• Proceedings of the KIPE Conference
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• 2002.07a
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• pp.589-592
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• 2002

The CCM (Continuous Conduction Mode) boost topology is generally used in the PFC (Power Factor Correction) regulator of household air-conditioning systems. There are three kinds of power devices-bridge rectifier diodes, FRDs (Fast Recovery Diodes), and IGBTs (or MOSFETs) - used In a boost PFC regulator. Selecting the appropriate device is very cumbersome work, specially, in the case of FRDs and IGBTs, because there are several considerations as described below: 1) High frequency leakage current regulation (conducted and radiated EMI regulation) 2) Power losses and thermal design 3) Device cost. It should be noted that there are trade-offs between the power loss characteristic of 2) and the other characteristics of 1) and 3). This paper presents a detailed evaluation by using several types of power devices, which can be unintentionally used, to show that optimal selection can be achieved. Based on the given thermal resistances, thermal analysis and design procedures are also described from a practical viewpoint.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.11
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• pp.1056-1060
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• 2005

We investigated the fabrication and characteristics of the nitride-based spin-polarized LEDs with room-temperature ferromagnetic (Ga,Mn)N layer as a spin injection source. The (Ga,Mn)N thin films having room-temperature ferromagnetic ordering were found to exhibit the negative MR and anomalous Hall resistance up to room temperature, revealing the existence of spin-polarized electrons in (Ga,Mn)N films at room temperature. The electrical characteristics in the spin LEDs did not degraded in spite of the insertion of the (Ga,Mn)N layer into the LED structure. In EL spectra of the spin LEDs, it is confirmed that the devices produce intense EL emission at 7 K as well as room temperature. These results are expected to open up new opportunities to realize room-temperature operating semiconductor spintronic devices.

• Proceedings of the Materials Research Society of Korea Conference
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• 2012.05a
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• pp.63.1-63.1
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• 2012

In recent years, the functional inks for printed electronics that can be combined with a variety of printing techniques have attracted increasingly significant interest for use in low cost, large area, high performance integrated electronics and microelectronics. In particular, the development of solution-processable conductor, semiconductor and insulator materials is of great importance as such materials have decisive impacts on the electrical performance of various electronic devices, and, therefore, need to meet various requirements including solution processability, high electrical performance, and environmental stability. Semiconductor inks such as IGO, CIGS are synthesized by chemical solution method and microwave reaction method for TFT and solar cell application. Fine circuit pattern with high conductivity, which is valuable for flexible electrode for PCB and TSP devices, can be printed with highly concentrated and stabilized conductor inks such as silver and copper. Solution processed insulator such as polyimide derivatives can be use to all printed TFT device. Our research results of functional inks for printed electronics provide a recent trends and issues on this area.

• Fire Science and Engineering
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• v.10 no.2
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• pp.28-39
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• 1996

A recently developed electro-thermal simulation methodology is used to analyze the behavior of a PWM(Pulse-Width-Modulated) voltage source inverter which uses IGBT(Insulated Gate Bipolar Transistor) as the switching devices. In the electro-thermal network simulation methdology, the simulator solves for the temperature distribution within the power semiconductor devices(IGBT electro-thermal model), control logic circuitry, the IGBT gate drivers, the thermal network component models for the power silicon chips, package, and heat sinks as well as the current and voltage within the electrical network. The thermal network describes the flow of heat form the chip surface through the package and heat sink and thus determines the evolution of the chip surface temperature used by the power semiconductor device models. The thermal component model for the device silicon chip, packages, and heat sink are developed by discretizing the nonlinear heat diffusion equation and are represented in component from so that the thermal component models for various package and heat sink can be readily connected to on another to form the thermal network.

• Journal of the Semiconductor & Display Technology
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• v.20 no.1
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• pp.113-117
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• 2021

A composite active layer was designed based on graphene quantum dots, which is a low-dimensional structure, and a heterogeneous active layer of graphene quantum dots was applied to the interfacial defect structure to overcome the limitations. Increasing to 1.5~3.5 wt % PVP GQD, Vf changed from 2.16 ~ 2.72 V. When negative deflection is applied to the lower electrode, electrons travel through the HfOx/ITO interface. The Al + ions are reduced and the device dominates at low resistance. In addition, as the PVP GQD concentration increased, the depth of the interfacial defect decreased, and the repetition of appropriate electrical properties was confirmed through Al and HfOx/ITO. The low interfacial defects help electrophoresis of Al+ ions to the PVP GQD layer and the HfOx thin film. A local electric field increase occurred, resulting in the breakage of the conductive filament in the defect.

