• Title/Summary/Keyword: Science and Engineering

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Measurement and removal of a cerenkov light in a plastic optical fiber to detect a scintillating light (섬광검출을 위한 플라스틱광섬유에서의 체렌코프 빛 측정 및 제거)

  • Cho, Dong-Hyun;Jang, Kyoung-Won;Yoo, Wook-Jae;Shin, Sang-Hun;Lee, Bong-So;Park, Byung-Gi;Cho, Hyo-Sung;Kim, Sin
    • Journal of Sensor Science and Technology
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    • v.17 no.2
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    • pp.100-105
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    • 2008
  • The objectives of this study are to measure and to remove Cerenkov lights generated in a fiber-optic radiation sensor by a charge-coupled device. we have fabricated a fiber-optic radiation sensor which comprises an organic scintillator, a plastic optical fiber and a charge-coupled device. Charge-coupled device as a light measuring tool has many advantages which are easy in multi-dimensional measurements, high spatial resolution and relatively low cost.

Characterization of the Manufacturing Process and Mechanical Properties of CoCrFeMnNi High-Entropy Alloys via Metal Injection Molding and Hot Isostatic Pressing

  • Eun Seong Kim;Jae Man Park;Do Won Lee;Hyojeong Ha;Jungho Choe;Jaemin Wang;Seong Jin Park;Byeong-Joo Lee;Hyoung Seop Kim
    • Journal of Powder Materials
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    • v.31 no.3
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    • pp.243-254
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    • 2024
  • High-entropy alloys (HEAs) have been reported to have better properties than conventional materials; however, they are more expensive due to the high cost of their main components. Therefore, research is needed to reduce manufacturing costs. In this study, CoCrFeMnNi HEAs were prepared using metal injection molding (MIM), which is a powder metallurgy process that involves less material waste than machining process. Although the MIM-processed samples were in the face-centered cubic (FCC) phase, porosity remained after sintering at 1200℃, 1250℃, and 1275℃. In this study, the hot isostatic pressing (HIP) process, which considers both temperature (1150℃) and pressure (150 MPa), was adopted to improve the quality of the MIM samples. Although the hardness of the HIP-treated samples decreased slightly and the Mn composition was significantly reduced, the process effectively eliminated many pores that remained after the 1275℃ MIM process. The HIP process can improve the quality of the alloy.

Design Education Methodology in Computer Science and Engineering (컴퓨터공학 분야 설계교육 방법론)

  • Kim, Sangjin
    • Journal of Engineering Education Research
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    • v.18 no.4
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    • pp.66-75
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    • 2015
  • Commonly it is perceived that it is difficult to teach engineering design and satisfy accreditation criteria in computer science and engineering related majors. However, since engineering design in these disciplines are a product design, it is more adaptable than other majors which are process design oriented. This paper shows that although there are subtle differences with conventional engineering design, engineering design education in computer science and engineering can be effectively done. This paper concentrates on how engineering design related curriculum can be constructed, what should be considered when designing such curriculum, and how engineering design can be taught in individual design courses(excluding introductory and capstone courses) based on case experience.

Fabrication of Equiatomic CoCrFeMnNi High-Entropy Alloy by Metal Injection Molding Process Using Coarse-Sized Powders

  • Eun Seong Kim;Jae Man Park;Ji Sun Lee;Jungho Choe;Soung Yeoul Ahn;Sang Guk Jeong;Do Won Lee;Seong Jin Park;Hyoung Seop Kim
    • Journal of Powder Materials
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    • v.30 no.1
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    • pp.1-6
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    • 2023
  • High-entropy alloys (HEAs) are attracting attention because of their excellent properties and functions; however, they are relatively expensive compared with commercial alloys. Therefore, various efforts have been made to reduce the cost of raw materials. In this study, MIM is attempted using coarse equiatomic CoCrFeMnNi HEA powders. The mixing ratio (powder:binder) for HEA feedstock preparation is explored using torque rheometer. The block-shaped green parts are fabricated through a metal injection molding process using feedstock. The thermal debinding conditions are explored by thermogravimetric analysis, and solvent and thermal debinding are performed. It is densified under various sintering conditions considering the melting point of the HEA. The final product, which contains a small amount of non-FCC phase, is manufactured at a sintering temperature of 1250℃.