• Title/Summary/Keyword: Sherlock

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A Study on the Expansion of Cultural Contents through the Case of Sherlock Holmes (셜록홈즈(Sherlock Holmes)의 사례를 통한 콘텐츠 확장성 연구)

  • Lim, Young-june;Lee, Young-suk
    • Journal of Korea Multimedia Society
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    • v.20 no.10
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    • pp.1689-1696
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    • 2017
  • The purpose of this study is to contribute to the development of a source of cultural contents by proposing extension possibility of cultural contents based on an original source. To this end, this article examined an aspect of Sherlock Holmes contents based on the novel "Sherlock Holmes" published in 1887. It has been produced as 217 different contents from 1899 to 2017 after publishing the novel Sherlock Holmes, and consequently, it has become the best material for the study of the expansion of contents. As a research method, we examined the concept of Transmedia with the change of media environment. Next, we examined the production method of "Sherlock Holmes" contents, analyzed the transformation factors according to each media, and presented the expansion of contents through "Sherlock Holmes" contents.

Structural Reliability Evaluation on Solder Joint of BGA and TSSOP Components under Random Vibration using Reliability and Life Prediction Tool of Sherlock (신뢰성 수명예측 도구 Sherlock을 활용한 랜덤진동에서의 BGA 및 TSSOP 솔더 접합부의 구조 신뢰성 평가)

  • Park, Tae-Yong;Park, Jong-Chan;Park, Hoon;Oh, Hyun-Ung
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.45 no.12
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    • pp.1048-1058
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    • 2017
  • One of the failure mechanism of spaceborne electronics is a fatigue fracture on solder joint under launch random vibration. Thus, a necessity of early diagnosis through the fatigue life evaluation on solder joint arises to prevent such potential risk of failure. The conventional life prediction methods cannot assure the accuracy of life estimation results if the packaging type changes, and also requires much time and effort to construct the analysis model of highly integrated PCB with various packaging types. In this study, we performed life prediction of PCB based on a reliability and life prediction tool of sherlock as a new approach for evaluating the structural reliability on solder joint, and those prediction results were validated by fatigue tests. In addition, we also investigated an influence of solder height on the fatigue life of solder joint. These results indicated that the Sherlock is applicable tool for evaluating the structural reliability of spaceborne electronic.

Life Prediction of Failure Mechanisms of the CubeSat Mission Board using Sherlock of Reliability and Life Prediction Tools (신뢰성 수명예측 도구 Sherlock을 이용한 큐브위성용 임무보드의 고장 메커니즘별 수명예측)

  • Jeon, Su-Hyeon;Kwon, Yae-Ha;Kwon, Hyeong-Ahn;Lee, Yong-Geun;Lim, In-OK;Oh, Hyun-Ung
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.44 no.2
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    • pp.172-180
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    • 2016
  • A cubesat classified as a pico-satellite typically uses commercial-grade components that satisfy the vibration and thermal environmental specifications and goes into mission orbit even after undergoing minimum environment tests due to their lower cost and short development period. However, its reliability exposed to the physical environment such as on-orbit thermal vacuum for long periods cannot be assured under minimum tests criterion. In this paper, we have analysed the reliability and life prediction of the failure mechanisms of the cubesat mission board during its service life under the launch and on-orbit environment by using the sherlock software which has been widely used in automobile fields to predict the reliability of electronic devices.

Mechanical Reliability Evaluation on Solder Joint of CCB for Compact Advanced Satellite (Sherlock을 활용한 차세대 중형위성용 CCB 솔더 접합부의 기계적 신뢰성 평가)

  • Jeon, Young-Hyeon;Kim, Hyun-Soo;Lim, In-Ok;Kim, Youngsun;Oh, Hyun-Ung
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.45 no.6
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    • pp.498-507
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    • 2017
  • Electronic equipments comprised of high density components with various packaging types have been recently applied to a satellite. Therefore, to guarantee high reliability of electrical equipment, a design approach, which can reduce the development period and cost through an early diagnosis in potential risks of failure, should be established. In the previous research, the reliability assesment of the electronic equipments have based on Steinberg's fatigue failure theory. However, this theory was not enough for further investigation of life prediction and reliability of the electronic equipments comprised of various sizes and packaging types due to its theoretical limitations and analysis results sensitivity with regard to different modeling technic. In that case, if detailed finite element model is established, aforementioned problems can be readily solved. However, this approach might arise disadvantage of spending much time. In this paper, to establish strategy for high reliability design of electronic equipment, we performed mechanical reliability evaluation of CCB (Camera Controller Box) at qualification level based on the approach using Sherlock unlike design techniques applied to existing business.

