Journal of the Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회논문지)

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
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The Electric Control Method on the Packaging Technology for Non-Conductive Materials Using the Surface Processing Cavity Pressure Sensor

표면 가공형 캐비티 압력센서를 이용하여 비전도성 물질용 패키지 기술에 전기적 제어방식 연구

  • Lee, Sun-Jong (Department of Semiconductor and Electrical System, Semiconductor Convergence Campus of KOREA PolyTechnic) ;
  • Woo, Jong-Chang (Department of Semiconductor Process Equipment, Semiconductor Convergence Campus of KOREA PolyTechnic)
  • 이선종 (한국폴리텍대학 반도체융합캠퍼스 반도체전기시스템과) ;
  • 우종창 (한국폴리텍대학 반도체융합캠퍼스 반도체공정장비과)
  • Received : 2020.07.05
  • Accepted : 2020.07.22
  • Published : 2020.09.01
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Abstract

In this study, a pressure sensor for each displacement was fabricated based on the silicon-based pressure sensor obtained through simulation results. Wires were bonded to the pressure sensor, and a piezoresistive pressure sensor was inserted into the printed circuit board (PCB) base by directly connecting a micro-electro-mechanical system (MEMS) sensor and a readout integrated circuit (ROIC) for signal processing. In addition, to prevent exposure, a non-conductive liquid silicone was injected into the sensor and the entire ROIC using a pipette. The packaging proceeded to block from the outside. Performing such packaging, comparing simple contact with strong contact, and confirming that the measured pulse wavelength appears accurately.

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