• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.06a
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• pp.673-674
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• 2008

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.110-113
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• 2001

We present an interferometer system, which is able to perform both the phase shifting interferometry and white light interferometry. The interferometer system uses a d.c. motor to control the probe position with an accuracy of 10nm, which shows an outstanding performance on white light interferometry. However, the moving mechanism of d.c. motor is not accurate enough for the phase shifting interferometry that requires a moving precision less than 1 nm. We therefore propose a Fourier transform technique to calculate the phase of interferograms, which is strongly resistant to calibration errors and external vibration. Experimental results show that the Fourier transform technique is capable of reducing the measurement error caused by inaccurate movement within 0.1nm.

• Journal of the Optical Society of Korea
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• v.3 no.2
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• pp.35-40
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• 1999

One of main error sources in white light scanning interferometry is the inaccuracy of scanning mechanisms in that PZT(piezoelectric transducer) micro-actuators are preferably used. We propose a new calibration method that is capable of identifying actual scanning errors directly by analyzing the spectral distribution of sampled interferograms. This calibration provides an effective means of self-compensation for the non-linearity errors caused by PZT hysteresis, enhancing the measurement uncertainty to a level of 5 nanometers over an entire measuring range of 100 ${\mu}{\textrm}{m}$.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.204-207
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• 2005

We discuss two possibilities of using femtosecond pulse lasers as a new interferometric light source fer enhanced precision surface profile metrology. First, a train of ultra-fast laser pulses yields repeated low temporal coherence, which allows performing unequal-path scanning interferometry that is not feasible with white light. Second, high spatial coherence of femtosecond pulse lasers enables to test large size optics in non-symmetric configurations with relatively small size reference surfaces. These two advantages are verified experimentally using Fizeau and Twyman-Green type scanning interferometers.

• Journal of the Korean Society for Precision Engineering
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• v.24 no.4 s.193
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• pp.21-28
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• 2007

• Journal of the Korean Society for Precision Engineering
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• v.34 no.2
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• pp.107-114
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• 2017

In this investigation, we describe a metrological technique for surface and thickness profiles of a silicon (Si) wafer by using a 6 degree of freedom (DOF) stitching method. Low coherence scanning interferometry employing near infrared light, partially transparent to a Si wafer, is adopted to simultaneously measure the surface and thickness profiles of the wafer. For the large field of view, a stitching method of the sub-aperture measurement is added to the measurement system; also, 6 DOF parameters, including the lateral positioning errors and the rotational error, are considered. In the experiment, surface profiles of a double-sided polished wafer with a 100 mm diameter were measured with the sub-aperture of an 18 mm diameter at $10\times10$ locations and the surface profiles of both sides were stitched with the sub-aperture maps. As a result, the nominal thickness of the wafer was $483.2{\mu}m$ and the calculated PV values of both surfaces were $16.57{\mu}m$ and $17.12{\mu}m$, respectively.

• Applied Microscopy
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• v.41 no.4
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• pp.223-228
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• 2011

White light scanning interferometry has been employed to analyze surface features of diverse specimens. Long established in the field of materials engineering, the technique provides quantitative three-dimensional data as well as qualitative morphological images. It uses white light that is split and reflected from a reference mirror and an object. Merged together, the light generates interference patterns representing topographical contours of the object surface. The amplitude of the z-axis data is differentiated by gray scale. The technique allows the rapid, noncontact, and wide-field measurements for morphometry of biological specimens including chondrocytes, tooth enamel, and plant leaves. Quantification of the dimension of surface structures such as width, length, and elevation angle could be achievable by white light scanning interferometry. The light reflection from plant leaves has been assumed to be sufficient for the technique. Without special specimen preparations like conductive metal coating, the technique can be increasingly used for quantitative three-dimensional surface measurements of biological specimens.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.23-24
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• 2006

We present a dispersive scheme of white-light interferometry that enables not only to perform tomographical measurements of thin-film layers but also to measure a refractive index without mechanical depth scanning. The interferometry is found useful particularly for in-situ 3-D inspection of micro-engineered surfaces such as liquid crystal displays, semi-conductor and MEMS structure, which requires for high-speed implementation of 3-D surface metrology.

• Journal of the Optical Society of Korea
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• v.17 no.4
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• pp.317-322
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• 2013

We have proposed and demonstrated a low numerical aperture technique to measure the depth of through silicon vias (TSVs) using white-light scanning interferometry. The high aspect ratio hole like TSV's was considered to be impossible to measure using conventional optical methods due to low visibility at the bottom of the hole. We assumed that the limitation of the measurement was caused by reflection attenuation in TSVs. A novel interference theory which takes the structural reflection attenuation into consideration was proposed and simulated. As a result, we figured out that the low visibility in the interference signal was caused by the unbalanced light intensity between the object and the reference mirror. Unbalanced light can be balanced using an aperture at the illumination optics. As a result of simulation and experiment, we figured out that the interference signal can be enhanced using the proposed technique. With the proposed optics, the depth of TSVs having an aspect ratio of 11.2 was measured in 5 seconds. The proposed method is expected to be an alternative method for 3-D inspection of TSVs.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.10 no.2
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• pp.104-109
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• 2011

I present a method of aspheric surface profile measurement using 2nd derivative of local area profile. This method is based on the principle of curvature sensor which measures the local 2nd derivative under test along a line. The profile is then reconstructed from the data on the each point. Unlike subaperture-stiching method and slope detection method, 2nd derivative method has strong points from a geometric point of view in measuring the aspheric surface profile. The second derivative terms of surface profile is an intrinsic property of the test piece, which is independent of its position and tip-tilt motion. The curvature is measured at every local area with high accuracy and high lateral resolution by using White-light scanning interferometry.