• Proceedings of the Safety Management and Science Conference
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• 2009.11a
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• pp.187-201
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• 2009

Semiconductor industry is based on equipment industry and timing industry. In particular, semiconductor process is very complex and as semiconductor-chip width tails and is becoming equipment gradually more as a high technology. Equipment operation is primarily engaged in semiconductor manufacturing (engineers and operator) of being conducted by, equipment errors have also been raised. Equipment operational data related to the error of korea occupational safety and health agency were based on data and production engineers involved in the operator's questionnaire was drawn through the error factor. Equipment operating in the error factor of 9 big item and 36 detail item detailed argument based on the errors down, and 9 big item the equipment during operation of the correlation error factor was conducted. Each of the significance level was correlated with the tabulation and analysis. Using the maximum correlation coefficient, the correlation between the error factors to derive the relationship between factors were analyzed. Facility operating with the analysis of error factors (big and detail item) derive a relationship between the model saw. The end of the operation of the facility in operation on the part of the two factors appeared as prevention. Safety aspects and ergonomics aspects of the approach should be guided to the conclusion.

• Journal of the Semiconductor & Display Technology
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• v.21 no.4
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• pp.126-131
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• 2022

The number of joint disease patients is increasing every year. Currently, the most CPM(Continuous Passive Motion) equipment uses expensive imported equipment, and one CPM equipment is designed to be used only in one joint, medical personnel or hospitals who are the main users of the medical equipment need to have several types of CPMs for joint rehabilitation. To solve this problem, this paper designed a multifunctional joint medical equipment that enables rehabilitation of knee, shoulder, and elbow joints in one CPM equipment and includes general, intensive, and adaptive exercise functions for effective treatment according to the patient's condition. The patient's condition was diagnosed using a load cell and a current sensor. In this paper, effective rehabilitation methods were presented and high reliability and precision of medical equipment was confirmed through experiments using potentiometer, encoder, and PI controller.

• Journal of the Korea Convergence Society
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• v.10 no.11
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• pp.85-93
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• 2019

Despite its matchless position in the global semiconductor industry, Korea has not distinguished itself in the semiconductor equipment sector. Semiconductor cleaning equipment is one of the semiconductor fabrication equipment, and it is expected to be more important along with the advancement of semiconductor fabrication processes. This study attempts to analyze technology competitiveness of major countries in the sector including Korea, and explore specialty sub-areas of the countries. For this purpose, we collected patents of semiconductor cleaning equipment during the last 10 years from the US patent database, and implemented quantitative patent analysis and co-classification network analysis. The result shows that, the US and Japan have been leading the technological progress in this sector, and Korea's competitiveness has lagged behind not only the leading countries but also its competitors and even latecomers. Therefore, intensive R&D and developing technological capabilities are needed for advancing the country's competitiveness in the sector.

• Journal of the Semiconductor & Display Technology
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• v.19 no.4
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• pp.18-21
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• 2020

Undetected wafer slip during the lift pin-down motion in semiconductor equipment may affect the center to edge variation, wafer warpage, and pattern misalignment in plasma equipment. Direct measuring of the amount of wafer slip inside the plasma process chamber is not feasible because of the hardware space limitation inside the plasma chamber. In this paper, we demonstrated a practice for the wafer lift pin-up and down motions with respect to the gear ratio, operating voltage, and pulse width modulation to maintain accurate wafer position using remote control linear servo motor with an experimentally designed chamber mockup. We noticed that the pin moving velocity and gear ratio are the most influencing parameters to be control, and the step-wised position control algorithm showed the most suitable for the reduction of wafer slip.

• Journal of the Semiconductor & Display Technology
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• v.7 no.2
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• pp.39-43
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• 2008

Productivity is one of the performance indices of the semiconductor equipment in manufacturing viewpoint. Among many ways tried and adopted for improvement of the productivity of the FAB equipment, variation of equipment configuration was considered and its effect on the throughput was analyzed. Parallel machine cycle charts that were generated based on the equipment log were used in the analysis. Efficiency of the equipment due to change of the structure and the probability of the usage in the manufacturing process were examined. The results showed that the modification of the control algorithm in the equipment and the redistribution of the process time for each process and transfer module along to the change in the structure enhance the throughput of the equipment.

