• Korean Journal of Materials Research
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• v.12 no.9
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• pp.750-760
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• 2002

In this study, three solders, Sn-37Pb, Sn-3.5Ag, and Sn-3.8Ag-0.7Cu were screen printed on both electroless Ni/Au and OSP metal finished micro-via PCBs (Printed Circuit Boards). The interfacial reaction between PCB metal pad finish materials and solder materials, and its effects on the solder bump joint mechanical reliability were investigated. The lead free solders formed a large amount of intermetallic compounds (IMC) than Sn-37Pb on both electroless Ni/Au and OSP (Organic Solderabilty Preservatives) finished PCBs during solder reflows because of the higher Sn content and higher reflow temperature. For OSP finish, scallop-like $Cu_{6}$ /$Sn_{5}$ and planar $Cu_3$Sn intermetallic compounds (IMC) were formed, and fracture occurred 100% within the solder regardless of reflow numbers and solder materials. Bump shear strength of lead free solders showed higher value than that of Sn-37Pb solder, because lead free solders are usually harder than eutectic Sn-37Pb solder. For Ni/Au finish, polygonal shaped $Ni_3$$Sn_4$ IMC and P-rich Ni layer were formed, and a brittle fracture at the Ni-Sn IMC layer or the interface between Ni-Sn intermetallic and P-rich Ni layer was observed after several reflows. Therefore, bump shear strength values of the Ni/Au finish are relatively lower than those of OSP finish. Especially, spalled IMCs at Sn-3.5Ag interface was observed after several reflow times. And, for the Sn-3.8Ag-0.7Cu solder case, the ternary Sn-Ni-Cu IMCs were observed. As a result, it was found that OSP finished PCB was a better choice for solders on PCB in terms of flip chip mechanical reliability.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07b
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• pp.1092-1095
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• 2005

The effect of the dielectric constant (${\varepsilon}$) of bonding materials in screen-printed carbon nanotube cathode on field enhancement factor was investigated using the ANSYS software for high-efficient CNT-cathodes. The field enhancement factor increased with decreasing the dielectric constant and reaching a maximum value when the dielectric constant is 1, the value for a vacuum. This indicates that the best bonding materials for screen-printing CNT cathodes should have a low dielectric constant and this can be used as criteria for selecting bonding materials for use in CNT pastes for high-efficient CNT-cathodes

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.1386-1389
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• 2006

In this study, a plasma flat fluorescent lamp having a new structure was fabricated by screen printing technique. Coplanar types of silver electrodes with a dielectric layer were screen-printed on a rear glass plate, and then fired at $550^{\circ}C$ and $580^{\circ}C$, respectively. Phosphor was spin-coated on the dielectric layer with firing at $490^{\circ}C$. Several types of lamps were designed and its properties wee investigated with electrode shape, gas pressure, etc.

• Journal of Information Display
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• v.12 no.4
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• pp.213-217
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• 2011

Printing technologies were applied to fabricate a flexible organic thin-film transistor (OTFT) backplane for electrophoretic displays (EPDs). Various printing processes were adopted to maximize the figures of each layer of OTFT: screen printing combined with reverse offset printing for the gate electrodes and scan bus lines with Ag ink, inkjet for the source/drain electrodes with glycerol-doped Poly (3,4-ethylenedioxythiophene): Poly (styrenesulfonate) (PEDOT:PSS), inkjet for the semiconductor layer with Triisopropylsilylethynyl (TIPS)-pentacene, and screen printing for the pixel electrodes with Ag paste. A mobility of $0.44cm^2/V$ s was obtained, with an average standard deviation of 20%, from the 36 OTFTs taken from different backplane locations, which indicates high uniformity. An EPD laminated on an OTFT backplane with $190{\times}152$ pixels on an 8-in panel was successfully operated by displaying some patterns.

• Journal of Korea Multimedia Society
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• v.23 no.2
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• pp.361-367
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• 2020

This study analyzed the factors consisting moving poster design. In order to analyze the elements of moving poster, the researcher reorganized the elements of moving posters by referring to the previous studies on printed posters, motion graphics and works of moving posters. In this study, moving poster components were classified into 'communication', 'visual and form', and 'sound'. In 'communication' section, moving posters had narrative elements, including scenes, because of the time and movement added by the poster's original function. The 'visual and form' section was classified into graphics, layouts, movement, and time. Graphics refered to various graphic objects constituting the screen such as photo, illustration, typography, color, diagram. Layout means screen layout, size, and orientation of the screen. Movement section was divided into 'subject of movement' and 'attributes of movement'. Time was classified physical time such as playing time and subjective time felt by the audience. Also, the researcher categorized 'sound' as an additional section, since most moving posters did not include sound.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.391-391
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• 2011

