• 제목/요약/키워드: Sensor technology

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Fabrication of TiO2/polyelectrolyte thin film for a methyl mercaptan gas sensor (메칠멜캅탄 가스센서용 TiO2/전해질폴리머 박막 제조)

  • Kim, Jin-Ho;Hwang, Jong-Hee;Lee, Mi-Jai;Kim, Sei-Ki;Lim, Tae-Young
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.20 no.5
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    • pp.221-226
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    • 2010
  • Quartz crystal microbalance (QCM) gas sensor to detect methyl mercaptan ($CH_3SH$) gas was fabricated by depositing $TiO_2$ nanoparticles and polyelectrolyte on the electrode of QCM. The $TiO_2$/poly(sodium 4-styrenesulfonate) (PSS) thin film fabricated by a layer-by-layer self-assembly (LBL-SA) method showed a high surface area and increased the sensitivity of gas sensor. When the QCM sensors coated with triethanolamine (TEA) or ($TiO_2$/PSS) were exposed to methyl mercaptan gas (1.0 ppm), the frequency shifts of QCM with TEA casting film and $TiO_2$/PSS thin film were ca. 9 Hz and ca. 24 Hz, respectively. As the bilayer number of ($TiO_2$/PSS) increased, the frequency shift of QCM sensor with ($TiO_2$/PSS) thin film was gradually increased. In addition, the frequency shift of QCM sensor was gradually increased as the concentration of methyl mercaptan gas increased from 0.5 ppm to 2.0 ppm. In this study, the surface morphology and sensor property of QCM sensor coated with ($TiO_2$/PSS) thin film were measured.

Development of Packaging Technology for CdTe Multi-Energy X-ray Image Sensor (CdTe 멀티에너지 엑스선 영상센서 패키징 기술 개발)

  • Kwon, Youngman;Kim, Youngjo;Ryu, Cheolwoo;Son, Hyunhwa;Kim, Byoungwook;Kim, YoungJu;Choi, ByoungJung;Lee, YoungChoon
    • Journal of the Korean Society of Radiology
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    • v.8 no.7
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    • pp.371-376
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    • 2014
  • The process of flip-chip bump bonding, Au wire bonding and encapsulation were sucessfully developed and modularized. The CdTe sensor and ROIC were optimally jointed together at $150^{\circ}C$ and $270^{\circ}C$ respectively under24.5 N for 30s. To make SnAg bump on ROIC easy to be bonded, the higher bonding temperature was established than CdTe sensor's. In addition, the bonding pressure was lowered minimally because CdTe Sensor is easier to break than Si Sensor. CdTe multi-energy sensor module observed were no electrical failures in the joints using developed flip chip bump bonding and Au wire bonding process. As a result of measurement, shearing force was $2.45kgf/mm^2$ and, it is enough bonding force against threshold force, $2kgf/mm^2s$.

A Medium Access Control Scheme for Reducing Energy Consumption through Avoiding Receipt of Redundant Messages in Wireless Sensor Networks (무선 센서 네트워크에서 중복 메세지 순신 회피를 통한 에너지 소비절감 매체 접근 제어)

  • Han, Jung-An;Lee, Moon-Ho
    • Journal of Information Technology Applications and Management
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    • v.12 no.4
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    • pp.13-24
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    • 2005
  • The sensor network is a key component of the ubiquitous computing system which is expected to be widely utilized in logistics control, environment/disaster control, medical/health-care services, digital home and other applications. Nodes in the sensor network are small-sized and exposed to adverse environments. They are demanded to perform their missions with very limited power supply only. Also the sensor network is composed of much more nodes than the wireless ad hoc networks are. In case that some nodes consume up their power capacity, the network topology should change, and rerouting/retransmission is necessitated. Communication protocols studied for conventional wireless networks or ad hoc networks are not suited for the sensor network resultantly. Schemes should be devised to control the efficient usage of node power in the sensor network. This paper proposes a medium access protocol to enhance the efficiency of energy consumption in the sensor network node. Its performance is analyzed by simulation.

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An optical instrumentation using a sensor with a sensordummy against noises on sensor and transmission line

  • Mine, Katsutoshi;Kubota, Nobuhisa;Morimoto, Fumio;Sanada, Mizuho;Qi, Zhang
    • 제어로봇시스템학회:학술대회논문집
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    • 1993.10b
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    • pp.550-553
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    • 1993
  • Methods of Alternating Noise Canceling were previously developed for the optical instrumentation;one using a dual photo sensor and another using a single photo sensor that could cancel normal mode noise on a transmission line, even if the noise was of equal status noise. But the methods could not remove noise on sensor line. This paper discusses a new method of using a photo sensor with a resistance sensordummy, effectively canceling equal status normal mode noise not only on a sensor line but also on a transmission line of an optical instrumentation. The accuracy of this method has been verified by experiments using sinusoidal wave as an equal status noise on a sensor line and/or rectangular wave as an equal status wide band noise on a transmission line respectively.