• Electronics and Telecommunications Trends
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• v.38 no.3
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• pp.86-97
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• 2023

The outbreak of the novel coronavirus disease in 2020 caused a global semiconductor supply shortage and disruption in the production of devices such as iPhones owing to China's quarantine lockdown. Thus, Apple is diversifying its production bases from China to countries like India and Vietnam. The company is also accelerating semiconductor development to guarantee a stable supply, reduce design costs, and customize semiconductors with high quality and outstanding specifications for their products to outperform devices that use general-purpose semiconductors. Following the mobile application processor, Apple is releasing world-class semiconductors, such as the M1 and M2 chips that play the role of central processing units.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.37 no.4
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• pp.451-456
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• 2024

Organic photovoltaic (OPV) devices have attracted attention due to their high efficiency and simple manufacturing process. Applying an overlayer to OPV devices is one way to improve their performance because it can improve charge extraction and suppress vertical phase separation. In addition, dichloromethane (DCM) was used as an orthogonal solvent to minimize the effect on other layers. However, an coating problems due to the use of DCM were found, which affects surface morphology as rough or peeling. Additional research efforts are needed to solve these problems, and optimal results are expected to be obtained by utilizing various buffer layers or selective organic solvents.

• Journal of Magnetics
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• v.11 no.2
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• pp.83-86
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• 2006

Controlling magnetic domains in soft underlayer (SUL) of perpendicular magnetic recording (PMR) is an important issue for the application of PMR in HDD. We studied the magnetic domain structures in SUL using the finite element based micromagnetic simulation (FEMM) for the SUL models with different thicknesses. The purpose is to simulate the magnetic domain wall noise when the SUL thickness and saturation magnetization are changed. The simulation results show that a 15 nm SUL forms simpler Neel wall domain wall pattern and 40 nm SUL forms complex Bloch wall. To visualize the effect of these domain walls stray field at a read sensor position, the magnetic stray field of the domain walls at air bearing surface (ABS) which is 50 nm above the SUL was simulated and the results imply that Bloch walls have stronger stray field with more complicated field patterns than Neel walls and this becomes a significant noise source. Therefore, the thickness of the SUL should be controlled to avoid the formation of Bloch walls.

• ETRI Journal
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• v.27 no.3
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• pp.319-325
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• 2005

In this paper the effect of temperature on the electrical properties of organic semiconductor disperse orange dye 25 (OD) have been examined. Thin films of OD have been deposited on $In_{2}O_{3}$ substrates using a centrifugal machine. DC current-voltage (I-V) characteristics of the fabricated devices $(Al/OD/In_{2}O_{3)$ have been evaluated at varying temperatures ranging from 40 to $60^{\circ}C$. A rectification behavior in these devices has been observed such that the rectifying ratio increases as a function of temperature. I-V characteristics observed in $Al/OD/In_{2}O_{3)$ devices have been classified as low temperature $({\leq} 50^{\circ}C)$ and high temperature characteristics (approximately $60^{\circ}C$). Low temperature characteristics have been explained on the basis of the charge transport mechanism associated with free carriers available in OD, whereas high temperature characteristics have been explained on the basis of the trapped space-charge-limited current. Different electrical parameters such as traps factor, free carrier density, trapped carrier density, trap density of states, and effective mobility have been determined from the observed temperature dependent I-V characteristics. It has been shown that the traps factor, effective mobility, and free carrier density increase with increasing values of temperature, whilst no significant change has been observed in the trap density of states.

• Journal of Sensor Science and Technology
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• v.22 no.3
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• pp.233-237
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• 2013

We fabricated electrolyte-insulator-semiconductor (EIS) devices using a solution process and measured the sensing properties of EIS devices according to the thicknesses of sensing membrane. For high pH sensitivity and better stability properties, we used $SiO_2/HfO_x$ (OH) layer as a sensing membrane. In this work, $HfO_x$ sensing membranes were deposited on 5 nm thick $SiO_2$ buffer layer by spin coater with thicknesses of 15, 31, 42, 55 nm, respectively. As a result, we founded that the thickness of $HfO_x$ sensing membrane affects to sensitivity and chemical stability of EIS device. Especially, the EIS device with 42 nm thick $HfO_x$ membrane showed superior sensing ability in terms of pH-sensitivity, linearity, hysteresis voltage and drift rate characteristics than the other devices. In conclusion, we confirmed that it is possible to improve the sensing ability and the chemical stability properties using optimized thickness of sensing membrane and proper annealing process.