• 한국산업보건학회지
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• 제22권1호
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• pp.52-59
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• 2012

Objectives: The purpose of this study was to evaluate the exposure possibility of by-products during the semiconductor manufacturing processes. Methods: The authors investigated types of chemicals generated during semiconductor manufacturing processes by the qualitative experiment on generation of by-products at the laboratory and a literature survey. Results: By-products due to decomposition of photoresist by UV-light during the photo-lithography process, ionization of arsine during the ion implant process, and inter-reactions of chemicals used at diffusion and deposition processes can be generated in wafer fabrication line. Volatile organic compounds (VOCs) such as benzene and formaldehyde can be generated during the mold process due to decomposition of epoxy molding compound and mold cleaner in semiconductor chip assembly line. Conclusions: Various types of by-products can be generated during the semiconductor manufacturing processes. Therefore, by-products carcinogen such as benzene, formaldehyde, and arsenic as well as chemical substances used during the semiconductor manufacturing processes should be controlled carefully.

• 한국표면공학회지
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• 제57권3호
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• pp.208-213
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• 2024

With the development of industry, miniaturization and densification of semiconductor components are rapidly progressing. Particularly, as demand surges across various sectors, efficiency in productivity has emerged as a crucial issue in semiconductor component manufacturing. Maximizing semiconductor productivity requires real-time monitoring of semiconductor processes and continuous reflection of the results to stabilize processes. However, various unexpected variables and errors in judgment that occur during the process can cause significant losses in semiconductor productivity. Therefore, while the development of a reliable manufacturing system is important, the importance of developing sensor technology that can complement this and accurately monitor the process is also growing. In this study, conducted a basic research on the concept of diagnostic sensors for thickness based on the physical changes of thin films due to etching. It observed changes in resistance corresponding to variations in thin film thickness as etching processes progressed, and conducted research on the correlation between these physical changes and thickness variations. Furthermore, to assess the reliability of thin film thickness measurement sensors, it conducted multiple measurements and comparative analyses of physical changes in thin films according to various thicknesses.

• 청정기술
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• 제5권1호
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• pp.62-77
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• 1999

전자 및 컴퓨터 산업의 발전으로 반도체 산업은 비약적으로 발전하고 있다. 그러나 반도체 제조 공정에서 필수적으로 사용되는 각종 환경 오염 물질에 대한 규제가 세계적으로 강화되고 있어 반도체 업계의 적극적인 환경 대응책이 없이는 반도체 수출에 대한 선진국의 제재를 피하기 어렵다. 따라서 본 연구에서는 청정 기술 측면에서, 반도체 산업의 환경영향 개선을 위한 세정 공정의 기술적 대체 방안에 대하여 조사하였다. 세정 공정의 대안으로서 기상 세정 공정, UV 사용 공정, 플라즈마 사용 공정을 조사하였으며, 각 공정의 장단점을 비교하였다.

• 산업경영시스템학회지
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• 제34권4호
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• pp.57-65
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• 2011

Monitoring auto correlated processes is prevalent in recent manufacturing environments. As a proactive control for manufacturing processes is emphasized especially in the semiconductor industry, it is natural to monitor real-time status of equipment through sensor rather than resultant output status of the processes. Equipment's sensor data show various forms of correlation features. Among them, considerable amount of sensor data, statistically autocorrelated, is well represented by Box-Jenkins autoregressive moving average (ARMA) model. In this paper, we present a design method of statistical process control (SPC) used for monitoring processes represented by the ARMA model. The proposed method shows benefits in the power of detecting process changes, and considers robustness to ARMA modeling errors simultaneously. We prove benefits through Monte carlo simulation-based investigations.

