• 한국재료학회지
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• 제16권10호
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• pp.629-632
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• 2006

Electrical characteristics of Pt/Ti/Pt/Au and Pd/Zn/Pd/Au contacts to p-type InGaAs grown on an InP substrate have been characterized as a function of the doping concentration and the annealing temperature. The Pt/Ti/Pt/Au contacts produced the specific contact resistance as low as $2.3{\times}10^{-6}{\Omega}{\cdot}cm^2$, when heat-treated at an annealing temperature of $400^{\circ}C$. Comparison of the Pt/Ti/Pt/Au and Ti/Pt/Au contacts showed that the first Pt layer plays an important role in reducing the contact resistivity probably by lowering energy barrier at the metal-semiconductor interface. For the Pd/Zn/Pd/Au contacts, the contact resistivity remained virtually unchanged with increasing annealing temperature. The specific contact resistivity as low as $4.7{\times}10^{-6}{\Omega}{\cdot}cm^2$ was obtained. The results indicate that the Pt/Ti/Pt/Au and Pd/Zn/Pd/Au schemes could be potentially important for the fabrication of InP-based optoelectronic devices, such as photodetector and optical modulator.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 추계학술대회 논문집
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• pp.362-365
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• 2005

Currently Chemical Mechanical Planarization (CMP) has become an essential step in the overall semiconductor wafer fabrication technology. Especially the CMP pad conditioner, one of the diamond tools, is required to have strong diamond retention. Strong cohesion between diamond grits and metal matrix prevents macro scratch on the wafer. If diamond retention is weak, the diamond will be pulled out of metal matrix. The pulled diamond grits are causative of macro scratch on wafer during CMP process. Firstly, some results will be reported of cohesion between diamond grits and metal matrix on the diamond tools prepared by three different manufacturing methods. A measuring instrument with sharp cemented carbide connected with a push-pull gauge was manufactured to measure the cohesion between diamond grits and metal matrix. The retention force of brazed diamond tool was stronger than the others. The retention force was also increased in proportion to the contact area of diamond grits and metal matrix. The brazed diamond tool has a strong chemical combination of the interlayer composed of chrome in metal matrix and carbon which enhance the interfacial cohesion strength between diamond grits and metal matrix. Secondly, we measured real-time data of the coefficient of friction and the pad wear rate by using CMP tester (CETR, CP-4). CMP pad conditioner samples were manufactured by brazed, electro-plated and sintered methods. The coefficient of friction and the pad wear rate were shown differently according to the arranged diamond patterns. Consequently, the coefficient of friction is increased according as the space between diamonds is increased or the concentration of diamonds is decreased. The pad wear rate is increased according as the degree of diamond protrusion is increased.

• 한국결정성장학회지
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• 제28권6호
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• pp.263-270
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• 2018

최근 반도체, 디스플레이 제조장비용 세라믹소재로 대전방지 기능을 가지는 다공성 세라믹스가 시급히 요구되고 있다. 본 연구에서는 다공성 산화티탄-산화망간 기지상에 산화티탄 나노분말을 첨가하여 부분소결함으로써 $10^8-10^{10}$ ohm의 표면저항을 가지고 향상된 기계적 강도를 가지는 다공성 세라믹스를 제조하였다. 나노 크기의 산화티탄 분말을 첨가함으로써 입자 사이의 목 형성을 강화하였고, 그 결과 꺽임강도를 170 MPa(@기공률 15 %), 110 MPa(@기공률 31 %) 수준으로 증가시킬 수 있었다. 이는 P-25를 첨가하지 않았을 때의 꺽임강도(80 MPa @ 기공률 26 %)에 비하여 주목할만큼 증가한 값으로 단순한 기공률 감소가 아닌 목 형성등 미세구조 변화에 따른 것으로 판단된다. 개발 세라믹스를 적용한 OLED 유연소자 제조공정용 공기부상용 모듈을 제작하여 진공척의 성능을 평가하였다.

