• Applied Microscopy
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• 제50권
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• pp.25.1-25.11
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• 2020

Scanning acoustic microscopy (SAM) or Acoustic Micro Imaging (AMI) is a powerful, non-destructive technique that can detect hidden defects in elastic and biological samples as well as non-transparent hard materials. By monitoring the internal features of a sample in three-dimensional integration, this technique can efficiently find physical defects such as cracks, voids, and delamination with high sensitivity. In recent years, advanced techniques such as ultrasound impedance microscopy, ultrasound speed microscopy, and scanning acoustic gigahertz microscopy have been developed for applications in industries and in the medical field to provide additional information on the internal stress, viscoelastic, and anisotropic, or nonlinear properties. X-ray, magnetic resonance, and infrared techniques are the other competitive and widely used methods. However, they have their own advantages and limitations owing to their inherent properties such as different light sources and sensors. This paper provides an overview of the principle of SAM and presents a few results to demonstrate the applications of modern acoustic imaging technology. A variety of inspection modes, such as vertical, horizontal, and diagonal cross-sections have been presented by employing the focus pathway and image reconstruction algorithm. Images have been reconstructed from the reflected echoes resulting from the change in the acoustic impedance at the interface of the material layers or defects. The results described in this paper indicate that the novel acoustic technology can expand the scope of SAM as a versatile diagnostic tool requiring less time and having a high efficiency.

• 비파괴검사학회지
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• 제29권6호
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• pp.534-549
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• 2009

As the thin film technology has emerged in various fields, adhesion of the film interface becomes an important issue in terms of the longevity and durability of thin film devices. Diverse nondestructive methods utilizing acoustic techniques have been developed to assess the interfacial integrity. As an effective technique based on the ultrasonic wave focusing and the surface acoustic wave(SAW) generation, scanning acoustic microscopy(SAM) has been investigated for adhesion evaluation. Visualization of film microstructures and quantification of adhesion weakness levels by SAW dispersion are the recent achievements of SAM. To overcome the limitations in the theoretical dispersion model only suitable for perfectly elastic and isotropic materials, a new model has been more recently developed in consideration of film anisotropy and viscoelasticity and applied to the adhesion evaluation of polymeric films fabricated on semiconductive wafers.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2009년도 춘계학술대회 논문집
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• pp.899-900
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• 2009

• International Journal of Precision Engineering and Manufacturing
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• 제9권2호
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• pp.28-33
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• 2008

In a scanning electron microscope (SEM), outside acoustic noise causes image noise that distorts observations of the specimen being examined. A SEM that is less sensitive to acoustic noise is highly desirable. This paper investigates the image noise problem by addressing the mode shapes of the base plate and the transmission path of the acoustic noise and vibration. By arranging the position of the rib, a new SEM base plate was developed that had twisting as the 1st and 2nd modes. In those two twisting modes, vibration nodes existed near the center of the base plate where the specimen chamber is placed. Less vibration was transmitted to the chamber and to the specimen by the twisting modes compared to bending ones, which are the 2nd and 3rd modes for a rectangular plain base plate. An SEM with the developed base plate installed exhibited a significant reduction of image noise when exposed to acoustic noises below 250 Hz.

• 한국안전학회지
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• 제16권4호
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• pp.7-13
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• 2001

Wire electrical discharge machining experiments in conducted to investigate characteristics of acoustic emission (AE) and electrical discharge energy due to current peak (I$_{p}$), pulse on time($\tau$/on/). The AE signals are obtained with a sensor attached to workpiece side. Machining states are identified with scanning electron microscopy and residual stress analyzer. It is demonstrated that the residual stress provide reliable informations about the machining states. Moreover, machining states can be detected successfully using both the residual stress and AE count rate.e.

