• 제목/요약/키워드: Semiconductor laser

검색결과 525건 처리시간 0.025초

Development of Wafer Bond Integrity Inspection System Based on Laser Transmittance

  • Jang, Dong-Young;Ahn, Hyo-Sok;Mehdi, Sajadieh.S.M.;Lim, Young-Hwan;Hong, Seok-Kee
    • 마이크로전자및패키징학회지
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    • 제17권2호
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    • pp.29-33
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    • 2010
  • Among several critical topics in semiconductor fabrication technology, particles in addition to bonded surface contaminations are issues of great concerns. This study reports the development of a system which inspects wafer bond integrity by analyzing laser beam transmittance deviations and the variations of the intensity caused by the defect thickness. Since the speckling phenomenon exists inherently as long as the laser is used as an optical source and it degrades the inspection accuracy, speckle contrast is another obstacle to be conquered in this system. Consequently speckle contrast reduction methods were reviewed and among the all remedies have been established in the past 30 years the most adaptable solution for inline inspection system is applied. Simulation and subsequently design of experiments has been utilized to discover the best solution to improve irradiance distribution and detection accuracy. Comparison between simulation and experimental results has been done and it confirms an outstanding detection accuracy achievement. Bonded wafer inspection system has been developed and it is ready to be implemented in FAB in the near future.

Burr Control in Meso-Punching Process

  • Shin Hong Gue;Shin Yong Seung;Kim Byeong Hee;Kim Heon Young
    • Journal of Mechanical Science and Technology
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    • 제19권4호
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    • pp.968-975
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    • 2005
  • The shearing process for the sheet metal is normally used in the precision elements such as semi-conductor components. In these precision elements, the burr formation brings a bad effect on the system assembly and demands the additional de-burring process, so this imposes high cost on manufacturing. In this paper, we have developed the in-situ auto-aligning precision meso-punching system to investigate the burr formation mechanism and ultimately minimize burr. Firstly, we introduced the punch-die contact sensing method to align the punch and the die at initial state prior to the punching process. Secondly, by using the low-price semi-con­ductor laser, burr formed on the edges is measured intermittently during the punching process. We could, finally, make burr on the sheet metal uniformized and minimized by controlling of the precision X - Y table, $1\;{\mu}m$ resolution, and measuring burr height by semiconductor laser. Experimental results show the validity of our system for pursuing the burr-free punched elements.

Improvement of self-mixing semiconductor laser range finder and its application to range-image recognition of slowly moving object

  • Suzuki, Takashi;Shinohara, Shigenobu;Yoshida, Hirofumi;Ikeda, Hiroaki;Saitoh, Yasuhiro;Nishide, Ken-Ichi;Sumi, Masao
    • 제어로봇시스템학회:학술대회논문집
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    • 제어로봇시스템학회 1992년도 한국자동제어학술회의논문집(국제학술편); KOEX, Seoul; 19-21 Oct. 1992
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    • pp.388-393
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    • 1992
  • An infrared range finder using a self-mixing laser diode (SM-LD), which has been proposed and developed by the Authors, can measure not only a range of a moving target but its velocity simultaneously. In this paper, described is that the precise mode-hop pulse train can be obtained by employing a new signal processing circuit even when the backscattered light returning into the SM-LD is much more weaker. As a result, the distance to a tilted square sheet made from aluminium or white paper, which is placed 10 cm through 60 cm from the SM-LD, is measured with accuracy of a few percent even when the tilting angle is less than 75 degrees or 85 degrees, respectively. And in this paper, described is the range-image recognition of a plane object under the condition of standstill. The output laser beam is scanned by scanning two plane mirrors-equipped with each stepping motor. And we succeeded in the acquisition of the range-image of a plane object in a few tens of seconds. Furthermore, described is a feasibility study about the range-image recognition of a slowly moving plane object.

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Cu2ZnSnSe4 Thin Films Preparation by Pulsed Laser Deposition Using Powder Compacted Target

  • Kim, Kyoo-Ho;Wibowo, Rachmat Adhi;Alfaruqi, M.Hilmy;Ahn, Jong-Heon
    • 한국표면공학회지
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    • 제44권5호
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    • pp.185-189
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    • 2011
  • $Cu_2ZnSnSe_4$ thin films for solar absorber application were prepared by pulsed laser deposition of a synthesized $Cu_2ZnSnSe_4$ compound target. The film's composition revealed that the deposited films possess an identical composition with the target material. Further film compositional control toward a stoichiometric composition was performed by optimizing substrate temperature, deposition time and target rotational speed. At the optimum condition, X-ray diffraction patterns of films showed that the films demonstrated polycrystalline stannite single phase with a high degree of (112) preferred orientation. The absorption coefficient of $Cu_2ZnSnSe_4$ thin films were above 104 cm.1 with a band gap of 1.45 eV. At an optimum condition, films were identified as a p type semiconductor characteristic with a resistivity as low as $10^{-1}{\Omega}cm$ and a carrier concentration in the order of $10^{17}cm^{-3}$.