• 융합정보논문지
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• 제9권5호
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• pp.117-124
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• 2019

본 논문에서는 AMOLED 디스플레이 구동회로로 사용되는 박막트랜지스터의 구성요소 중에서 반도제 물질 제조의 최근 동향에 대해 논한다. 트랜지스터에 적용을 위해 특성이 좋은 반도체 막을 얻는 방법으로 비정질 실리콘을 다결정 실리콘으로 변화시켜야 하는데 레이저와 열처리 방법이 있으며, 레이저를 이용한 기술에는 SLS(Sequential Lateral Solidification), ELA(Excimer Laser Annealing), TDX(Thin-beam Directional Crystallization), 열처리 기술에는 SPC(Solid Phase Crystallization), SGS(Super Grain Silicon), MIC(Metal Induced Crystallization), FALC(Field Aided Lateral Crystallization)가 대표적이며, 이들에 대해 상세히 설명한다. 본 연구실에서 연구중인 레이저 결정화 기술의 대형 AMOLED 디스플레이 제작을 위한 연구 내용도 다룬다.

• Korean Chemical Engineering Research
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• 제59권3호
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• pp.450-454
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• 2021

현재, 감마 핵종 분석은 주로 무기섬광체 또는 반도체 검출기를 활용하여 여러 분야에 사용되고 있다. 이러한 검출기는 분해능이 좋지만 크기가 제한적이며, 가공성이 낮고 경제성이 플라스틱 섬광체보다 낮다. 따라서, 나노물질인 양자점과 플라스틱섬광체의 장점을 이용하여 양자점 나노물질 기반 플라스틱 섬광체를 개발하였다. 가장 많이 활용되고 있는 Cd계열 물질인 CdS/ZnS 양자점을 플라스틱 매트릭스에 교반하여 제작하였으며, 이를 ⁶⁰Co핵종 대상 계측 실험을 하여 상용플라스틱 섬광체의 성능과 비교 분석하였다. 상용플라스틱 섬광체 대비 CdS/ZnS 양자점 기반 플라스틱 섬광체가 20~30% 높은 효율을 보였다. 이는 의료분야뿐만 아니라 원자력 해체분야에서도 방사능 분석기로 활용 가능할 것으로 판단된다.

• 대한금속재료학회지
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• 제49권6호
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• pp.493-497
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• 2011

The basic properties and electrical characteristics of sputtering films deposited with a commercial cast target and spark plasma sintering (SPS) were compared and analyzed. The results, revealed that, the Al film prepared by heating at $60^{\circ}C/min$ (SPS process) showed a specific resistance similar to the commercial cast Al film. In addition, the results of XRD, SIMS and TEM, showed that there was not much difference in the crystal structure and impurities between the two films. Consequently, the SPS Al target was found to have properties quite similar to the commercial one and it is expected to be applied in future research to the metal wiring material for semiconductor/display devices.

• 한국인터넷방송통신학회논문지
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• 제21권3호
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• pp.35-42
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• 2021

초고주파 대역에서 TWTA(Traveling Wave Tube Amplifier)를 대체하기 위한 증폭기 연구가 활발히 이루어지고 있다. 반도체형 소자를 결합하여 높은 출력을 얻는 SSPA(Solid State Power Amplifier)의 경우 상대적으로 낮은 단일 소자의 출력으로 요구 출력을 충족하기 위해서는 저손실, 고효율의 결합 기술이 필요하다. 본 논문을 통해 8-way 도파관 결합기를 설계, 제작하여 20dB 이상의 반사 손실과 85% 이상의 결합 효율을 확인하였다. 전계 분석을 통해 결합기 내부의 임계 전력을 계산하여 안정적인 Power Rating을 확보하였고 전력 모니터링을 위한 커플러를 내장하여 소형화 및 경량화를 이루었다.

