• International journal of advanced smart convergence
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• v.13 no.2
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• pp.25-34
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• 2024

The paper investigates how the semiconductor and electric vehicle industries are addressing safety and security concerns in the era of autonomous driving, emphasizing the prioritization of safety over security for market competitiveness. Collaboration between these sectors is deemed essential for maintaining competitiveness and value. The research suggests solutions such as advanced autonomous driving technologies and enhanced battery safety measures, with the integration of AI chips playing a pivotal role. However, challenges persist, including the limitations of big data and potential errors in semiconductor-related issues. Legacy automotive manufacturers are transitioning towards software-driven cars, leveraging artificial intelligence to mitigate risks associated with safety and security. Conflicting safety expectations and security concerns can lead to accidents, underscoring the continuous need for safety improvements. We analyzed the expansion of electric vehicles as a means to enhance safety within a framework of converging security concerns, with AI chips being instrumental in this process. Ultimately, the paper advocates for informed safety and security decisions to drive technological advancements in electric vehicles, ensuring significant strides in safety innovation.

• Journal of the Korea Safety Management & Science
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• v.9 no.1
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• pp.197-211
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• 2007

The power of semiconductor, Korea is continuously constructing semiconductor production line for keeping a front-runner status. however, studies and data about potential risks in semiconductor factory are still short. If fire does not initially suppressed, the fire causes a great damage. To decrease fire risk factors, in addition to fire fighting safety equipment, more important thing is how to design and construct fire protection system. The current fire protection codes about semiconductor factory come under functional law, and this law is short of consideration about particularity of factory. The existing prescriptive fire codes depending on experience compose without evident engineering verifications, thus equipments which is created by the current prescriptive fire code may bring about a variety of problems. For example, the design under the current regulation can not cope with the excessive investments, low efficiencies, and the diversifying construction designs and be applied to the quick changes of new technologies. Ergo, an optimal design for fire protection is to equip fire protection arrangements with condition and environment of production field. Manufacturing factory of semiconductors is a windowless airtight space. And for cleanliness, there exists strong flow of cooperation. Therefore, there is a need for fire safety design that meets the characteristic of a clean room. Accordingly, we are to derive smoke flow according to cooperation process within a clean room and construction plan of an optimal sensor system. In this study, in order to confirm the performance of proposed smoke-exhaust equipment and suggest efficient smoke exhaust device when there is a fire of 1MW of methane in the clean room of company H, we have implemented fire simulation using fluid dynamics computation.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.12 no.3
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• pp.36-40
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• 2013

Recently, electronic equipments become smaller, more functional, and more complex than before. As these trends, MLC(multi-layer ceramic) circuit has been emerged to a promising technology in semiconductor inspection industry. Especially, multi-layer ceramic which is consisted of many fine-pitch multi-hole is used to produce a semiconductor inspection unit. The hole is processed by UV laser. But, working conditions are changed all the time. Therefore real time measurement of fine-pitch multi-hole is very important method for ensuring performance. In this paper we found the best method for illuminating and auto focusing. And, we verified our equipment.

• Proceedings of the Korean Institute of Intelligent Systems Conference
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• 2004.04a
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• pp.149-152
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• 2004

Generally the wafer is increased by 300mm. We are desired that the wafer is prevented from pollutions of metal contaminant on surface of wafer. We have to develop new wafer cleaning process of IC Manufacturing that can reduce DI water and chemical by removal of the wafer cleaning process step. Moreover, it is difficult to control temprature and density of chemical in spite of rapidly increasing automation of system. We design smart module controller for new generation of semiconductor wet station with intelligent algorithm using data that is taken by computer simulation for optimal system.

• Journal of the Semiconductor & Display Technology
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• v.22 no.1
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• pp.88-93
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• 2023

In software engineering, requirement analysis is an important task throughout the process and takes up a high proportion. However, factors that fail to analyze requirements include communication failure, different understanding of the meaning of requirements, and failure to perform requirements normally. To solve this problem, we derived actors and behaviors using morpheme analysis and BERT algorithms in the Korean requirement document and constructed them as ontologies. A chatbot system with ontology data is constructed to derive a final system event list through Q&A with users. The chatbot system generates the derived system event list as a requirement diagram and a requirement specification and provides it to the user. Through the above system, diagrams and specifications with a level of coverage complied with Korean requirement documents were created.

