• Title/Summary/Keyword: Shpae Optimization

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A Study on Rigid Front Axle Shape Optimization of a Commercial Vehicle by Hydforming Process (하이드로포밍을 이용한 대형차 앞차축 형상최적화에 관한 연구)

  • Jang, Jong-Min;Kim, Yun-Gyu;Hur, Joo-Haeng;Na, Sang-Mook
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.33 no.3
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    • pp.231-236
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    • 2009
  • Recently, The Hydroforming technology has recognized general technique in manufacture industry. Especially automotive industry, It has applied to increase strength, and decrease weight, cost and part number. The rigid axle suspension type is widely used for truck and bus in commercial vehicles due to simplicity. To develop the hydroforming rigid axle, it is necessary to estimate of the characteristics of front suspension from the design process. In this study, the characteristics estimation of the hydroforming rigid axle is preformed using Finite Element Analysis and apply to shape optimization.

Optimization of parasitic inductance for maximizing the modulation bandwidth of MQW modulators (MQW 광변조기의 변조대역폭 확대를 위한 실장 기생 인덕턴스의 최적화)

  • 김병남;이해영
    • Journal of the Korean Institute of Telematics and Electronics D
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    • v.34D no.6
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    • pp.20-32
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    • 1997
  • An optimum parasitic inductance is observed for maximizing the modulation bandwidth of the multiple quantum well (MQW) electro-absorption optical modulator. For 1.1 pF device cpaacitance of the current MQW optical modulator, the optimum parasitic inductances for maximum bandwidth are calculated for different terminating resistors. In ase of 50.ohm. terminating resistor, the 3-dB modulation bandwidth can be increased 45% wider by using the optimum parasitic inductance than nothing parasitic inductance. This calculated optimum inductance can be practically implemented, since the parasitic inductance of bondwires can be accurately analyzed using the method of moments (MoM) and controlled by changing the length and shpae of bondwires.

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The Characteristics of Viscosity Behavior of EMC for Semi-conductor Encapsulant -The Prediction of Viscosity by Mooney Equation- (반도체 봉지제용 EMC의 점도거동 특성 연구 -Mooney식을 이용한 점도예측-)

  • Kim, In Beom;Bae, Doo Han;Lee, Myung Cheon;Lee, Euy Soo;Yun, Hyo Chang;Lim, Jong Chan
    • Applied Chemistry for Engineering
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    • v.10 no.6
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    • pp.949-953
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    • 1999
  • Because epoxy molding compound(EMC) for semi-conductor encapsulants contains high concentrations of fillers, its flow behaviors are affected much by the concentrations and properties of those fillers. This paper reports the effects of a filler concentration, shape, size, and size distributions on the viscosity behavior of EMC(epoxy/silica). In addition, the prediction of viscosity behavior was performed using the Mooney equation. The maximum packing volume in the Mooney equation was calculated by Ouchiyama's packing model and Taguchi's optimization method, while the shpae factor was determined by fitting the experimental data. The results showed that the Mooney equation predicted the viscosity behavior of EMC very well.

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