• 제목/요약/키워드: Semiconductor sheet

검색결과 131건 처리시간 0.029초

CIGS 태양전지의 윈도우 층에 적용 가능한 스퍼터링으로 증착한 AZO 박막의 공정압력의 영향에 따른 특성 연구 (A Study on the Effect of Process Pressure on AZO Thin Films Sputtered for the Windows Layers of CIGS Solar Cells)

  • 윤여탁;조의식;권상직
    • 반도체디스플레이기술학회지
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    • 제16권2호
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    • pp.89-93
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    • 2017
  • For various process pressures, aluminum doped zinc oxide(AZO) films were deposited by in-line pulsed-DC sputtering. The deposited AZO films were optically and electrically investigated and analyzed for the window layers of CIGS solar cell systems. As the pressure was increased from 9 mtorr to 15 mtorr, the thickness of AZO was decreased as a result of scattering and its sheet resistance was rapidly increased. The transmittance of AZO was slightly decreased as the pressure was increased and the calculation of figure of merit(F.O.M) was dependent on the sheet resistance. The structural characteristics of AZO thin films analyzed by X-ray diffraction(XRD) showed no significant dependency according to the pressure.

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플라즈마 표면 처리에 따른 AZO 박막의 특성 변화 (Characterization of AZO Thin Film by Plasma Surface Treatment)

  • 우종창;김관하
    • 한국전기전자재료학회논문지
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    • 제32권2호
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    • pp.147-150
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    • 2019
  • There is a need for the development of transparent conductive materials that are economical and environmentally friendly with exhibit low resistivity and high transmittance in the visible spectrum. In this study, the deposition rate and uniformity of Al-doped ZnO-thin films were improved by changing the Z-motion of the sputtering system. The deposition rate and the uniformity were determined to be 3.44 nm/min and 1.23%, respectively, under the 10 mm Z-motion condition. During $O_2$ plasma treatment, the intrusion-type metal elements in the thin film were reduced, which contributed to an oxygen vacancy reduction in addition to structural stabilization. Moreover, the sheet resistance was more easily saturated.

Cr capping layer를 이용한 n-Ge(100) 기판에서의 Ti germanide 형성과 특성에 관한 연구 (The Formation and Characteristics of Titanium Germanide with Cr capping layer on n-Ge(100) Substrate)

  • 문란주;최철종;심규환
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2009년도 하계학술대회 논문집
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    • pp.154-154
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    • 2009
  • Cr capping layer를 이용하여 Titanium germanide의 열적 안정성을 향상시키는 연구를 수행하였다. n-type Ge(100) 기판 위에 전자빔 증착기를 이용하여 30nm 두께의 Ti와 Cr capping layer를 증착하고 $400\;^{\circ}C$에서 $800\;^{\circ}C$까지 30초간 N2 분위기로 급속 열처리하여 Ti germanide를 형성하였다. XRD결과로부터 Cr capping layer의 유무에 관계 없이 Ti germanide가 형성된 것을 관찰할 수 있었다. Ge 기판 위에 CTLM 패턴을 형성하고 실험을 진행하여 Ti germanide의 I-V 측정 데이터를 통해 Ohmic 특성을 알아보았고, contact resistance, sheet resistance, specific contact resistance를 구하였다.

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저결함 그래핀 양자점 구조를 갖는 RGO 나노 복합체 기반의 저항성 메모리 특성 (Memristive Devices Based on RGO Nano-sheet Nanocomposites with an Embedded GQD Layer)

  • 김용우;황성원
    • 반도체디스플레이기술학회지
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    • 제20권1호
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    • pp.54-58
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    • 2021
  • The RGO with controllable oxygen functional groups is a novel material as the active layer of resistive switching memory through a reduction process. We designed a nanoscale conductive channel induced by local oxygen ion diffusion in an Au / RGO+GQD / Al resistive switching memory structure. A strong electric field was locally generated around the Al metal channel generated in BIL, and the local formation of a direct conductive low-dimensional channel in the complex RGO graphene quantum dot region was confirmed. The resistive memory design of the complex RGO graphene quantum dot structure can be applied as an effective structure for charge transport, and it has been shown that the resistive switching mechanism based on the movement of oxygen and metal ions is a fundamental alternative to understanding and application of next-generation intelligent semiconductor systems.

Thermal Stability Improvement of the Ni Germano-silicide formed by a novel structure Ni/Co/TiN using 2-step RTP for Nano-Scale CMOS Technology

  • Huang Bin-Feng;Oh Soon-Young;Yun Jang-Gn;Kim Yong-Jin;Ji Hee-Hwan;Kim Yong-Goo;Cha Han-Seob;Heo Sang-Bum;Lee Jeong-Gun;Kim Yeong-Cheol;Lee Hi-Deok
    • 대한전자공학회:학술대회논문집
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    • 대한전자공학회 2004년도 하계종합학술대회 논문집(2)
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    • pp.371-374
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    • 2004
  • In this paper, Ni Germane-silicide formed on undoped $Si_{0.8}Ge_{0.2}$ as well as source/drain dopants doped $Si_{0.8}Ge_{0.2}$ was characterized by the four-point probe for sheet resistance. x-ray diffraction (XRD), x-ray photoelectron spectroscopy (XPS) and field emission scanning electron microscope (FESEM). Low resistive NiSiGe is formed by one step RTP (Rapid thermal processing) with temperature range at $500{\~}700^{\circ}C$. To enhance the thermal stability of Ni Germane-silicide, Ni/Co/TiN structure with different Co concentration were studied in this work. Low sheet resistance was obtained by Ni/Co/TiN structure with high Co concentration using 2-step RTP and it almost keeps the same low sheet resistance even after furnace annealing at $650^{\circ}C$ for 30 min.

