• Proceedings of the KIEE Conference
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• 1999.07d
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• pp.1581-1583
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• 1999

Epoxy Compound has been used as insulation material in cable accessories. During the applying voltage to cable, heat shock is induced to accessory by the temperature difference between atmosphere and conductor. In this study, crack resistance, thermal and mechanical properties were evaluated about conventional epoxy compound and rubber toughened epoxy compound. Because rubber absorbs the stress caused by heat shock, crack resistance of rubber toughened epoxy compound is high. In the case of low thermal expansion coefficient, the compound shows high crack resistance because of low volumetric change.

• Nuclear Engineering and Technology
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• v.30 no.5
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• pp.470-484
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• 1998

An analysis program for the evaluation of pressure vessel integrity under pressurized thermal shock (PTS) is developed. For given material properties and transient history such as temperature and pressure, the stress distribution is calculated and then stress intensity factors are obtained for a wide range of crack sizes. The stress intensity factors are compared with the fracture toughness to check if cracking is expected to occur during the transient. Using this program a round robin problem of PTS during a small break loss of coolant transient has been analyzed as a part of the international comparative assessment study. The allowable maximum reference nil-ductility transition temperatures are determined for various crack sizes.

• Journal of the Korean Ceramic Society
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• v.30 no.3
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• pp.229-235
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• 1993

Thermal history and thermal stress of alumina specimen, which occured from thermal shock process, were calculated by finite difference method. Stress intensity factor and crack growth in cyclic thermal fatigue were calculated from single thermal shock temperature history and thermal stress. Cyclic thermal life were estimated by bending strength after cyclic thermal shock under critical thermal shock temperature. Calculated stress intensity factor was compared with real experimental thermal fatigue life of specimen. Fatigue life until critical stress intensity factor and real experimental result were comparable.

• Transactions of the Korean Society of Pressure Vessels and Piping
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• v.15 no.2
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• pp.40-49
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• 2019

In this paper, failure probabilities of the OPR1000 reactor vessel under pressurized thermal shock (PTS) were estimated using the probabilistic fracture mechanics code, R-PIE. Input variables of initial crack distribution, crack size, copper contents, and upper shelf toughness were selected for the sensitivity analyses. A wide range of the input data were considered. Through-wall cracking frequencies determined by the product of the vessel failure probability and the corresponding occurrence frequency of the transient were also compared to the acceptance criterion. The results showed that transient history had the most significant impact on the vessel failure probability. Moreover, conservative assumptions resulted in extremely high through-wall cracking frequencies.

• Computational Structural Engineering
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• v.11 no.1
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• pp.153-160
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• 1998

A small break loss of coolant accident is postulated as a pressurized thermal shock accident in this study. From the temperature and pressure histories of coolant, distributions of the temperature and stress in a vessel wall are analytically calculated. The stress intensity factor and fracture toughness of the vessel wall are determined at the crack tip using the ASME code method and they are compared to check if cracking is expected to occur during the transient postulated. The maximum allowable reference nil-ductility transition temperatures are determined for various crack sizes and the results are discussed.

• Journal of the Korean Society for Precision Engineering
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• v.17 no.12
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• pp.76-81
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• 2000

Analysis on failure of the panel glass under mechanical shock is the main topic of this study. Since the glass for the LCD panel is thin, it needs to be designed to have enough toughness against mechanical shock. In this paper, a process of estimating fracture of the panel glass is proposed to guarantee reliability of the product. The fracture toughness of the panel glass is used as a criterion of the fracture based on an experimental approach. The stress intensity factor was calculated considering a model with the largest initial crack size on a cut surface and with the boundary force obtained from a dynamic finite element analysis. Critical surface roughness on the cut surface of a typical glass panel, to prevent fracture in case of bending mode, is obtained.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.3
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• pp.152-158
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• 2016

The bonding characteristics of MLCCs (multi layer ceramic capacitor, C1608) lead-free solder (SAC305) joints were evaluated through thermal shock test ($-40^{\circ}C{\sim}125^{\circ}C$, total 1,800 cycle). After the test, IMCs( intermetallic compounds) growth and cracks were verified, also shear strengths were measured for degradation of solder joints. In addition, The thermal stress distributions at solder joints were analyzed to compare the solder joints changes before and after according to thermal shock test by FEA (finite elements analysis). We considered the effects of IMCs growth at solder joints. As results, the bonding characteristics degradation was occurred according to initial crack, crack propagations and thermal stress concentration at solder-IMCs interface, when the IMCs grown to solder inside.

• Transactions of the Korean Society of Mechanical Engineers
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• v.19 no.5
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• pp.1229-1242
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• 1995

The thermal shock stress intensity factors of semi-elliptical surface crack in finite plate and the stress intensity fractors of embedded elliptical crack in turbine rotor is determined by means of Vainshtok weight function method. In case of semi-elliptical surface crack, the solution is compared with previous solution. The stress intensity factor for embedded elliptical crack in turbine rotor loaded by centrifugal and thermal loading is also determined. In this case, the value of stress intensity factor is larger at crack contour near internal radius surface and is almost constant at the crack contour farther from internal radius surface.

• Journal of the korean Society of Automotive Engineers
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• v.14 no.6
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• pp.91-98
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• 1992

In the research on the fracture time of soda lime silicate glass under thermal shock, it is shown that the theoretical and experimental fracture times are in good agreement, the suggested method to measure critical stress intensity factor for small three-point bending specimen is useful and the edge temperature before thermal shock on cracked side vs. crack length and fracture time are inversely proportional.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.21 no.7
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• pp.1089-1096
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• 1997

In this paper, Rancho Seco transient which is reported as a typical pressurized thermal shock event is postulated to be occuring in the Kori unit 1 plant, the oldest nuclear power plant in Korea. For the given material properties, transient history such as temperature and pressure, and postulated flaw, the stress distribution is obtained to calculate stress intensities for a wide range of assumed crack sizes. The stress intensities are compared with the fracture toughness, which is determined using the material properties and the distribution of the nil ductility transition temperature, to determine if cracking is expected to occur during the transient. The allowable operating year for the transient is determined and the evaluation results are discussed.