• Korean Chemical Engineering Research
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• v.49 no.5
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• pp.560-564
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• 2011

The objective of this study is to propose a mathematical model for a pervaporation process for concentrating hydrogen peroxide. The process was developed by NASA, which consists of a shell and membrane tubes, where a liquid hydrogen peroxide solution flows in the shell, and a sweep gas flows in the tubes countercurrent to each other. The liquid retentate is concentrated as more water molecules permeate and evaporate through the membrane than hydrogen peroxide. For this process, a mathematical model has been developed in the form of a system of nonlinear partial differential algebraic equations based on a sorption-diffusion mechanism for permeation, an Arrhenius relationship for the temperature dependency of the permeate flux, and mass and momentum balances for the liquid concentrations and flows in the membrane module. The dynamic behavior of the concentration of hydrogen peroxide in the retentate side has been simulated by solving a simplified version of the proposed model, and the result is compared with the experimental data reported in the NASA patent.

• Journal of the Korean Institute of Gas
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• v.25 no.5
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• pp.1-10
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• 2021

Semiconductor Photo Resist (PR) automation equipment uses a mixture of several flammable substances, and when it leaks during the process, it can lead to various accidents, therefore, risk assessment is necessary. This study analyzed the frequency of leakage of Acetone and PGMEA used in PR automation equipment and the frequency at which such leakage could lead to a fire accident through the frequency analysis method, and evaluated the need for additional risk reduction measures in the current facility. Based on the process leak data and ignition probability data of IOGP, leak frequency analysis and ignition probability were derived, and the frequency of actual fire accidents was analyzed by combining them. The frequency of material leakage in semiconductor PR process is 7.30E-03/year, and fire accidents can occur by acetone that exists above the flash point when the material is leaked, the frequency was calculated at the level of 1.24E-05/year. According to the UK HSE, for a major accident occurring with a frequency of 1.24E-05/year, it is defined as "Broadly Acceptable", a level that does not require additional measures for risk reduction when it causes 7 or less deaths, and due to the process operated by two people, no additional risk reduction are required.

• Journal of IKEEE
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• v.19 no.4
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• pp.541-547
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• 2015

In current semiconductor manufacturing, as the feature size of integrated circuit (IC) devices continuously shrinks, detecting endpoint in plasma etching process is more difficult than before. For endpoint detection, various kinds of sensors are installed in semiconductor manufacturing equipments, and sensor data are gathered with predefined sampling rate. Generally, detecting endpoint is performed using OES data of by-product. In this study, OES data of both by-product and etchant gas are used to improve reliability of endpoint detection. For the OES data pre-processing, a combination of Signal to Noise Ratio (SNR) and Principal Component Analysis (PCA),are used. Polynomial Regression and Expanded Hidden Markov model (eHMM) technique are applied to pre-processed OES data to detect endpoint.

• Journal of Institute of Control, Robotics and Systems
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• v.19 no.11
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• pp.984-990
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• 2013

Pick and placement systems need high speeds and reliability for the position alignment process of semiconductor packages in picking up and placing them on placement trays. Image processing is usually adopted for position aligning where finding out the most suitable method is considered most important aspect of the process. This paper proposes a method for judging the performance of different image processing algorithms based on the PCI (Process Capability Index). The PCI is an index which represents the error distribution acquired from many experimental data. The bigger the index, the more reliable the results or the lower the deviation. Two compared and candidate methods are Hough Transform and PCA (Principal Component Analysis), both of which are very suitable for oblong or rectangular type packages such as BGA's. Comparing the two approaches through a CPI with enough experimental results leads to the conclusion that the PCA is much better than the Hough Transform in not only reliability, but also processing speed.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.10 no.2
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• pp.79-83
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• 2011

Magnetic seal uses a magnetic fluid to seal a gap between a rotating shaft and housing. It is distinguished from other kinds of seals from the fact that solid contact does not occur in the seal. This implies that it is free from solid rubbing thus dustless and provides a clean circumstance. That is the reason why the magnetic seal is used exclusively for most of vacuum chambers in semiconductor process where dustless clean circumstance is critical. A magnetic seal has been developed of which design parameters are determined based on published data, and an air pressure test has been done to examine its sealing capability. Effects of some design parameters have been studied through FEM analysis. The results show some notable aspects of design parameters and provide suggestions for developing the seals. Regarding the sealing capacity of the magnetic seal the factor to match the theoretical value with the actual one was found to be 0.4~0.7, which means still there is some discrepancy between theory and actual.