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Study of Capacitive Tilt Sensor with Metallic Ball

  • Lee, Chang Hwa;Lee, Seung Seob
    • ETRI Journal
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    • v.36 no.3
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    • pp.361-366
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    • 2014
  • In this paper, a new, simple capacitive tilt sensor with a metallic ball is proposed. The proposed tilt sensor has only two electrodes and a metallic ball, and this design assists in managing the inherent contact problem in measuring tilt angles. Capacitive sensing, compared with other types of tilt sensor, has many advantages such as simplicity, noncontact measurement, long-throw linear displacement, and sub-micron plate spacing. Its design and fabrication process are significantly simpler than previous types of tilt sensors. The dimensions of the prototype tilt sensor are $20mm{\times}20mm$, and the diameter of the polystyrene tube is 5 mm with a tube thickness of 0.15 mm. An analytical study of the prototype capacitive tilt sensor was undertaken, and the experimental results demonstrate the relationship between the tilt angles and measured capacitances compared with the analytical study.

A Gap Sensor Design for Precision Stage (초정밀 스테이지용 변위 센서)

  • 김일해;김종혁;장동영
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 2004.04a
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    • pp.453-458
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    • 2004
  • A capacitate sensor is a proper device for measuring high small displacement. General design parameters and procedure are discussed and a test sensor was built to have a measuring range of 100$\mu\textrm{m}$ and a sensitivity about 30nm. This sensor has too opposing electrode of comparably large area and has nominal gap distance about 150$\mu\textrm{m}$. So as to achieve a nano order displacement sensitivity, both sensor and target system have to be considered. This is important for the sensitivity can be achieved by minimizing a system total noise level in electronic type sensor application. Typical performance of the developed sensor is demonstrated in precision moving stage having 0.1$\mu\textrm{m}$ moving resolution.

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Fiber-Optic Pressure Sensor Using a Rugate-Structured Porous Silicon Diaphragm Coated with PMMA (PMMA가 코팅된 주름 구조를 갖는 다공성규소 격판을 이용한 광섬유 압력센서)

  • Lee, Ki-Won;Cho, So-Yeon
    • Journal of Sensor Science and Technology
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    • v.22 no.3
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    • pp.227-232
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    • 2013
  • In this research, fiber-optic pressure sensors were fabricated with rugate-structured porous silicon (RPS) diaphragms coated with PMMA (Polymethyl-Methacrylate). The reflectance spectrum of the PMMA/RPS diaphragm was almost the same as that of uncoated RPS diaphragm. However the mechanical strength of the PMMA/RPS diaphragm increased more than that of the uncoated diaphragm. As a result, the fiber-optic sensor fabricated with PMMA/RPS diaphragm could successfully detect more high pressure difference without diaphragm damage than the highest detectable pressure difference of the sensor with normal RPS diaphragm. The response data of the fiber-optic sensor recorded as a function of pressure difference were fitted by theoretical curves. During this process, elastic moduli of the used PMMA/RPS diaphragms were obtained numerically. The dynamic response properties of the fiber-optic sensor were also investigated under continuous variation of the pressure difference conditions.

Development of Eco-Friendly Paper Glucose Bio-Sensor (친환경 종이 혈당 비이오센서 개발)

  • Kim, A-Young;Lee, Young-Tae
    • Journal of Sensor Science and Technology
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    • v.22 no.3
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    • pp.202-206
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    • 2013
  • In this paper, a disposable glucose sensor was made of paper. Glucose sensor strip using carbon electrode is appropriate for the low price ones because it requires cheap materials and low cost production. Most of blood glucose sensors were developed with plastics, but it causes pollution problems. Therefore we developed disposable carbon electrode glucose sensor using paper. This sensor consists of upper and bottom plate. On the upper plate, three-dimensional channel are formed through pressing process. The fabricated paper glucose sensor shows relatively short sensing time of about 5seconds, excellent reproducibility ($R^2$=0.9558), and fabrication yield as well.

Implementation of the Pulse Wave Measurement System Using Bipolar Biased Head on Mode of the Hall Sensor (홀 센서의 양극 바이어스 수직모드를 이용한 맥파측정시스템 구현)

  • Jin, Sang-Gon;Kim, Myoung-Nam
    • Journal of Sensor Science and Technology
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    • v.20 no.5
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    • pp.322-328
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    • 2011
  • There are many ways to detect the heart rate non-invasively such as ECG, PPG, strain gauge, and pressure sensor. In this paper, the pulse wave measurement system using bipolar biased head on mode of the Hall sensor is proposed for measuring the radial artery pulse. TMS320F2812 was used to implement the proposed system and a portable wireless network(zig-bee) was used to show the experimental result. It was confirmed from experiment that the performance of the implemented system was more stable and faster than PPG sensor or piezoelectric film pressure sensor.

The Electric Control Method on the Packaging Technology for Non-Conductive Materials Using the Surface Processing Cavity Pressure Sensor (표면 가공형 캐비티 압력센서를 이용하여 비전도성 물질용 패키지 기술에 전기적 제어방식 연구)

  • Lee, Sun-Jong;Woo, Jong-Chang
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.33 no.5
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    • pp.350-354
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    • 2020
  • In this study, a pressure sensor for each displacement was fabricated based on the silicon-based pressure sensor obtained through simulation results. Wires were bonded to the pressure sensor, and a piezoresistive pressure sensor was inserted into the printed circuit board (PCB) base by directly connecting a micro-electro-mechanical system (MEMS) sensor and a readout integrated circuit (ROIC) for signal processing. In addition, to prevent exposure, a non-conductive liquid silicone was injected into the sensor and the entire ROIC using a pipette. The packaging proceeded to block from the outside. Performing such packaging, comparing simple contact with strong contact, and confirming that the measured pulse wavelength appears accurately.