Investigation of Structural Reliability on Solder Joint According to Heater Set-point of the Lunar Lander (달 착륙선의 히터 작동온도 설정에 따른 솔더 접합부의 구조적 신뢰성 분석)

  • Jeon, Young-Hyeon;Park, Tae-Yong;Lee, Jang-Joon;Kim, Jung-Hoon;Oh, Hyun-Ung
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.46 no.2
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    • pp.167-174
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    • 2018
  • The heater is applied to the lunar lander for securing its survivability under severe lunar thermal environment during 14 days of night time. For this, the heater on/off set-points shall be determined to minimize the power consumption due to the limited power generation of lunar lander during night time. In addition, the temperature changes of the lander according to the heater set-point is also an important factor because it is related to thermo-mechanical reliability on solder joint of on-board electronics. In this study, we investigated thermo-mechanical reliability on solder joint according to the heater set-point by using commercial reliability and a life prediction tool of Sherlock based on the thermal analysis results of lunar lander that is a year of the mission lifetime.

Disinfection Efficiency of Medium Pressure UV Lamp on Major Bacteria in Sand Filtered Water (사여과수에 존재하는 우점세균의 중압 자외선 램프 소독능)

  • Ahn, Seoung-Koo;Yang, Yoon-Yong
    • Journal of Korean Society of Environmental Engineers
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    • v.32 no.12
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    • pp.1141-1146
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    • 2010
  • Isolated the heterotrophic aerobic bacteria in sandfiltered water on NA and TSBA solid medium, selected 8 dominant species and identified by Sherlock System. Each samples are irradiated 0, 5, 16, 40 and $60\;mJ/cm^2$ using on CBD (Collimated Beam Device) Medium Pressure UV lamp after these identified bacterium did liquid culture how to make $10^6{\sim}10^7\;cells/mL$ suspended in dilution water. Then cultured bacteria are estimated inactivation rate on plate media. Identified Gram positive group are Bacillus Subtilus, Bacillus megaterium, Rhodococcus erythropolis and Microbacterium laevaniformans; Gram negative group are Pseudomonas vesicularis, Pseudomonas pseudoflava, Alcaligenes paradoxus and Zooglea ramigera. These isolation of bacterium are more stronger reference strain and high resistance of MP UV irradiation, Besides Gram negative bacterium are more sensitive Gram positive bacterium on MP UV dose. Now we are estimating to $60{\sim}100\;mJ/cm^2$ MP UV dose for efficient disinfection in water treatment plant.

Isolation and Antifungar Activity of Bacillus ehimensis YJ-37 as Antagonistic against Vegetables Damping-off Fungi (채소류 모잘록병균에 길항하는 Bacillus ehimensis YJ-37의 선발과 항진균성)

  • 주길재;김진호;강상재
    • Journal of Life Science
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    • v.12 no.2
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    • pp.200-207
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    • 2002
  • This study was carried out to isolate of antagonistic bacterium against Pythium ultimum and Rhizoctonia solani AG-4, causal pathogens of vegetables damping-off. Total of 600 strains were isolated from soil and plait roots. The isolates were screened for antagonism against Pythium ultimum and Rhizoctonia solani AG-4. One strain, named YJ-37, was sellected for detained study among those microoganisms screened. It was identified as Bacillus ehimensis based on morphological and physiological characterisitics according to the Bergey's mannual of systematic bacteriology, Sherlock system of Microbial ID Inc. and 16S rDNA sequences methods. Furthermore Bacillus ehimensis YJ-37 showed antifungal activities against Alternaria altrata, Collectotrichum gloeosporioides, Didymella bryoniae, Fusarium moniliforme, Fusarium oxysporum, F. oxysporum cucumerinum, F. oxysporum niveum, Gloeosporium sp., Glomerella sp., G. cingulata, G. lagenaria, Penicillium digitatum, P. italicum, Phytophthora capsici, Sclerotinia sclerotiorum, and Stemprhylium solani.

