• Journal of the Korean Ceramic Society
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• v.38 no.9
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• pp.811-816
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• 2001

The influence of the incinerated ash and additives on glass phase formation of lightweight aggregate, weight-lightening, and the bloating mechanism was investigated. Clay was used as base materials and incinerated ash was added from 0 to 30wt%. The additives such as $Na_2CO_3,\;CaCo_3,\;K_2CO_3,\;MgCO_3$, and a little amount of waste oil were added to the mixed body. In clay/incinerated ash/additive system, it turned out that $CaCO_3\;and\;MgCO_3$ were the components for glass phase formation and $Na_2CO_3$ was the component for both glass phase formation and weight-lightening. The small addition of waste oil from 0.5wt% to 3.0wt% affect on the bloating of aggregate. Incinerated ash had a good effect on the glass phase controlling. The most effective condition controlling glass phase and bloating of aggregate was 10wt% incinerated ash, 2wt% waste oil at 1200$^{\circ}$C. The bloating mechanism of lightweight aggregate is as follows; 1) micro-crack formation caused by thermal-shock and gas generation from inside of aggregate, 2) volume expansion by glass phase formation on the aggregate surface and rapid gas bloating inside of aggregate, 3) densification after bloating.

• Korean Journal of Heritage: History & Science
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• v.46 no.4
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• pp.90-107
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• 2013

The Stone Monument of Taejong King in Heonreung Royal Tomb, Seoul was originally erected in 1424 to pay a tribute to Bang Won Lee's achievement who was named Taejong, the Third King of Joseon Dynasty. The monument has been damaged by Japanese Invasion of Korea in 1592 so that another monument was newly made and erected together with the original monument in 1695. The original monument was made of medium-grained biotite granite for the turtle base and medium-grained milky white crystalline limestone for the stele body and the top stone. The turtle base of the original monument is destroyed beyond the original shape and inscription due to irregular shaped breaking and a set of longitudinal crack. Analyzing the deterioration degree by using nondestructive methods, the 88 percentage of the front area and 38 percentage of the back area of the monument are damaged, and the lower part of the stele body is dominantly deteriorated especially due to the combination of discoloration and physical deterioration. The new monument in 1695 is also made of granite and limestone. The weathering indices of the turtle base and stele body stones by the calculation from ultrasonic velocity are 0.10 and 0.74, respectively. This is because the original monument is presumed to be degraded by heat shock and physical attack during the Japanese war, and the long-term outdoor exposure accelerated the weathering of the monument afterward without protective shelter.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.1
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• pp.55-65
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• 2020

The use of underfill materials in semiconductor packages is not only important for stress relieving of the package, but also for improving the reliability of the package during shock and vibration. However, in recent years, as the size of the package becomes larger and very thin, the use of the underfill shows adverse effects and rather deteriorates the reliability of the package. To resolve these issues, we developed the package using a solid epoxy material to improve the reliability of the package as a substitute for underfill material. The developed solid epoxy was applied to the package of the application processor in smart phone, and the reliability of the package was evaluated using thermal cycling reliability tests and numerical analysis. In order to find the optimal solid epoxy material and process conditions for improving the reliability, the effects of various factors on the reliability, such as the application number of solid epoxy, type of PCB pad, and different solid epoxy materials, were investigated. The reliability test results indicated that the package with solid epoxy exhibited higher reliability than that without solid epoxy. The application of solid epoxy at six locations showed higher reliability than that of solid epoxy at four locations indicating that the solid epoxy plays a role in relieving stress of the package, thereby improving the reliability of the package. For the different types of PCB pad, NSMD (non-solder mask defined) pad showed higher reliability than the SMD (solder mask defined) pad. This is because the application of the NSMD pad is more advantageous in terms of thermomechanical stress reliability because the solderpad bond area is larger. In addition, for the different solid epoxy materials with different thermal expansion coefficients, the reliability was more improved when solid epoxy having lower thermal expansion coefficient was used.