• 비파괴검사학회지
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• 제34권2호
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• pp.171-175
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• 2014

본 연구에서는 박막 표면을 따라 전파하는 표면파의 속도 분산성을 이용하여 박막의 두께를 비파괴적으로 측정할 수 있는 기법을 제안하였다. 표면파의 분산성을 이용하여 박막의 두께를 측정하기 위하여 전자빔증착법(E-beam evaporation)을 이용하여 Si(100) 웨이퍼 위에 니켈의 증착시간을 제어함으로서 두께가 다른 니켈 박막시험편을 제작하였다. 제작된 시험편의 실제 증착된 박막의 두께를 확인하기 위하여 SEM(scanning electron microscope)을 이용하여 박막의 단면사진을 촬영하여 두께를 확인하였다. 그 후에 두께가 다른 시험편에서의 표면파의 속도를 초음파현미경(scanning acoustic microscope)의 V(z) 곡선법을 이용하여 표면파의 속도를 측정하고 실제 측정된 두께와 표면파 속도와의 상관성을 확인하였다. 박막의 두께가 증가함에 따라 표면파의 속도는 감소하는 경향성을 나타내었다. 결론적으로 본 연구에서 제안한 표면파의 속도 분산성을 이용하여 나노 스케일 니켈 박막의 두께를 측정하는 기법이 가능성이 있음을 확인하였다.

• 한국공작기계학회논문집
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• 제10권5호
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• pp.9-16
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• 2001

Turning experiments are conducted to investigate characteristics of acoustic emission due to wear of the coated tool. The AE signals are obtained with a sensor attached to tool holder side. Tool states are identified with scanning electron microscopy and optical microscopy. It is demonstrated that the AE signals provide reliable informations about the cutting processes and tool states. Moreover, tool wear can be detected successfully using the AE-RMS.

• 비파괴검사학회지
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• 제30권5호
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• pp.437-443
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• 2010

최근 재료, 생물의학(biomedicine), 음향, 전자 등 다양한 분야에서 나노 구조를 갖는 박막 기술이 도입되면서 박막 계면의 수명과 내구성 확보를 위한 초고주파수의 초음파현미경을 이용한 정량적인 비파괴적 접합평가에 관한 연구가 큰 이슈가 되고 있다. 본 연구에서는 초음파의 집속, 누설탄성표면파의 발생과 V(z) 곡선의 시뮬레이션 그리고 초고주파수 음향 이미징 기법을 이용하여 나노 스케일 구조를 갖는 박막 시험편의 접합계면을 평가하였다. V(z) 곡선의 컴퓨터 시뮬레이션을 통하여 접합계면에 존재하는 미세 결함(디라미네이션 등)의 검출 감도를 추정할 수 있었으며, 1 GHz의 초고주파수 디포커싱 모드로 박막 시험편의 접합계면에 존재하는 나노 스케일의 미세 결함을 음향 이미지로 가시화 할 수 있어 나노 구조를 갖는 박막의 접합계면의 비파괴평가에 초음파현미경이 매우 유용함을 알 수 있었다.

• 한국정밀공학회지
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• 제8권4호
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• pp.118-125
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• 1991

Acoustic microscopy has attracted much interest recently as potential nondestructive evaluation technique for detecting and sizing defects of surface and sub-surface. Also acoustic emission testing method has been developed for detecting microcracks which is more than 30${\mu}m$ in length quantitatively on ceramics. In the present paper, acoustic emission during the four point bending test in hot-pressed sintered $Si_3N_4$ specimen which was stressed by thermal shock, has been measured by high sensitive sensing system. The surface and sub-surface cracks were detected by scanning acoustic micrscope of 800 MHz and conventional ultrasonic testing in C-scope image. The purpose was to investigate the location and size of cracks by SAM and AE technique, whose experimental data demonstrate good for detecting microcracks.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2001년도 춘계학술발표대회 논문집
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• pp.89-92
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• 2001

Drop weight impact tests were performed to investigate the impact behavior of carbon fiber/epoxy composite laminates reinforced by short fibers and other interleaving materials. Characterization techniques, such as cross-sectional fractography and scanning acoustic microscopy, were employed quantitatively to assess the internal damage of some composite laminates. Scanning electron microscopy was used to observe impact damage and fracture modes on specimen fracture surfaces. The results show that composite laminates experience various types of fracture; delamination, intra-ply cracking, matrix cracking and fiber breakage depending on the interlayer materials. Among the composite laminates tested in this study, the composites reinforced by Zylon fibers showed very good impact damage resistance with medium level of damage, while the composites interleaved by poly(ethylene-co-acrylic acid) (PEEA) film is expected to deteriorate the bulk strength due to the reduction of fiber volume fraction, even though the damaged area is significantly reduced.