• Applied Chemistry for Engineering
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• v.30 no.6
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• pp.737-741
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• 2019

A low-cost and flexible potassium ion (K⁺) sensor was fabricated through a screen-printed process. Uniform and conformal coating of conductive inks was verified by scanning electron microscopy and optical microscopy measurements. The K⁺-sensors showed a high sensitivity, fast response time, and low detection limit. The sensitivity of K⁺-sensor was similar to that of both mechanically normal and bent states. The K⁺-sensor exhibited a good reproducibility with no hysteresis effect and excellent long term stability. In addition, the K⁺-sensor showed an excellent selectivity for K⁺ concentrations in the presence of other interfering cation ions. Successful measurements of K⁺ concentrations in sports drink samples were demonstrated by comparing K⁺ concentration values from K⁺-sensor to those of using a commercial K⁺-meter.

• Journal of the Korean Ceramic Society
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• v.51 no.4
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• pp.362-366
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• 2014

Dye-sensitized solar cells (DSSCs) were synthesized using a $0.25cm^2$ area of a $TiO_2$ nanoparticle layer as the electrode and platinum (Pt) as the counter electrode. The $TiO_2$ nanoparticle layers (12 to 22 ${\mu}m$) were screen-printed on fluorine-doped tin oxide glass. Glancing angle X-ray diffraction results indicated that the $TiO_2$ layer is composed of pure anatase with no traces of rutile $TiO_2$. The Pt counter electrode and the ruthenium dye anchored $TiO_2$ electrode were then assembled. The best photovoltaic performance of DSSC, which consists of a $18{\mu}m$ thick $TiO_2$ nanoparticle layer, was observed at a short circuit current density ($J_{sc}$) of $14.68mA{\cdot}cm^{-2}$, an open circuit voltage ($V_{oc}$) of 0.72V, a fill factor (FF) of 63.0%, and an energy conversion efficiency (${\eta}$) of 6.65%. It can be concluded that the electrode thickness is attributed to the energy conversion efficiency of DSSCs.

• Applied Chemistry for Engineering
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• v.32 no.4
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• pp.403-408
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• 2021

In this study, a thin and flexible planar supercapacitor (PSC) was fabricated by coating polyaniline (PANI) on a screen-printed carbon electrode. Carbon ink was coated onto the flexible polyethylene terephthalate using a screen-printing method; subsequently, a thin film of PANI was coated onto the carbon surface using a dilute polymerization method. A thin flexible PANI electrode in an interdigitated structure was assembled with a polymer gel electrolyte that resulted in planar-shaped supercapacitor (PSC) devices. The as-obtained PANI/PSC was very thin and flexible, exhibiting a high areal capacitance of 409 µF/cm was obtained at a rate of 10 mV/s. This capacitance retains 46% of its original value at 500 mV/s. The flexible PANI/PSC exhibited an excellent capacitance retention of 82% even under bent states of 180° and 100 repetitive bent cycles.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.24 no.12
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• pp.1010-1017
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• 2011

The use of plated front contact for metallization of silicon solar cell may alternative technologies as a screen printed and silver paste contact. This technologies should allow the formation of contact with low contact resistivity a high line conductivity and also reduction of shading losses. A selective emitter structure with highly dopes regions underneath the metal contacts, is widely known to be one of the most promising high-efficiency solution in solar cell processing. When fabricated Ni/Cu plating metallization cell with a selective emitter structure, it has been shown that efficiencies of up to 18% have been achieved using this technology.

• Journal of electromagnetic engineering and science
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• v.17 no.3
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• pp.159-164
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• 2017

This article proposes a design of chipless RFID tag with dipole array structure that is fully printable using conductive ink. The proposed tags encode data based on spectral signature modulations. The reading range is considerably increased (2 m) while maintaining low transmission power (1 mW). Several prototype chipless RFID tags were fabricated and measured in the SHF and UHF bands. The proposed dipole array structure enhances the antenna gain of the passive tags and contributes to overcoming the low conductivity of conductive ink. In order to verify the utility of our proposal, the tags are manufactured on paper, using conductive ink, for the purpose of economic mass production.

