• Proceedings of the KIEE Conference
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• 2006.04a
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• pp.342-344
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• 2006

During last years, large investments have been directed to development and research of nano-technological products like semiconductor, display panel, optic-fiber communication components, life technology, and ultra-precision components. All quantitative measurements at nanometre scale should guarantees accurate results and high quality. Laser interferometer is one of most famous nanometre scale devices to be able to measure metre-scale distance with nanometre scale resolution, but it is easily affected by various error causes like geometrical, instrumental and environmental factor. On the other side, capacitive sensor is robust to above error factors, but it is able to measure relatively shorter distance, under $100{\mu}m$, than laser interferometer. New error correction method for laser interferometry using capacitive sensor will be introduced in this paper.

• Proceedings of the KIEE Conference
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• 2007.04a
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• pp.86-88
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• 2007

In the semiconductor manufacturing industry, the heterodyne laser interferometer plays as an ultra-precise measurement system. However, the heterodyne laser interferometer has some unwanted nonlinearity error which is caused from frequency-mixing. This is an obstacle to improve the measurement accuracy in nanometer scale. In this paper we propose a compensation algorithm based on RLS(recursive least square) method and artificial intelligence method, which reduce the nonlinearity error in the heterodyne laser interferometer. With the capacitance displacement sensor we get a reference signal which can be transformed into the intensity domain. Using the back-propagation Neural Network method, we train the network to track the reference signal. Through some experiments, we demonstrate the effectiveness of the proposed algorithm in measurement accuracy.

• Laser Solutions
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• v.4 no.3
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• pp.22-29
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• 2001

A development of new surface clwaning technol ogies such as laser and aerosol in paeallel with the improvement of conventional wet mwthods becomes more essential in semiconductor industry due the confrontation of new challenges such as significant device shrink, environmental foralum inum do not work for copper as a new interconnection material, and more effective cleaning tools are required with decreasing the feature size less than 0.13 ㎛ as well as increasing the wafer size from 200 ㎜ to 300 ㎜. In this article, various cleaning techniques increasing laser cleaning are compared methodolgically hi order to understand their unique characteristics such as advantages and disadvantages according to the current clean ing issues. In particular, the current state of art of laser technique for semiconductors md prospects as a try cleaning method are described.

• Korean Journal of Optics and Photonics
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• v.10 no.6
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• pp.500-506
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• 1999

We designed and fabricated a bidirectional optical transceiver module for low cost access network. An integrated chip forming a pin-PD on an 1.3 urn FP-LD was assembled by flip-chip bonding on a Si optical bench, a single mode fiber with an angled end facet was aligned passively with the integrated chip on V-groove of Si-optical bench. Gaussian beam theory was applied to evaluate the coupling coefficients as a function of some parameters such as alignment distance, angle of fiber end facet, vertical alignment error. The theory is also used to search the bottle-neck between transmittance and receiving coupling efficiency in the bi-directional optical system. Tn this paper, we confirmed that reduction of coupling efficiency by the vertical alignment error between laser beam and fiber core axis can be compensated by controlling the fiber facet angle. In the fabrication of sub-module, a'||'&'||' we made such that the fiber facet have a corn shape with an angled facet only core part, the reflection of transmitted laser beam from the fiber facet could be minimized below -35 dE in alignment distance of 2: 30 /J.m. In the same condition, transmitted output power of -12.1 dEm and responsivity of 0.2. AIW were obtained.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.10a
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• pp.887-890
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• 1997

Recently micromachining using DPSSL(Diode Pumped Solid State Laser) with 3rd harmonic wavelength is actively studied in laser machining area. Micromachining using DPSSL have outstanding advantages as UV source comparing with excimer laser in various aspect such a maintenance cost, maskless machining, high repetition rate and so on. In this study micro-drilling of PCB type substrate which consists of Cu-PI-Cu layer was performed using DPSS Nd:YAG laser(355nm, wavelength) in vector scanning method. Experimental and numerical method(Matlab simulation, FEM) are used to optimize process parameter and control machining depth. The man mechanism of this process is laser ablation. It is known that there is large gap between energy threshold of copper and that of PI. Matlab simulation considering energy threshold of material is performed to effect of duplication of pulse and FEM thermal analysis is used to predict the ablation depth of copper. This study could be widely used in various laser micromachining including via hole microdrilling of PCB, and micromachining of semiconductor components, medical parts and printer nozzle and so on.

• Proceedings of the Optical Society of Korea Conference
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• 2004.07a
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• pp.192-193
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• 2004

• Proceedings of the Optical Society of Korea Conference
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• 2001.08a
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• pp.180-181
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• 2001

• Proceedings of the Optical Society of Korea Conference
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• 1999.08a
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• pp.64-65
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• 1999

• Proceedings of the Optical Society of Korea Conference
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• 2002.11a
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• pp.8-9
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• 2002

• Journal of the Korea Society for Simulation
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• v.18 no.4
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• pp.59-66
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• 2009

This has been possible by integration techniques such as very large scale integration (VLSI) and wafer scale integration (WSI). Redundancy has been extensively used for manufacturing memory chips and to provide repair of these devices in the presence of faulty cells. If there are too many defects, the momory has to be rejected. But if there are a few defects, it will be more efficient and cost reducing for the company to use it by repairing. Therefore, laser-repair process is nedded for such a reason and redundancy analysis is needed to establish correct target of laser-repair process. The proposed CRA (Correlation Repair Algorithm) simulation, beyond the idea of the conventional redundancy analysis algorithm, aims at reducing the time spent in the process and strengthening cost competitiveness by performing redundancy analysis after simulating each case of defect.