• The Transactions of the Korean Institute of Electrical Engineers C
• /
• v.52 no.2
• /
• pp.74-79
• /
• 2003

The method of the analysis of the base Gummel number of the BJT(Bipolar Junction Transistor) for integrated circuits based upon the semiconductor physics is proposed and the method of calculating the doping profile of the base region using process conditions is presented. The transistor saturation current obtained from the proposed method of NPN BJT using 20V and 30V process shows an averaged relative error of 6.7% compared with the measured data and the transistor saturation current of PNP BJT shows an averaged relative error of 9.2% compared with the measured data

• Journal of the Korean Institute of Telematics and Electronics D
• /
• v.34D no.9
• /
• pp.72-79
• /
• 1997

The dominant physical process repsonsible for the nonlinear gain is from spectral-hole burning with the time constant fo about 50fs and the contribution to the nonlinea rgain form hot carriers effect is determined to be about 15% of the contribution due to spectral-hole burning. To prove the above results we fit the data of hall and found that hot carriers have a profound effect on their experimental data despite the fact that the magnitude of hot carriers effect is only 15% of spectral-hole burning. We suggest that the experimenta with a pump pulse width of 180 fs is very sensitive in detecting the effect of hot carriers, but is not sensitive in detecting much faster process associated with spectral-hole burning.

• Journal of the Korea Society for Simulation
• /
• v.26 no.4
• /
• pp.35-41
• /
• 2017

With the advances in Internet over Things, the demand in diverse electronic devices such as mobile phones and sensors has been rapidly increasing and boosting up the researches on those products. Semiconductor materials, devices, and fabrication processes are becoming more diverse and complicated, which accompanies finding parameters for an optimal fabrication process. In order to find the parameters, a process simulation before fabrication or a real-time process control system during fabrication can be used, but they lack incorporating the feedback from post-fabrication data and compatibility with older equipment. In this research, we have developed an artificial intelligence based simulator, which finds parameters for an optimal process and controls process equipment. In order to apply the control concept to all the equipment in a fabrication sequence, we have developed a prototype for a manipulator which can be installed over an existing buttons and knobs in the equipment and controls the equipment communicating with the AI over the Internet. The AI is based on the deep learning to find process parameters that will produce a device having target electrical characteristics. The proposed simulator can control existing equipment via the Internet to fabricate devices with desired performance and, therefore, it will help engineers to develop new devices efficiently and effectively.

• Korean Journal of Optics and Photonics
• /
• v.19 no.3
• /
• pp.237-241
• /
• 2008

An all-optical encryption system built on the basis of electrical logic circuit design principles is proposed, using semiconductor optical amplifier (SOA) exclusive or (XOR) logic gates. Numerical techniques (steady-state and dynamic) were employed in a sequential manner to optimize the system parameters, speeding up the overall design process. The results from both numerical and experimental testbeds show that the encoding/decoding of the optical signal can be achieved at a 10 Gbps data rate with a conventional SOA cascade without serious degradation in the data quality.

• Proceedings of the KAIS Fall Conference
• /
• 2002.05a
• /
• pp.127-129
• /
• 2002

본 연구는 반도체 및 LCD Photo 공정에서 발생되는 폐액의 재자원화를 위한 공정설계 data와 재자원화 기술의 성능향상을 위한 기초 자료를 제공하는데 있다. 재자원화 증류탑의 설계를 위한 공정모사를 통하여 공정폐액 재자원화의 최적조건을 설계할 수 있는 기초자료를 제안하였다.

• Transactions on Electrical and Electronic Materials
• /
• v.14 no.2
• /
• pp.71-77
• /
• 2013

Advanced semiconductor manufacturing technology requires methods to maximize tool efficiency and improve product quality by reducing process variability. Real-time plasma process monitoring and diagnosis have become crucial for fault detection and classification (FDC) and advanced process control (APC). Additional sensors may increase the accuracy of detection of process anomalies, and optical monitoring methods are non-invasive. In this paper, we propose the use of a chromatic data acquisition system for real-time in-situ plasma process monitoring called the Plasma Eyes Chromatic System (PECS). The proposed system was initially tested in a six-inch research tool, and it was then further evaluated for its potential to detect process anomalies in an eight-inch production tool for etching blanket oxide films. Chromatic representation of the PECS output shows a clear correlation with small changes in process parameters, such as RF power, pressure, and gas flow. We also present how the PECS may be adapted as an in-situ plasma arc detector. The proposed system can provide useful indications of a faulty process in a timely and non-invasive manner for successful run-to-run (R2R) control and FDC.

