Journal of the Korean Society for Nondestructive Testing (비파괴검사학회지)

The Korean Society for Nondestructive Testing (한국비파괴검사학회)
권호 표지

Recent Advances in Scanning Acoustic Microscopy for Adhesion Evaluation of Thin Films

  • Ju, Hyeong-Sick (Graduate Program in Acoustics, The Pennsylvania State University) ;
  • Tittmann, Bernhard R. (Department of Engineering Science and Mechanics, The Pennsylvania State University)
  • Published : 2009.12.30
Download PDF
⟨ Previous Next ⟩

Abstract

As the thin film technology has emerged in various fields, adhesion of the film interface becomes an important issue in terms of the longevity and durability of thin film devices. Diverse nondestructive methods utilizing acoustic techniques have been developed to assess the interfacial integrity. As an effective technique based on the ultrasonic wave focusing and the surface acoustic wave(SAW) generation, scanning acoustic microscopy(SAM) has been investigated for adhesion evaluation. Visualization of film microstructures and quantification of adhesion weakness levels by SAW dispersion are the recent achievements of SAM. To overcome the limitations in the theoretical dispersion model only suitable for perfectly elastic and isotropic materials, a new model has been more recently developed in consideration of film anisotropy and viscoelasticity and applied to the adhesion evaluation of polymeric films fabricated on semiconductive wafers.

