• Journal of Sensor Science and Technology
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• v.30 no.5
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• pp.342-348
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• 2021

For the characterization or failure analysis of electronic devices such as PCB (printed circuit boards), the most common method is the measurement of voltage waveforms with an oscilloscope. However, because there are many types of problems that cannot be detected by voltage waveform analysis, several other methods such as X-ray transmission, infrared imaging, or eddy current measurement have been applied for these analyses. However, these methods have also been limited to general analyses because they are partially useful in detecting physical defects, such as disconnections or short circuits. Fundamentally current waveform measurements during the operation of electronic devices need to be performed, however, commercially available current sensors have not yet been developed, particularly for applications in highly integrated PCB products with sub-millimeter fine pitch. In this study, we developed a highly sensitive PHR (planar hall resistance) magnetic sensor for application in highly integrated PCBs. The developed magnetic sensor exhibited sufficient features of an ultra-small size of less than 340 ㎛, magnetic field resolution of 10 nT, and current resolution of 1 mA, which can be applicable for PCB analyses. In this work, we introduce the development process of the magnetic sensing probe and its characteristic results in detail, and aim to extend this pin-type current probe to applications such as current distribution imaging of PCBs.

• Journal of Sensor Science and Technology
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• v.30 no.4
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• pp.236-242
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• 2021

In this paper, we report the fabrication of the tip-on-gate of a field-effect-transistor (ToGoFET) probe using a standard complementary metal-oxide-semiconductor (CMOS) process and the performance evaluation of the fabricated probe. After the CMOS process, I-V characteristic measurement was performed on the reference MOSFET. We confirmed that the ToGoFET probe could be operated at a gate voltage of 0 V due to channel ion implantation. The transconductance at the operating point (Vg = 0 V, Vd = 2 V) was 360 ㎂/V. After the fabrication process was completed, calibration was performed using a pure metal sample. For sensitivity calibration, the relationship between the input voltage of the sample and the output current of the probe was determined and the result was consistent with the measurement result of the reference MOSFET. An oxide sample measurement was performed as an example of an application of the new ToGoFET probe. According to the measurement, the ToGoFET probe could spatially resolve a hundred nanometers with a height of a few nanometers in both the topographic image and the ToGoFET image.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.05a
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• pp.7-8
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• 2009

Non-contact critical current measurement apparatus was developed using hall probe which measures the magnetic field distribution across the width of superconducting tape. The hall probe consists of 7 independent hall sensors which lie in a line 600 ${\mu}m$. The difference between maximum and minimum magnetic field in the magnetic filed distribution is a main parameter to determine the critical current. As preliminary research, we calculated the magnetic field intensity at the middle sensor, which is a minimum magnetic field and generated by the circular shielding current modeled by Bean model. We confirmed that there are some parameters that affect on the minimum magnetic field; the distance between superconducting layer and hall sensor, the width of superconducting tape, and the critical current distribution across the width of superconducting tape. Among these parameters, the distance between superconducting layer and hall sensor highly influences on the minimum magnetic field.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.411-415
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• 2002

In this paper, a mechanical probe for CMM (Coordinate Measuring Machine) with a three-axis force-sensing unit is proposed, which is capable of measuring an actual contact position without the lobbing effect and the pre-travel error. The force-sensing unit detects the external force, which is act on the stylus of CMM during the measuring process. Thus, the contact point of the stylus of CMM can be estimated ken the direction of measured force components. Based on the structural analysis of the proposed CMM probe, the transformation matrix is derived and calibrated so that it shows linear relationships between the estimated force components from the output voltages and the real input forces. And, the relationships are verified through the computer simulation. The results show that the proposed mechanical probe is very useful fur detecting the contacting force components on measuring process of CMM.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.4
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• pp.73-77
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• 2017