Crystalline silicon solar cell을 양산에 적용하기 위해 전면 전극의 패턴을 형성하는 방법으로 Ag paste를 이용한 screen printing이 가장 일반적으로 사용된다. 전면 전극의 패턴 형성 시, Finger의 width와 spacing은 Fill factor, JSC, VOC 등 태양전지의 중요 parameter들과 관련되어, 효율에 영향을 미치기 때문에, printing 시 Finger width와 spacing을 최적화하여 최대한의 효율을 내는 조건을 찾는 것이 바람직하다. 본 연구에서는 Finger width를 $30{\mu}m{\sim}100{\mu}m$, spacing을 $1.8{\mu}m{\sim}2.8{\mu}m$ 까지 가변하여 c-Si solar cell을 제작하였으며, 제작된 cell의 LIV를 측정을 통하여, 최적의 효율을 내는 조건을 찾고자 하였다. 그 결과 Finger width $30{\mu}m$, Finger spacing $1.8{\mu}m$의 조건에서 17.12%로 최고의 효율을 나타내었다.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.1486-1489
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• 2009

Micro wall is fabricated using iterative screen printing that it is able to fabricate the pattern as low cost, simple process, formation of pattern at large area on the various substrates. In the process of micro wall fabrication using screen printing, the printing result with pressure change in process and improvement of surface roughness using hydrophillic plasma treatment are included. Height of micro wall increase linearly and precision of iteration is very high. Error rate of printed pattern width is very high, but change rate of width is under 10 %. Fabricated micro pattern have minimum width $48.75{\mu}m$ and maximum height $75.45{\mu}m$ with aspect ratio 1.55.

• Journal of the Korean Society for Precision Engineering
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• v.30 no.6
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• pp.589-595
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• 2013

Solution processed conjugated molecules enable to manufacture various electronic devices by unconventional and cost effective patterning methods as screen or gravure printing. Spin-coating is the most popularly used method to form conjugated polymeric film for various electronic devices. The coating method has certain disadvantages such as a large amount of unwanted wastes, difficulty forming a film with a large area, and impossible to apply roll-to-roll manufacturing. We present here a promising alternative coating method, bar-coating for conjugated polymer film and OLED with the bar coated light emitting layer. In this papers, we show atomic force microscope images of spin- and bar-coated Poly[(9,9-di-n-octylfluorenyl-2,7-diyl)-alt-(benzo[2,1,3]thiadiazol-4,8-diyl)] (F8BT) films on substrate. The bar-coated film showed a slight lower RMS roughness (1.058 [nm]) than spin-coated film (1.767 [nm]). It means the bar-coating is suitable method to form light emitting layers in OLEDs. By using bar-coating process, an OLED obtained with 4.7 [cd/A] in maximum current efficiency.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.6
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• pp.353-358
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• 2016

In this paper, we have studied about the optimum fabrication condition of the printed Indium Tin Oxide (ITO) layers for the electrical resistance-type sensor application. We have investigated on the substrates surface treatments, mixing ratio of organic binder/ITO powder, and viscosity of the printing paste to determine the optimum condition of the screen printed ITO layer. Also, we found that the printing condition is closely related with the sensor performance. To know the feasibility of printed ITO layer as an electrical resistance-type sensor, we have fabricated the ITO sensors with a printed and sputtered ITO layers. The printed ITO films revealed $10^2$ times higher sensitivity than the sputtered ITO layer. Also, the sputtered ITO layer exhibited an operating temperature of $127^{\circ}C$ at the operating voltage of 5 V. While, in case of the printed ITO layer showed the operating temperature of $27.6^{\circ}C$ in high operating voltage of 30 V. We found that the printed ITO layer is suitable for the various sensor applications.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.59-64
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• 2022

Effects of film stack structure and peeling rate on the peel strength of screen-printed (SP) Ag/polyimide (PI) systems were investigated by a 90° peel test. When PI film was peeled at PI/SP-Ag and PI/SP-Ag/electroplated (EP) Cu structures, the peel strength was nearly constant regardless of the peeling rate. When EP Cu was peeled at EP Cu/SP-Ag/PI structure, the peel strength continuously increased as peeling rate increased. Considering uniaxial tensile test results of EP Cu/SP-Ag film with respect to loading rate, the increase of 90° plastic bending energy and peel strength was attributed to increased flow stress and toughness. On the other hand, viscoelastic PI film showed little variation of flow stress and toughness with respect to loading rate, which was assumed to result in nearly constant 90° plastic bending energy and peel strength.