• Korean Journal of Computational Design and Engineering
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• v.13 no.4
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• pp.273-285
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• 2008

In this paper we propose an engineering bill of materials (E-BOM) copy method that can be utilized to manage the product information for each equipment during building a product lifecycle management (PLM) system in the order-specific semiconductor equipment manufacturer. The previous works studied on an E-BOM creation and management method for the mass manufacturing and production. The method is difficult to apply to an environment in which many engineering changes occur and the different specification to each equipment is required such as semiconductor equipments and facilities adopting built-to-order instead of built for inventory. Moreover the method is known to be the major drawback to deteriorate the design efficiency. Our E-BOM copy method enables users efficiently to manage the specification of a product and shortens the product development cycle. To implement the E-BOM copy method in the PLM environment, we developed the E-BOM copy system that automatically generates new parts and their numbers according to the numbering rule while copying the E-BOM from existing semiconductor equipments and then can apply the parts for reuse to new semiconductor equipments. This system can duplicate not only 3D CAD data but also technical documents.

• Journal of Practical Engineering Education
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• v.7 no.2
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• pp.125-134
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• 2015

The purpose of this study is to develop semiconductor equipment maintenance technician train program for the effective train of professional maintenance technician in the semiconductor industry. To achieve the purpose, both of the actual condition survey and the literature investigation had been proceeded for the prediction of educational train manpower requirements in the field of semiconductor equipment maintenance in and outside the country. In addition, tasks and education contents were also analyzed through job analysis. Based on the result, we suggest that the education program for semiconductor equipment maintenance technician train.

• Journal of the Semiconductor & Display Technology
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• v.18 no.4
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• pp.40-45
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• 2019

The smart factory has developed with the help of several technologies such as automation, artificial intelligence, big data, smart sensors and communication protocols. The Internet of things(IOT) among communication protocols has become the key factor for the seamless integration of various manufacturing equipment. Therefore, it is important that the IOT cooperate with the standards of communication protocols proposed by the SEMI in the semiconductor industry. In this paper, we suggest a novel reference model of the communication protocols for semiconductor equipment by introducing an IOT service layer. With the IOT service layer, we can use the functions and the additional services provided by the IOT standards that give the inter-operability between factory machines and host computers. We implement the standard of the communication protocols for semiconductor equipment with the IOT service layer by using ns3 simulator. It concludes that it is necessary to provide the platform for the IOT service layer to deploy efficiently the proposed reference model of the communication protocols.

• Journal of the Semiconductor & Display Technology
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• v.19 no.2
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• pp.16-21
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• 2020

How accurately reproducible energy is delivered to the wafer in the process of making thin films using PE-CVD (Plasma enhanced chemical vapor deposition) during the semiconductor process. This is the most important technique, and most of the reaction on the wafer surface is made by thermal energy. In this study, we studied the method of monitoring the change of thermal energy transferred to the wafer surface by monitoring the temperature change according to the change of the thin film formed on the showerhead facing the wafer. Through this research, we could confirm the monitoring of wafer thin-film which is changed due to abnormal operation and accumulation of equipment, and we can expect improvement of semiconductor quality and yield through process reproducibility and equipment status by real-time monitoring of problem of deposition process equipment performance.

• Journal of Advanced Navigation Technology
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• v.14 no.3
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• pp.432-438
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• 2010

In this paper, we propose a system which can perceive status of semiconductor equipment and evaluate its performance. The proposed system acquires the information such acceleration, pressure, temperature and gas sensors in the surrounding semiconductor equipment. After acquiring information, it is sent to server through multi hop transmission. The transmitted data generates 3 steps alarm using context-aware algorithm of unit or multiple event. From the experiment's result of the proposed system, we confirm that the reliability and efficiency of information is more improved about 80% than a system that doesn't use context-aware algorithm. Moreover, this system can be effective status monitoring of semiconductor equipment because lots of client nodes acquire surrounding information.