 흡수율에 의해 결정되며, 이는 증착한 박막의 두께에 의해 결정된다. 증착한 박막의 두께가 두꺼워질수록 광 흡수율은 증가하지만, 박막 두께가 지나치게 두꺼워지면 열화 현상으로 인한 모듈의 효율 감소가 생기므로 적절한 박막의 두께가 요구된다. 특히 a-Si:H의 경우 가시광 영역에서 높은 흡수계수를 가지고 있어서 얇은 박막 두께로도 태양전지의 제작이 가능하지만, 동일한 박막 두께에서 효율을 더욱 향상시키기 위한 다양한 광 포획 기술에 대한 연구가 많이 진행 되고 있다. 본 연구에서는 자외선을 이용한 nano-imprint lithography 기술을 이용하여 a-Si:H 태양전지의 유리기판 위에 pattern을 삽입하여 광 산란 효과를 향상 시키고자 하였다. 또한 유리기판의 굴절률 (n=1.5)과 투명전극의 굴절률 (n=1.9)의 중간 값을 갖는 ZnO nanoparticles (n=1.7)이 분산 된 imprinting resin을 사용함으로써 점진적으로 굴절률을 변화시켜, 최종적으로 a-Si:H 층까지의 광 투과율을 높이고자 하였다. 제작한 기판의 종류는 다음과 같다. 첫 번째 기판으로는 유리기판 위에 ZnO nanoparticles이 분산 된 imprinting resin을 spin-coating 하여 점진적인 굴절률의 변화에 의한 투과도 향상을 확인하고자 하였다. 두 번째 기판으로는 규칙적인 배열을 갖는 micro 크기의 패턴을 형성하였다. 마지막으로는 불규칙한 배열을 갖는 nano 크기와 micro 크기가 혼재 된 패턴을 형성하여 투과도 향상과 동시에 빛의 산란을 증가시키고자 하였다. 후에 이 세가지 종류를 기판으로 사용하여 a-Si:H 기반의 박막 태양전지를 제작하였다. 먼저 제작한 박막 태양전지용 기판의 광학적 전기적 특성을 분석하였다. 유리 기판 위에 형성한 패턴에 의한 roughness 변화를 확인하기 위해 atomic force microscopy (AFM)를 이용하여 시편의 표면을 측정하였다. 또한 제작한 유리 기판 위에 투명 전극층을 형성 후, 이로 인한 전기적 특성의 변화를 확인하기 위해 hall measurement system을 이용하여 sheet resistance, carrier mobility, carrier concentration 등의 특성을 측정하였다. 또한, UV-visible photospectrometer 장비를 이용하여 각 공정마다 시편의 광학적 특성(투과도, 반사도, 산란도, 흡수도 등)을 측정하였고, 최종적으로 제작한 박막 태양전지의 I-V 특성과 외부양자효율을 측정하여 태양전지의 효율 변화를 확인하였다. 그 결과 일반적인 유리에 기판에 제작된 a-Si:H 기반의 박막 태양전지에 비해, ZnO nanoparticles이 분산 된 imprinting resin을 spin-coating 하여 점진적인 굴절률 변화를 준 것만으로도 약 12%의 태양전지 효율이 증가하였다. 또한, micro 크기의 패턴과 nano-micro 크기가 혼재된 패턴을 형성한 경우 일반적인 유리를 사용한 경우에 비해 각각 27%, 36%까지 효율이 증가함을 확인하였다.

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The Residual Stress Effect on Microstructure and Optical Property of ZnO Films Produced by RF Sputtering (R.F Sputtering으로 제조한 ZnO박막의 미세구조와 광학적 특성에 미치는 잔류응력의 영향)

  • Ryu, Sang;Kim, Young-Man
    • Journal of Surface Science and Engineering
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    • v.38 no.4
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    • pp.144-149
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    • 2005
  • ZnO films were produced on the Si(100) and sapphire(0001) wafers by RF magnetron sputtering in terms of processing variables such as substrate temperature and RF power. The stress in films was obtained from the Stoney's formula using a laser scanning device. The stress levels in the films showed the range from $\~40$ MPa to $\~-1100$MPa depending on processing variables. The specimens were thermally cycled from R.T. to $250^{\circ}C$ to investigate the stress variation as a function of temperature. SEM was employed to characterize the microstructure of te films. As the substrate temperature increased, the film surface became rougher and the films showed coarser grains. The optical property o the films was studied by PL measurements. At the highest substrate temperature $800^{\circ}C$ the film exhibited sharper UV peaks unlike other conditions.

Growth and Structural Properties of Fe Thin Films Electrodeposited on n-Si(111) (n-Si(111) 기판 위에 전기증착에 의한 Fe 박막의 성장과 구조적 특성)

  • Kim Hyun-Deok;Park Kyeong-Won;Lee Jong-Duk
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.10 no.9
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    • pp.1663-1670
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    • 2006
  • Single crystal Fe thin films were grown directly onto n-Si(111) substrates by pulsed electrodeposition. Cyclic Voltammogram(CV) indicated that the $Fe^{2+}/n-Si(111)$ interface shows a good diode behavior by forming a Schottky barrier. From Mott-Schottky (MS) relation, it is found that the flat-band potential of n-Si(111) substrate and equilibrium redox potential of $Fet^{2+}$ ions are -0.526V and -0.316V, respectively. The nucleation and growth kinetics at the initial reaction stages of Fe/n-Si(111) substraste was studied by current transients. Current transients measurements have indicated that the deposition process starts via instantaneous nucleation and 3D diffusion limited growth. After the more deposition, the deposition flux of Fe ions was saturated with increase of deposition time. from the as-deposited sample obtained using the potential pulse of 1.4V and 300Hz, it is found that Fe nuclei grows to three dimensional(3D) islands with the average size of about 100nm in early deposition stages. As the deposition time increases, the sizes of Fe nuclei increases progressively and by a coalescence of the nuclei, a continuous Fe films grow on the Si surface. In this case, the Fe films show a highly oriented columnar structure and x-ray diffraction patterns reveal that the phase ${\alpha}-Fe$ grows on the n-Si(111) substrates.

Deposition of SiO2 Thin Film for the Core of Planar Light-Wave-Guide by Transformer Coupled Plasma Chemical-Vapor-Deposition (TCP-CVD 장비를 활용한 광도파로용 Core-SiO2 증착)

  • Kim, Chang-Jo;Shin, Paik-Kyun
    • Journal of the Korean Vacuum Society
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    • v.19 no.3
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    • pp.230-235
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    • 2010
  • In this paper, we controlled the deposition rate and reflective index with process conditions that are TCP power, gas flow ratio and bias for optical properties of $SiO_2$ thin film using TCP-CVD equipment. We obtained a excellent $SiO_2$ thin film which has a excellent uniformity (<1 [%]), deposition rate (0.28 [${\mu}m$/ min]) and reflective index (1.4610-1.4621) within 4" wafer with process conditions ($SiH_4:O_2$=50 : 100 [sccm], TCP power 1 [kW], bias 200 [W]) at [$300^{\circ}C$].

Formation and Growth of Epitaxial $CoSi_2$ Layer by Reactive Chemical Vapor Deposition (반응성 화학기상증착법을 이용한 에피택셜 $CoSi_2$ 박막의 형성 및 성장에 관한 연구)

  • Lee, Hwa-Seong;Lee, Hui-Seung;An, Byeong-Tae
    • Korean Journal of Materials Research
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    • v.10 no.11
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    • pp.738-741
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    • 2000
  • Univorm epitaxial $CoSi_2$layers have been grown in situ on a (100) Si substrate at temperatures near$ 600^{\circ}C$ by reactive chemical vapor deposition of cyclopentadienyl dicarbonyl cobalt, (Co(η(sup)5-C(sub)5H(sub)5) ($CO_2$). The growth kinetics of an epitaxial $CoSi_2$layer on al Si(100) substrate was investigated at temperatures ranging from 575 to $650^{\circ}C$. In initial deposition stage, plate-like discrete $CoSi_2$spikes were nucleated along the <111> directions in (100) Si substrate with a twinned structure. The discrete $CoSi_2$plates with both {111} and (100) planes grew into an epitaxial layer with a flat interface on (100) Si. For epitaxial $CoSi_2$growth on (100) Si, the activation energy of the parabolic growth was found to be 2.82 eV. The growth rate seems to be controlled by the diffusion of Co through the $CoSi_2$layer.

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Structural and optical properties of Si nanowires grown by Au-Si island-catalyzed chemical vapor deposition (Au-Si 나노점을 촉매로 성장한 Si 나노선의 구조 및 광학적 특성 연구)