Identification and Physiological Characteristics of Microorganism Isolated from Spoiled Sweetened Adzuki Ann (부패된 팥앙금으로부터 분리된 미생물의 동정과 그 균의 생리적 특성)

  • Lee, Tae-Kyoo;Roh, Min-Hwan
    • Journal of the Korean Society of Food Science and Nutrition
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    • v.35 no.10
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    • pp.1456-1460
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    • 2006
  • In order to determine the causes of sweetened adzuki ann spoilage, the characteristics of microorganism isolated from spoiled adzuki ann were investigated. The isolated microorganism was gram-positive, roil-shaped and shore-forming bacteria; its surface was smooth and glazed. From the results of the assimilation test of 46 different biochemicals by the Vitec 2 Compact test and comparison of the cellular wall composition of fatty acid by the data bank of Midi sherlock system, the microorganism was identified as Bacillus subtilis, D-value of the B. subtilis spore was 4.85 min at $115^{\circ}C$, 0.69 min at $121^{\circ}C$ and 0.48 min at $125^{\circ}C$; Z-value was 9.71. The Bacillus subtilis growth was not observed below water activity of 0.92 at $45^{\circ}C$. However, bacteria growth increased gradually as water activity increased above 0.93.

Antibacterial Activity of Onion Pathogens and Isolation of Bacillus ehimensis YJ-4 from the Rhizosphere of Healthy Onion Roots (건전 양파 근권으로부터 Bacillus ehimensis YJ-4의 분리 및 양파 병원균들에 대한 길항력 조사)

  • 주길재;이인구
    • Food Science and Preservation
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    • v.10 no.2
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    • pp.224-229
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    • 2003
  • This study was carried out to isolate of antagonistic bacterium to Allium cepa L. pathogens. A total of 250 strains were isolated from A. cepa L. roots. The isolates were screened for antagonism to A. cepa L. pathogens and the isolated strain No. YJ-4 was selected among these bacteria. It was identified as Bacillus ehimensis based on morphological and physiological characteristics according to the Bergey's mannual of systematic bacteriology, Sherlock system of Microbial ID Int and 165 rDNA sequences methods. Bacillus ehimensis YJ-4 showed broad spectrum of antibacterial and antifungal activities against plant pathogens as Alternaria porri, Botrytis cinerea, Erwinia carotovora subsp. carotovora Fusarium of oxysporium, penicillium sp., Pseudomonas sp., Rhizoctonia solani, Sclerotium cepivotum, Septoria sp., Stemphylium botryosum. Speially B. ehimensis YJ-4 showed high antifungal activity on growth against F. oxysporium, the causal agent of onion Fusarium wilt.

Reliability Design Analysis for Underwater Buriend PBA Based on PoF (고장물리 기반 수중 매설형 PBA에 대한 신뢰성 설계 연구)

  • Kim, Ji-Young;Lee, Ki-Won;Yoon, Hong-Woo;Lee, Seung-Jin;Heo, Jun-Ki;Kwon, Hyeong-Ahn
    • Journal of Applied Reliability
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    • v.17 no.4
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    • pp.280-288
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    • 2017
  • Purpose: PBA buried in underwater requires high reliability because of its mission critical characteristic and harsh operational environment during its life cycle. Therefore, various reliability improvement activities are necessary. The defect on PBA manufacturing process have been studied, as a result, many activities and standards have been presented. However, there are less studies regarding failure pattern on physical features based on design. In this paper, we studied a possible failure patten based on physical features that is related with manufacturing process of PBA. And reliability improvement design based on PoF (Physical of Failure) were intruduced in this paper. Methods: A reliability prediction simulation were performed on the components A and B of the H system using Sherlock Software which is a PoF commercial tool from DFR solution. Solder fatigue and PTH fatigue analysis based on thermal cycling profiles and random vibration was analyzed on three earthquake response spectrum. Result: It was validated that life time and reliability improvement design through solder fatigue and PTH fatigue analysis in case of component. For compoenet B, random vibration fatigue was additionally analyzed and validated reliability for earthquakes profile. Conclusion: In design stage prior to manufacturing, PoF can be analyzed, and it is possible to make a reliability improvement/validated design using design data. This study can be applied in every design step and contribute to make more stable development product.