• JSTS:Journal of Semiconductor Technology and Science
• /
• v.16 no.5
• /
• pp.582-594
• /
• 2016

Various test data compression techniques have been developed to reduce the test costs of system-on-a-chips. In this paper, a scan chain reordering algorithm for code-based test data compression techniques is proposed. Scan cells within an acceptable relocation distance are ranked to reduce the number of conflicts in all test patterns and rearranged by a positioning algorithm to minimize the routing overhead. The proposed method is demonstrated on ISCAS '89 benchmark circuits with their physical layout by using a 180 nm CMOS process library. Significant improvements are observed in compression ratio and test power consumption with minor routing overhead.

• The Journal of Information Systems
• /
• v.26 no.2
• /
• pp.105-121
• /
• 2017

Purpose It is a major goal to improve the product yields during production operations in the manufacturing industry. Therefore, factory is trying to keep the good quality materials and proper production resources, also find the proper condition of facilities and manufacturing environment for yields improvement. Design/methodology/approach We propose the hybrid framework to analyze to dataset extracted from MES. Those data is about the alarm information generated from equipment, both measurement and equipment process value from production and cycle/pitch time measured from production data these covered products during production. We adapt a data warehousing techniques for organizing dataset, a logistic regression for finding out the significant factors, and a association analysis for drawing the rules which affect the product yields. And then we validate the framework by applying the real data generated from the discrete process in secondary cell battery manufacturing. Findings This paper deals with challenges to apply the full potential of modeling and simulation within CPPS(Cyber-Physical Production System) and Smart Factory implementation. The framework is being applied in one of the most advanced and complex industrial sectors like semiconductor, display, and automotive industry.

• Journal of Korean Society of Occupational and Environmental Hygiene
• /
• v.25 no.2
• /
• pp.202-210
• /
• 2015

Objectives: The purpose of this study was to examine clean room(C/R) structure, air conditioning and contamination control systems and to provide basic information for identifying a correlation between the semiconductor work environment and workers' disease. Methods: This study was conducted at 200 mm and 300 mm semiconductor wafer fabrication facilities. The C/R structure and air conditioning method were investigated using basic engineering data from documentation for C/R construction. Furthermore, contamination parameters such as airborne particles, temperature, humidity, acids, ammonia, organic compounds, and vibration in the C/R were based on the International Technology Roadmap for Semiconductors(ITRS). The properties of contamination control systems and the current status of monitoring of various contaminants in the C/R were investigated. Results: 200 mm and 300 mm wafer fabrication facilities were divided into fab(C/R) and sub fab(Plenum), and fab, clean sub fab and facility sub fab, respectively. Fresh air(FA) is supplied in the plenum or clean sub fab by the outdoor air handling unit system which purifies outdoor air. FA supply or contaminated indoor air ventilation rates in the 200 mm and 300 mm wafer fabrication facilities are approximately 10-25%. Furthermore, semiconductor clean rooms strictly controlled airborne particles(${\leq}1,000{\sharp}/ft^3$), temperature($23{\pm}0.5^{\circ}C$), humidity($45{\pm}5%$), air velocity(0.4 m/s), air change(60-80 cycles/hr), vibration(${\leq}1cm/s^2$), and differential pressure(atmospheric pressure$+1.0-2.5mmH_2O$) through air handling and contamination control systems. In addition, acids, alkali and ozone are managed at less than internal criteria by chemical filters. Conclusions: Semiconductor clean rooms can be a pleasant environment for workers as well as semiconductor devices. However, based on the precautionary principle, it may be necessary to continuously improve semiconductor processes and the work environment.

• Journal of Korean Society for Atmospheric Environment
• /
• v.33 no.5
• /
• pp.521-528
• /
• 2017

In the combustion treatment of explosive gases with a high heating value such as $H_2$ and $NH_3$ used in semiconductor and chemical processes, the heat recovery modeling and exergy analysis of the process using the Aspen Plus simulator and its thermodynamic data were performed to examine the recovery of high temperature thermal energy. The heat recovery process was analyzed through this process modeling while the exergy results clearly confirmed that the rigorous reaction mainly occurs in the condenser and the chamber. In addition, the process modeling demonstrated that approximately 95% of the exergy is destructed on the basis of the exergies injected and the exergy being exhausted. Using the exergy technique, which can quantitatively analyze the energy, we could understand the energy flow in the process and confirm that our heat recovery process was efficiently designed.