Electrical and Optical Properties of Ga-doped SnO2 Thin Films Via Pulsed Laser Deposition

  • Sung, Chang-Hoon;Kim, Geun-Woo;Seo, Yong-Jun;Heo, Si-Nae;Huh, Seok-Hwan;Chang, Ji-Ho;Koo, Bon-Heun
    • 한국표면공학회지
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    • 제44권4호
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    • pp.144-148
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    • 2011
  • $Ga_2O_3$ doped $SnO_2$ thin films were grown by using pulsed laser deposition (PLD) technique on glass substrate. The optical and electrical properties of these films were investigated for different doping concentrations, oxygen partial pressures, substrate temperatures, and film thickness. The films were deposited at different substrate temperatures (room temperature to $600^{\circ}C$). The best opto-electrical properties is shown by the film deposited at substrate temperature of $300^{\circ}C$ with oxygen partial pressure of 80 m Torr and the gallium concentration of 2 wt%. The as obtained lowest resistivity is $9.57{\times}10^{-3}\;{\Omega}cm$ with the average transmission of 80% in the visible region and an optical band gap (indirect allowed) of 4.26 eV.

폴리머 결합 링 반사기를 이용한 하이브리드 집적 파장 가변 레이저 (Hybrid-integrated Tunable Laser Diode Using Polymer Coupled-ring Reflector)

  • 박준오;이태형;정영철
    • 한국광학회지
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    • 제19권3호
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    • pp.219-223
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    • 2008
  • 광대역 파장 가변 레이저를 구현하기 위하여, 폴리머 결합 링 반사기를 반사형 반도체 광증폭기와 하이브리드 집적하여 광대역 파장 가변 레이저를 구현하였다. 도파로 폭과 높이의 제작 오차로 인하여 방향성 결합기의 결합 비 조합이 설계 값에서 다소 벗어나더라도 단일 피크 조건이 유지되도록 설계함으로써, 제작 수율을 높이도록 하였다. 구현한 파장 가변 레이저는 파장 가변 범위가 35 nm, 부모드 억제 비가 30 dB 이상 보임을 확인하였다.

HIGH TEMPERATURE SUPERCONDUCTING THIN FILMS PREP ARED BY PULSED LASER DEPOSITION

  • Park, Yong-Ki;Kim, In-Seon;Ha, Dong-Han;Hwang, Doo-Sup;Huh, Yun-Sung;Park, Jong-Chul
    • 한국표면공학회지
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    • 제29권5호
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    • pp.430-436
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    • 1996
  • We have grown superconducting thin films on various substrates using a pulsed laser deposition (PLD) method. $YBa_2Cu_3O_7-\delta$ (YBCO) superconducting thin films with the superconducting transition temperature ($T_{c. offset}$) of 87K were grown on Si substrates using yittria-stabilized zirconia (YSZ) and $CeO_2$ double buffer layers. We have developed a large area pulsed laser deposition system. The system was designed to deposit up to 6 different materials on a large area substrate up to 7.5cm in diameter without breaking a vacuum. The preliminary runs of the deposition of YBCO superconducting thin films on $SrTiO_3$ substrate using this system showed a very uniform thickness profile over the entire substrate holder area. $T_{c}$ of the deposited YBCO thin film, however, was scattered depending on the position and the highest value was 85K.

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Laser CVD법에 의한 III-V화합물 반도체 표면의 불활성화 (The passivation of III-V compound semiconductor surface by laser CVD)

  • 이한신;이계신;조태훈;허윤종;김성진;성영권
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1993년도 하계학술대회 논문집 B
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    • pp.1274-1276
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    • 1993
  • The silicon-nitride films formed by laser CVD method are used for passivating GaAs surfaces. The electrical Properties of metal-insulator-GaAs structure are studied to determined the interfacial characteristics by C-V curves and deep level transient spectroscopy(DLTS). The SiN films are photolysisly deposited from $SiH_4\;and\;NH_3$ in the range of $100^{\circ}C-300^{\circ}C$ on P type, (100) GaAs. The hysteresis is reduced and interface trap density is lowered to $10^{12}-10^{13}$ at $100^{\circ}C-200^{\circ}C$. The surface leakage current is studied too. The passivated GaAs have a little leakage current compared to non passivated GaAs.

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편광 유지 광섬유 루프 거울을 이용한 고리형 반도체-광섬유 레이저에서의 다파장 발진 (Multiwavelength generation in semiconductor-fiber ring laser using a polarization maintaining fiber loop mirror)

  • 유봉안;이병호
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2001년도 하계학술대회 논문집 C
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    • pp.1823-1825
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    • 2001
  • 고리형 반도체-광섬유 레이저 공진기 안에 높은 복굴절률을 가지고 있는 편광 유지 광섬유 루프 거울을 삽입하여 새로운 구조의 다파장 발진 시스템을 제안하고 구현하였다. 이득 매질인 반도체 광 증폭기의 특성으로 인해 실온에서 파장 간격이 1 nm 이내인 22 개의 파장의 빛을 발진시킬 수 있었다.

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반도체 레이저에서의 2차 및 3차 비선형 왜곡의 특성 (Fundamental second-order and third-order Nonlinear Distortions in Semiconductor Lasers)

  • 이경식;문용수
    • 전자공학회논문지A
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    • 제31A권5호
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    • pp.18-26
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    • 1994
  • We express fundamental second-order and third- order harmonic distortions and intermodulation distortions in terms of the laser parameters. Compared to the Darcie `s result only limited to the high frequency (f >1GHz), these expression are quite valid in the entire modulation frequency region. It is found that the fundamental nonlinear distortions are strongly effected by the spontaneous emission to lasing mode as well as the gain compresion damping in the low frequency region.

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