• Journal of Electrochemical Science and Technology
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• v.8 no.4
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• pp.307-313
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• 2017

In this paper we report an electrochemical sensor based on ZnO-functionalized graphene oxide nanocomposite (ZnO-GO) for the sensitive determination of the cabergoline. Cabergoline electrochemical behaviors were investigated by cyclic voltammetry (CV), chronoamperometry (CHA) and differential pulse voltammetry (DPV). The modified electrode shows electrocatalytic activity toward cabergoline oxidation in phosphate buffer solution (PBS) (pH 7.0) with a reduction of the overpotential of about 180 mV and an increase in peak current. The DPV data showed that the obtained anodic peak currents were linearly dependent on the cabergoline concentrations in the range of $1.0-200.0{\mu}M$, with the detection limit of $0.45{\mu}M$. The prepared electrode was successfully applied for the determination of cabergoline in real samples.

• IE interfaces
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• v.10 no.1
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• pp.223-235
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• 1997

The process of determining the optimal tool path in PCB(printed circuit board) drilling operations is identical with that of solving a TSP(traveling salesman problem). However, the optimal solution will be ruined when a drill bit needs tracking back in its tool paths. The back tracking occurrences shorten a life of the main spindle and result in inaccurate mechanical movements. In this study, the performances of four heuristics(Nearest Neighbor, Convex Hull, Greatest Angle and Most Eccentric Ellipse) are evaluated to obtain feasible tool paths along with less number of back trackings for a large number of holes(more than 2000holes/bit) and to generate corresponding NC codes for a given CNC drill. Also, the operations of these algorithms are visualized to show a user the graphic image of tool visitation with PCB holes on a computer screen.

• Journal of the Korean Graphic Arts Communication Society
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• v.15 no.2
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• pp.117-130
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• 1997

Studies have been conducted to explore thermal imidization of polyamic acid. Aromatic polyimides are well recognized as high temperature linear polymers, and polyimide are used as structural materials, fibers, and adhesive. Two different kinds of polyimide were prepared by theimidization of polyamic acid which were synthesized from 2,2-bis[4-(4-aminophenoxy)phenyl]- hexafluoropropane, 2,2-bis [4-(4-aminophenxy)phenyl] - hexamethylpropane and caprolactam and pyromelliti dianhydride under N-Methly-pyrrolidinone solvent. Polyamic acids were converted to polyimides containing imide bond by thermal imidization. The weight 50% loss temperatures of polyimide by TGA thermogram were recorded in the range of 700 ~ 720$^{\circ}$C in nitrogen gas. According, as a results, we conclued polyamic acid were cycliation after H2O molecule separationed, and this polyimide film could be used for Printed Circuit Boand.

• Transactions on Electrical and Electronic Materials
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• v.6 no.4
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• pp.140-143
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• 2005

Carbon Nanotube(CNTs) counter electrode is a promising alternative to Platinum counter electrode for dye sensitized solar cells (DSSCs). In this study, CNT counter electrodes having different visible light transmittance were prepared on fluorine-doped tin oxide (FTO) glass surface by spray coating method. Microstructural images show that there are CNT-tangled region coated on FTO glass counter electrodes. Using such CNT counter electrodes and screen printed $TiO_2$ electrodes, DSSCs were assembled and its I-V characteristics have been studied and compared. Light energy conversion efficiency of DSSCs increased with decreasing in light transmittance of CNT counter electrode. Efficiency of DSSCs having CNT counter electrode is compatible to that of Pt counter electrode.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1993.11a
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• pp.49-54
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• 1993

This paper discusses the reliability of solder joints of electronic devices on printed circuit board. Solder application is usually done by screen printing method for the bonding between outer leads of devices and thick film(Ag/Pd) pattern on Hybrid IC as wel1 as Cu lands on PCB. As result of thermal stresses generated at the solder joints due to the differences of thermal expansion coefficients between packge body and PCB, Micro cracking often occurs due to thermal fatigue failure at solder joints. The initiation and the propagate of solder joint crack depends on the environmental conditions, such as storage temperature and thermal cycling. The principal mechanisms of the cracking pheno- mana are the formation of kirkendal void caused by the differences in diffusion rate of materials, ant the thermal fatigue effect due to the differences of thermal expansion coefficient between package body and PCB. Finally, This paper experimentally shows a way to supress solder joints cracks by using low-${\alpha}$ PCB and the packages with thin lead frame, and investigates the phenomena of diffusion near the bonding interfaces.