Keywords

References

  1. Achenbach, J. D., Kim, J. O. and Lee, Y. -C. (1995) Measuring Thin Film Elastic Constants by Line-Focus Acoustic Microscopy, in Briggs, G. A. D. (Ed.), Advances in Acoustic Microscopy, Plenum Press, New York, NY, pp. 153-208
  2. Addison Jr., R. C., Somekh, M. and Briggs, G. A. D. (1986) Techniques for the Characterization of Film Adhesion, in: McAvoy, B. R. (Eds.), Proceedings of IEEE Ultrasonic Symposium, Williamsberg, U.S.A., November 17-19, pp. 775-782
  3. Addison, R. C. and Marshall, D. B. (1988) Correlation of Thin-Film Bond Compliance and Bond Fracture Resistance, in: Thompson, D. O. and Chimenti, D. E. (Eds.) Review of Progress in Quantitative Nondestructive Evaluation, 7B, Plenum, New York, NY, pp. 1185-1194
  4. Aizawa, T. and Kihara, J. (1992) Materials Evaluation of PVD/CVD Coated WC/Co Superhard Alloys by the Ultrasonic Microscopy, Nondestructive Testing and Evaluation, Vol. 8-9, pp. 999-1011 https://doi.org/10.1080/10589759208952770
  5. Aizawa, T., Itoh, M., Kihara, J. and Tokyo, J. (1993) Nondestructive Quality Assurance of PVD/CVD Ceramic Coated WC/C0 Cermets, Ceramic Coatings, Vol. 44, pp. 111-132
  6. Almond, D. P., Cox, R. L., Moghi, M. and Reiter, H. (1981) Acoustic Properties of Plasma Sprayed Coatings and Their Applications to Nondestructive Evaluation, Thin Solid Film, Vol. 83, pp. 311-324 https://doi.org/10.1016/0040-6090(81)90634-9
  7. Berndt, C. C. (1989) Failure Processes within Ceramic Coatings at High Temperatures, Journal of Materials Sciences, Vol. 24, pp. 3511-3520 https://doi.org/10.1007/BF02385733
  8. Bray, R. C., Quate, C. F., Calhoun J. and Koch, R. (1980) Film Adhesion Studies with the Acoustic Microscope, Thin Solid Films, Vol. 74, pp. 295-302 https://doi.org/10.1016/0040-6090(80)90093-0
  9. Briggs, G. A. D and Hoppe, M. (1991) Acoustic Microscopy, in D. B. Williams, A. R. Pelton and R. Gronsky (Eds.), Image of Materials, Oxford University Press, New York, NY
  10. Doering, E. R., Havrilla, G. J. and Miller, T. C. (2004) Disilicide Diffusion Coating Inspection by Micro X-Ray Fluorescence Imaging, Journal of Nondestructive Evaluation, Vol. 23, No. 3, pp. 95-105 https://doi.org/10.1023/B:JONE.0000048865.96417.bc
  11. Du, J. (2008) Toward the Acoustic Evaluation of Low Modulus Thin Film Structures, Ph. D Thesis, The Pennsylvania State University
  12. Du, J., Tittmann, B. R and Ju, H. S. Evaluation of Film Adhesion to Substrates by Means of Surface Acoustic Wave Dispersion, Thin Solid Films, acceptedation
  13. Freund, L. B. and Suresh, S. (2003) Thin Film Materials, Cambridge University Press, Cambridge, UK, pp. 6-13
  14. Gordon, G. A., Canumalla, S. and Tittmann, B. R. (1993) Ultrasonic C-Scan Imaging for Material Characterization, Ultrasonics, Vol. 31, No. 5, pp. 373-380 https://doi.org/10.1016/0041-624X(93)90071-7
  15. Guo, Z. and Achenbach, J. D. (1999) Modeling Quantitative Acoustic Microscopy for Layered Coatings, in: Thompson, D. O. and Chimenti, D. E. (Eds.), Review of Progress in Quantitative Nondestructive Evaluation, 18B, Plenum, New York, NY, pp. 1409-1416
  16. Guo, Z., Achenbach, J. D., Madan A., Martin, K. and Graham, M. E. (2001) Modeling and Acoustic Microscopy Measurements for Evaluation of the Adhesion between a Film and a Substrate, Thin Solid Films, Vol. 394, pp. 188-200 https://doi.org/10.1016/S0040-6090(01)01168-3
  17. Haskell, N. A. (1953) The Dispersion of Surface Waves on Multi-Layered Media, Bulletin of the Seismological Society of America, Vol. 43, pp. 17-34
  18. Jiao, D. and Rose, J. L. (1991) An Ultrasonic Interface Model for Bond Evaluation, Journal of Adhesion Science and Technology, Vol. 5, No. 8, pp. 631-646 https://doi.org/10.1163/156856191X00530
  19. Ju, H. S. and Tittmann, B. R., Quantitative Acoustic Model for Adhesion Evaluation of PMMA/Silicon Film Structures, in: Thompson, D. O. and Chimenti, D. E. (Eds.), Review of Progress in Quantitative Nondestructive Evaluation, American Institute of Physics, Melville, in Press
  20. Kinra, V. K. and Zhu, C. (1993) Ultrasonic Nondestructive Evaluation of Thin (Subwavelength) Coatings, Journal of Acoustic Society of America, Vol. 93, No. 5, pp. 2454-2467 https://doi.org/10.1121/1.405866
  21. Kosbi, K., Blum, T., Scheer, U. and Boseck, S. (1998) Evaluation of Imperfect Gold/Glass Interfaces Using Scanning Acoustic Microscopy, in: Sliwinski, A., Linde, B. B., Kwiek P. (Eds.), Proceedings of SPIE, 3581, Gdansk-Jurata, Poland, May 18, pp. 314-319