• 한국초전도ㆍ저온공학회논문지
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• 제24권3호
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• pp.47-51
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• 2022

With the innovative development of bio, pharmaceutical, and semiconductor technologies, it is essential to demand a next-generation transfer system that minimizes dust and vibrations generated during the manufacturing process. In order to develop dust-free and non-contact transfer systems, the high temperature superconductor (HTS) bulks have been applied as a magnet for levitation. However, sintered HTS bulk magnets are limited in their applications due to their relatively low critical current density (J_c) of several kA/cm² and low mechanical properties as a ceramic material. In addition, during cooling to cryogenic temperatures repeatedly, cracks and damage may occur by thermal shock. On the other hand, the bulk magnets made by stacked HTS tapes have various advantages, such as relatively high mechanical properties by alternate stacking of the metal and ceramic layer, high magnetic levitation performance by using coated conductors with high J_c of several MA/cm², consistent superconducting properties, miniaturization, light-weight, etc. In this study, we tried to fabricate HTS tapes stacked bulk magnets with 60 mm × 60 mm area and various numbers of HTS tape stacked layers for magnetic levitation. In order to examine the levitation forces of bulk magnets stacked with HTS tapes from 1 to 16 layers, specialized force measurement apparatus was made and adapted to measure the levitation force. By increasing the number of HTS tapes stacked layers, the levitation force of bulk magnet become larger. 16 HTS tapes stacked bulk magnets show promising levitation force of about 23.5 N, 6.538 kPa at 10 mm of levitated distance from NdFeB permanent magnet.

• Progress in Superconductivity
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• 제4권1호
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• pp.1-9
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• 2002

Transferring single flux quanta across a Josephson junction at an exactly determined rate has made highly precise voltage measurements possible. Making use of self-shunted Nb-based SINIS junctions, programmable fast-switching DC voltage standards with output voltages of up to 10 V were produced. This development is now extended from fundamental DC measurements to the precise determination of AC voltages with arbitrary waveforms. Integrated RSFQ circuits will help to replace expensive semiconductor devices for frequency control and signal coding. Easy-to-handle AC and inexpensive quantum voltmeters of fundamental accuracy would be of interest to industry. In analogy to the development in the flux regime, metallic nanocircuits comprising small-area tunnel junctions and providing the coherent transport of single electrons might play an important role in quantum current metrology. By precise counting of single charges these circuits allow prototypes of quantum standards for electric current and capacitance to be realised. Replacing single electron devices by single Cooper pair circuits, the charge transfer rates and thus the quantum currents could be significantly increased. Recently, the principles of the gate-controlled transfer of individual Cooper pairs in superconducting A1 devices in different electromagnetic environments were demonstrated. The characteristics of these quantum coherent circuits can be improved by replacing the small aluminum tunnel Junctions by niobium junctions. Due to the higher value of the superconducting energy gap ($\Delta_{Nb}$ ＝ $7\Delta_{Al}$), the characteristic energy and the frequency scales for Nb devices are substantially extended as compared to A1 devices. Although the fabrication of small Nb junctions presents a real challenge, the Nb-based metrological devices will be faster and more accurate in operation. Moreover, the Nb-based Cooper pair electrometer could be coupled to an Nb single Cooper pair qubit which can be beneficial for both, the stability of the qubit and its readout with a large signal-to-noise ratio..

• 마이크로전자및패키징학회지
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• 제30권3호
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• pp.73-77
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• 2023

본 연구에서는 서로 다른 강유전성 물질을 활용하여 Multi-level FeRAM (Ferroelectrics random access memory) 소자에 대한 구조를 제시하였으며, 이를 검증하기 위해 Simulation을 통한 C-V 분석을 수행하였습니다. Multi-level 소자를 구현하기 위해 두 가지 서로 다른 물성을 가진 강유전체를 동일한 하부 전극 위에 나란히 증착하고, 이후 게이트 전극을 위에 올린 MFM (Multi-Ferroelectric Material) 구조를 제안하였습니다. 두 강유전체가 서로 다른 전압 조건에서 분극 현상 (Polarization)을 나타내는 것을 바탕으로, 두 개의 물질 중 한 개만 polarization 되었을 때와 두 개 모두 polarization 되었을 때의 상황을 C-V peak 분석을 통해 확인하여 Multi-level 동작을 구현할 수 있음을 확인하였습니다. 더불어, 제시한 구조를 반도체 제조 공정을 활용하여 구현하는 방법을 공정 simulation을 통해 검증하였습니다. 이러한 결과는 하나의 메모리 셀에서 여러 상태 값을 저장할 수 있음을 의미하며, 이는 메모리의 집적도를 크게 향상시킬 수 있는 새로운 구조체로서의 가능성을 의미합니다.