• 한국재료학회:학술대회논문집
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• 한국재료학회 1998년도 IUMRS-ICEM ABSTRACT BOOK
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• pp.124.4-124
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• 1998

• 반도체디스플레이기술학회지
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• 제2권3호
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• pp.1-6
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• 2003

In the rapid changes of the semiconductor manufacturing technologies for early 21st century, it may be safely said that a kernel of terms is the size increase of Si wafer and the size decrease of semiconductor devices. As the size of Si wafers increases and semiconductor device is miniaturized, the units of cleaning processes increase. A present cleaning technology is based upon RCA cleaning which consumes vast chemicals and ultra pure water (UPW) and is the high temperature process. Therefore, this technology gives rise to environmental issue. To resolve this matter, candidates of advanced cleaning processes have been studied. One of them is to apply the electrolyzed water. In this work, electrolyzed water cleaning was compared with various chemical cleaning, using Si wafer surfaces by changing cleaning temperature and cleaning time, and especially, concentrating upon the contact angle. It was observed that contact angle on surface treated with Electrolyzed water cleaning was $4.4^{\circ}$ without RCA cleaning. Amine series additive of high pKa (negative logarithm of the acidity constant) was used to observe the property changes of cathode water.

• 반도체디스플레이기술학회지
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• 제23권2호
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• pp.92-99
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• 2024

As semiconductor processes require several nanometers precision, the importance of motor control is increasing in semiconductor equipment. Due to unpredictable uncertainties such as friction and mechanical vibrations achieving precise position control in semiconductor processes is challenging. The internal model principle-based controller is a control technique that ensures robust steady-state performance by incorporating a model of the reference and disturbance. The disturbance observer-based controller is a prominent robust control technique implemented to cope with various nonlinearities and uncertainties. Provided that the two controllers can be designed to exhibit equivalent performance under certain conditions, this paper demonstrates through experiments that they yield identical results for the case of a BLDC position control problem. The experimental results also indicate that they can offer enhanced robustness compared with the conventional PID controller in the presence of a time-varying disturbance.

• 산업경영시스템학회지
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• 제33권3호
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• pp.184-191
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• 2010

In the environment of 450mm wafers production known as the next-generation semiconductor production process, one of the most significant features is the full automation over the whole manufacturing processes involved. The full automation system for 450mm wafer production will minimize the human workers' involvement in the manufacturing process as much as possible. In addition, since the importance of an individual wafer processing increases noticeably, it is necessary to develop more robust scheduling systems in the whole manufacturing process than so ever. The scheduling systems for the next-generation semiconductor production processes also should be capable of monitoring individual wafers and collecting useful data on them in real time. Based on the information gathered from these processes, the system should finally have a real-time scheduling functions controlling whole the semiconductor manufacturing processes. In this study, preliminary investigations on the requirements and needed functions for constructing the real time scheduling system and transforming manufacturing environments for 300mm wafers to those of 400mm are conducted and through which the next generation semiconductor processes for efficient scheduling in a clustered production system architecture of the scheduler is proposed. Our scheduling architecture is composed of the modules for real-time scheduling, the clustered production type supporting, the optimal scheduling and so on. The specifications of modules to define the major required functions, capabilities, and the relationship between them are presented.

• 산업공학
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• 제23권3호
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• pp.205-212
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• 2010

The learning curve model is a mathematical form which represents the relationship between the manufacturing experience and its effectiveness. The semiconductor manufacturing is widely known as an appropriate example for the learning effect due to its complicated manufacturing processes. In this paper, I propose a new compound learning curve model for semiconductor products in which the general learning curve model and the growth curve are composed. The dependent variable and the effective independent variables of the model were abstracted from the existing learning curve models and selected according to multiple regression processes. The simulation results using the historical DRAM data show that the proposed compound learning curve model is one of adequate models for describing learning effect of semiconductor products.

• 반도체디스플레이기술학회지
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• 제9권4호
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• pp.45-50
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• 2010

This paper explores a new approach for modeling of decision-making problems that involve uncertain, time-dependent and sequence-dependent processes which can be applied to semiconductor industry. In the proposed approach, which is based on probability theory, approximate sample paths are required to be specified by probability and statistic characteristics. Completely specified sample paths are seen to be elementary and fundamental outcomes of the related experiment. The proposed approach is suitable for modeling real processes more accurately. A case study is applied to a single item production planning problem with continuous and uncertain demand and the solution obtained by the approximate path specification method shows less computational efforts and practically desirable features. The application possibility and general plan of the proposed approach in semiconductor manufacturing process is also described in the paper.