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AZO/Ag/AZO 다층박막의 Ag두께에 따른 특성 연구 (Influence of Ag thickness on properties of AZO/Ag/AZO Multi-layer Thin Films)

  • 연제호;김홍배
    • 반도체디스플레이기술학회지
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    • 제16권2호
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    • pp.27-31
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    • 2017
  • AZO/Ag/AZO multi-layer films deposited on glass substrate by RF magnetron sputtering and thermal evaporator have a much better electrical properties than Al-doped ZnO thin films. The multi-layer structure consisted of three layers, AZO/Ag/AZO, the electrical and optical properties of AZO/Ag/AZO were changed mainly by thickness of Ag layers. The optimum thickness of Ag layers was determined to be $90{\AA}$ for high optical transmittance and good electrical conductivity. The Ag layers thickness $90{\AA}$ is an optical transmittance greater than 80% of visible light and the obtained multilayer thin film with the low resistivity of $8.05{\times}10-3{\Omega}cm$ and the low sheet resistance $5.331{\Omega}/sq$. Applying to TCO and Solar electrode will improve efficiency.

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일부 반도체 사업장 포토레지스트 화학물질 MSDS 정보의 신뢰성 분석 (Reliability Analysis of Material Safety Data Sheets(MSDS) for Photoresist Chemicals used in some Semiconductor Factories)

  • 이경화;이석용;최윤지;최한영
    • 한국산업보건학회지
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    • 제26권4호
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    • pp.404-410
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    • 2016
  • Objectives: This study aimed to examine and analyze the material safety data sheet(MSDS) information for photoresist chemicals used in certain processes in semiconductor plants. Methods: After collecting MSDS for 178 chemical products currently used in certain processes in semiconductor plants, we analyzed Sections 2, 3, 11, and 15 of each MSDS with reference to the guidelines for evaluating the reliability of MSDS provided by the Korea Occupational Safety and Health Agency. In addition, we reviewed the recorded uses and the ratios of trade secrets. Results and Conclusions: We studied a total of 178 chemical products. An MSDS was available for 176(98.9%) of them and all adhered to the Globally Harmonized System(GHS) regulations. There were 37 cases of errors in Hazard Identification, pertaining to 20.8% of all products surveyed. There were 64 cases of errors in the current legal circumstances, pertaining to 36.0% of all products. There were a total of 407 trade secrets across 52.2% of products. We believe that a government-led education and certification system needs to be introduced to improve the transfer of MSDS information. The government, chemical manufacturers and suppliers all need to make an effort to produce reliable MSDS.

계면을 갖는 흡습된 XLPE시료에서의 유전특성과 온도의존성 (Temperature Dependency and Dielectric Properties of Humid XLPE sheet with)

  • 김동식;이종복;황보승;박대희
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1999년도 하계학술대회 논문집 D
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    • pp.1636-1638
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    • 1999
  • In this paper, humidity and temperature were carried out on XLPE sheet and XLPE/semi sheet. We measured voltage, temperature dependency and dielectric properties of humid dielectric materials. Dielectric losses of XLPE(A,B)/semi with and without humidity were $4.2{\times}10^{-4}$ and $3.6{\times}10^{-4},\;2.8{\times}10^{-4}$ and $3.2{\times}10^{-4}$, respectively, at room temperature. On the condition that humidity and semiconductors exist, we confirmed that dielectric properties had been influenced on semiconductor and humidity.

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Investigation of the Annealing Time Effects on the Properties of Sputtered ZnO:Al Thin Films

  • Kim, Deok Kyu;Kim, Hong Bae
    • Applied Science and Convergence Technology
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    • 제23권6호
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    • pp.366-370
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    • 2014
  • ZnO:Al transparent conductive films were deposited on glass substrates by RF magnetron sputtering technique and annealed by rapid thermal annealing system. The influence of annealing time on the structural, electrical, and optical properties of ZnO:Al thin films was investigated by atomic force microscopy, X-ray diffraction, Hall method and optical transmission spectroscopy. As the annealing time increases from 0 to 5 min, the crystallinity is improved, the root main square surface roughness is decreased and the sheet resistance is decreased. The lowest sheet resistance of ZnO:Al thin film is 90 ohm/sq. The reduction of sheet resistance is caused by increasing carrier concentration due to substituent Al ion. All films are transparent up to 80% in the visible wavelength range and the adsorption edge is a blue-shift due to Burstein-Moss effect with increasing annealing time.

Experiences with Simulation Software for the Analysis of Inverter Power Sources in Arc Welding Applications

  • Fischer W.;Mecke H.;Czarnecki T.K.
    • 전력전자학회:학술대회논문집
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    • 전력전자학회 2001년도 Proceedings ICPE 01 2001 International Conference on Power Electronics
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    • pp.731-736
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    • 2001
  • Nowadays various simulation tools are widely used for the design and the analysis of power electronic converters. From the engineering point of view it is rather difficult to parameterize power semiconductor device models without the knowledge of basic physical parameters. In recent years some data sheet driven behavioral models or so called 'wizard' tools have been introduced to solve this problem. In this contribution some experiences with some user-friendly power semiconductor models will be discussed. Using special simulation test circuits it is possible to get information on the static and dynamic behavior of the parameterized models before they are applied in more complex schemes. These results can be compared with data sheets or with measurements. The application of these models for power loss analysis of inverter type arc welding power sources will be described.

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