  22. Lee, Y-C., Kim, J. O. and Achenbach, J. D. (1995a) Acoustic Microscopy Measurement of Elastic Constants and Mass Density, IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control, Vol. 42, No. 2, pp. 253-264 https://doi.org/10.1109/58.365239
  23. Lee, Y.-C., Achenbach, J.D., Nystrom, M. J., Gilbert, S. R., Block, B. A. and Wessels, B. W. (1995b) Line-Focus Acoustic Microscopy Measurements of $Nb_2O_5$/MgO and $BaTiO_3$/$LaAlO_3$ Thin-Film/Substrate Configurations, IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control, Vol. 42, No. 3, pp. 376-380 https://doi.org/10.1109/58.384445
  24. Lemons, R. A. and Quate, C. F. (1974) Acoustic Microscope-Scanning Version, Applied Physics Letters, Vol. 24, No. 4, pp. 163-165 https://doi.org/10.1063/1.1655136
  25. Mal, A. K. and Weglein, R. D. (1988) Characterization of Film Adhesion by Acoustic Microscopy, Review of Progress in Quantitative Nondestructive Evaluation, 7B, Plenum, New York, NY, pp. 903-910
  26. Miller, A. J. (1983) Aspects of SAM Imaging of Semiconductor Devices, Institute of Physics Conference Series 67, pp. 393-398
  27. Miller, A. J. (1985) Scanning Acoustic Microscopy in Electronics Research, IEEE Transactions on Sonics and Ultrasonics, Vol. SU-32, No. 2, pp. 320-324
  28. Mittal, K. L. (1976) Adhesion Measurement of Thin Films, Electrocomponent Science and Technology, Vol. 3, pp. 21-42 https://doi.org/10.1155/APEC.3.21
  29. Pageler, A., Blum, T., Kosbi, K., Scheer U. and Boseck S. (2000) Determination of Bonding Properties in Layered Metal Silicon Systems Using Sezawa Wave Modes, in Lee H. (Ed.), Acoustic Imaging, 24, Kluwer Academic/Plenum Publishers, New York, NY, pp. 229-235
  30. Parmon, W. and Bertoni, H. L. (1979) Ray Interpretation of the Material Signature in the Acoustic Microscope, Electronics Letters, Vol. 15, No. 21, pp. 684-686 https://doi.org/10.1049/el:19790486
  31. Parthasarathi, S., Aesope, M. D., Sampath, K. and Tittmann, B. R. (1995) Thermal Wave Imaging and Ultrasonic Characterization of Defects in Plasma Sprayed Coatings, Journal of Materials and Manufacturing Processes, Vol. 10, No. 5, pp. 1077-1086 https://doi.org/10.1080/10426919508935089
  32. Parthasarathi, S. (1996) Rayleigh Wave Potential for Thin Film Characterization, Ph. D Thesis, The Pennsylvania State University
  33. Parthasarathi, S., Tittmann, B. R. and Ianno, R. J. (1997) Quantitative Acoustic Microscopy for Characterization of the Interface Strength of Diamond-Like Carbon Thin Films, Thin Solid Films, Vol. 300, pp. 42-50 https://doi.org/10.1016/S0040-6090(96)09501-6
  34. Parthasarathi, S., Tittmann, B. R. and Nishida, M. (1998) Characterization of Film Interface Integrity through Scanning Acoustic Microscopy, Surface & Coatings Technology, Vol. 105, pp. 1-7 https://doi.org/10.1016/S0257-8972(98)00484-8
  35. Richard, P., Gremaud, G. and Kulik, A. (1994) Thin Film Adhesion Investigation with the Acoustic Microscope, in: Levy, M, Schneider, S. C., and McAvoy, B. R. (Eds.) Proceedings of the IEEE Ultrasonics Symposium, Cannes, France, November 1-4, pp. 1425-1428
  36. Richard, P., Thomas, J., Landolt, D. and Gremaud, G. (1997) Combination of Scratch-Test and Acoustic Microscopy Imaging for the Study of Coating Adhesion, Surface Coatings Technology, Vol. 91, pp. 83-90 https://doi.org/10.1016/S0257-8972(96)03179-9
  37. Robert, L., Brunet, N., Flaherty, T., Randles, T., Matthaei-Schulz, E., Vetters, H., Rats, D. and Stebut, J. Von (1999) Characterisation of TiN and Carbon-Doped Chromium Thin Film Coatings by Acoustic Microscopy, Surface and Coatings Technology, Vol. 116-119, pp. 327-334 https://doi.org/10.1016/S0257-8972(99)00316-3
  38. Roge, B., Fahr, A., Giguere, J. S. R. and Mcare, K. I. (2003) Nondestructive Measurement of Porosity in Thermal Barrier Coatings, Journal of Thermal Spray Technology, Vol. 12, No. 4, pp. 530-535 https://doi.org/10.1361/105996303772082279
  39. Smith, D. L. (1995) Thin-Film Deposition: Principles and Practice, McGraw-Hill, Boston, MA, pp. 197-200
  40. Smith, I. R., Harvey, R. A. and Fathers, D. J. (1985) An Acoustic Microscope for Industrial Applications, IEEE Transaction on Sonics and Ultrasonics, Vol. SU-32, No. 2, pp. 274-288
  41. Thomsen, C., Maris, H. J. and Tauc, J. (1987) Picosecond Acoustics as a Nondestructive Tool for the Characterization of Very Thin Films, Thin Solid Films, Vol. 154, pp. 217-223 https://doi.org/10.1016/0040-6090(87)90366-X
  42. Thomson, W. T. (1950) Transmission of Elastic Waves through a Stratified Solid Medium, Journal of Applied Physics, Vol. 21, No. 2, pp. 89-93 https://doi.org/10.1063/1.1699629
  43. