Direct bonding of $Si∥SiO_2/Si_3N_4∥Si$ wafers using a furnace
(전기로를 이용한 $Si∥SiO_2/Si_3N_4∥Si$ 기판쌍의 직접접합)
-
- Proceedings of the Materials Research Society of Korea Conference
- /
- 2001.11a
- /
- pp.151-151
- /
- 2001