Recently, fingerprint sensors have widely used for personal information security, and require quality evaluation to reduce an error of their recognition rate. Quality of fingerprint sensors is evaluated by variation of their electrical resistance introducing by contacts between a probe tip and a sensor electrode, Investigation on the materials compatability and structure optimization of probe is required to reduce deformation of sensor electrode for repeatability of quality testing. Nickel, steel(SK4), beryllium copper, and phosphor bronze were considered as probe materials, and beryllium copper was the most appropriate for materials of probe tips, considering indentation and contact resistance while being contacted probe tips on electrodes. Probes of an inspection part were manufactured with the single-unit structure for physical damage prevention and parallel processing capability. Inspection repeatability was evaluated by voltage variation of fingerprint sensors when the specific current was applied. A single-unit inspection part with beryllium copper probe tips showed excellent repeatability within ${\pm}0.003V$ of its voltage variation.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2001.10a
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• pp.250-254
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• 2001

The resolution of analog sensor is determined by its sensitivity and amplitude of noise. This paper presents modeling of inductive gap sensor base on equivalent magnetic circuit and analysis of sensitivity. We can simulate static characteristic of inductive gap sensor using this model. Computer simulation show that sensor's sensitivity is affected by magnetic flux's leakage and fringing, and that they are affected by shape of sensor probe. Base on this, we designed shape of inductive position sensor probe.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1018-1021
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• 2003

A scratch tester was developed to evaluate the adhesive strength at interface between thin film and substrate(silicon wafer). Under force control, the scratch tester can measure the normal and the horizontal forces simultaneously as the probe tip of the equipment approaches to the interface between thin film and substrate of wafer. The capacity of each component of force sensor is 0.1 N ∼ 100 N. In addition, the tester can detect the signal of elastic wave from AE sensor(frequency range of 900 kHz) attached to the probe tip and evaluate the bonding strength of interface. Using the developed scratch tester. the feasibility test was performed to evaluate the adhesive strength of semiconductor wafer.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.17 no.1
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• pp.106-112
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• 2008

In this paper, It does the profile measurement of the cam of diesel engine SOHC of the actual object. It uses the measurement of run-out method. This method is that the surface of the object is measured by the sensor when the object rotate, and calculated and displayed by the computer the signal which acquired by sensor. When we acquire the signals, we have two error because of motion and contacting between cam and probe. In this paper, we compensate the motion error while simply liner equation. And we have a solution that we change the figure of probe when we have a contacting error. We compared the data measuring on developed automatic cam profile measuring system with the data measured on CMM.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.391-395
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• 2002

This paper described about the ultra-precision profile measurement of aspheric surfaces using contact probing technique. A contact probe has been designed as a sensing device to obtain measuring resolutions in nanometer regime utilizing a leaf spring mechanism and a capacitive-type sensor. The contact probe is attached on the z-axis during measurement while aspheric objects are supported on the single point diamond turning machine(SPDTM). The machine xz-axis motions are monitored by a set of two orthogonal plane mirror type laser interferometers. Experimental results show that the contact probing technique developed of On-machine Measurement System in this investigation is capable of providing a repeatability of 20 nanometers with a $\pm$20 uncertainty of 300 nanometers.

• Journal of Advanced Marine Engineering and Technology
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• v.33 no.6
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• pp.925-931
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• 2009

This paper reports a preliminary experimental investigation and characterization of an optical fiber-based submersion sensor system for applications in water flooding and leakage. The sensor system comprises a multi-mode fiber spliced with fiber Bragg grating and an intensity-based interrogator. Submersion tests were conducted in water-air and Glycerin-air environments. By the refractive index of the fiber-probe surrounding materials, the reflectance and the detecting power level is determined. When the probe is dipped into the water, the optical output power dramatically decreases from -7.5dBm to -17.5dBm. But, the center of Bragg wavelength is not affected in spite of external material changes. Temporal response characteristics of the sensor system is investigated to verify the real-time reaction. When the probe is immersed into the liquid, there is no transition time.