  • Lee, Y.H.;Kwak, D.W.;Yang, W.C.;Cho, H.Y.
    • Journal of the Korean Vacuum Society
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    • v.17 no.1
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    • pp.51-57
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    • 2008
  • we have demonstrated structural evolution and optical properties of Si-nanowires (NWs) synthesized on Si (111) substrates with nanoscale Au-Si islands by rapid thermal chemical vapor deposition (RTCVD). The Au-Si nano-islands (10-50nm in diameter) were employed as a liquid-droplet catalysis to grow Si-NWs via vapor-liquid-solid mechanism. The Si-NWs were grown by a mixture gas of SiH4 and H2 at a pressure of 1.0 Torr and temperatures of $500{\sim}600^{\circ}C$. Scanning electron microscopy measurements showed that the Si-NWs are uniformly sized and vertically well-aligned along <111> direction on Si (111) surfaces. The resulting NWs are ${\sim}60nm$ in average diameter and ${\sim}5um$ in average length. High resolution transmission microscopy measurements indicated that the NWs are single crystals covered with amorphous SiOx layers of ${\sim}3nm$ thickness. In addition, the optical properties of the NWs were investigated by micro-Raman spectroscopy. The downshift and asymmetric broadening of the Si main optical phonon peak were observed in Raman spectra of Si-NWs, which indicates a minute stress effects on Raman spectra due to a slight lattice distortion led by lattice expansion of Si-NW structures.

Growth of hexagonal Si epilayer on 4H-SiC substrate by mixed-source HVPE method (혼합 소스 HVPE 방법에 의한 4H-SiC 기판 위의 육각형 Si 에피층 성장)

  • Kyoung Hwa Kim;Seonwoo Park;Suhyun Mun;Hyung Soo Ahn;Jae Hak Lee;Min Yang;Young Tea Chun;Sam Nyung Yi;Won Jae Lee;Sang-Mo Koo;Suck-Whan Kim
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.33 no.2
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    • pp.45-53
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    • 2023
  • The growth of Si on 4H-SiC substrate has a wide range of applications as a very useful material in power semiconductors, bipolar junction transistors and optoelectronics. However, it is considerably difficult to grow very fine crystalline Si on 4H-SiC owing to the lattice mismatch of approximately 20 % between Si and 4H-SiC. In this paper, we report the growth of a Si epilayer by an Al-related nanostructure cluster grown on a 4H-SiC substrate using a mixed-source hydride vapor phase epitaxy (HVPE) method. In order to grow hexagonal Si on the 4H-SIC substrate, we observed the process in which an Al-related nanostructure cluster was first formed and an epitaxial layer was formed by absorbing Si atoms. From the FE-SEM and Raman spectrum results of the Al-related nanostructure cluster and the hexagonal Si epitaxial layer, it was considered that the hexagonal Si epitaxial layer had different characteristics from the general cubic Si structure.

A Study on the Characteristics of MgO Thin Films Prepared by Electron Beam (전자빔 증착법에 의해 형성된 MgO 박막의 증착 및 특성)

  • Lee, Choon-Ho;Kim, Sun-Il;Shin, Ho-Shik
    • Journal of the Korean Ceramic Society
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    • v.39 no.12
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    • pp.1171-1176
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    • 2002
  • The growth characteristics on the MgO thin films prepared by the e-beam evaporation method have been investigated. We observed the film of preferred orientation and surface morphology with various parameters such as substrate temperature, deposition rate on Si(100) and slide glass respectively. Consequently, it was shown that MgO(111) preferred orientation films can be obtained as the deposition rate was increased on Si(100) substrate. MgO(220) peak was found as the substrate temperature was increased. Whereas, in case of slide glass the orientation is changed from (200) to (111) by substrate temperature. Also we investigated the relationship between the film characteristics and the orientation of MgO thin films.

Wafer-Level MEMS Capping Process using Electrodeposition of Ni Cap and Debonding with SnBi Solder Layer (Ni 캡의 전기도금 및 SnBi 솔더 Debonding을 이용한 웨이퍼 레벨 MEMS Capping 공정)

  • Choi, J.Y.;Lee, J.H.;Moon, J.T.;Oh, T.S.
    • Journal of the Microelectronics and Packaging Society
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    • v.16 no.4
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    • pp.23-28
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    • 2009
  • We investigated the wafer-level MEMS capping process for which cavity formation in Si wafer was not required. Ni caps were formed by electrodeposition on 4" Si wafer and Ni rims of the Ni caps were bonded to the Cu rims of bottom Si wafer by using epoxy. Then, top Si wafer was debonded from the Ni cap structures by using SnBi layer of low melting temperature. As-evaporated SnBi layer was composed of double layers of Bi and Sn due to the large difference in vapor pressures of Bi and Sn. With keeping the as-evaporated SnBi layer at $150^{\circ}C$ for more than 15 sec, SnBi alloy composed of eutectic phase and Bi-rich $\beta$ phase was formed by interdiffusion of Sn and Bi. Debonding between top Si wafer and Ni cap structures was accomplished by melting of the SnBi layer at $150^{\circ}C$.

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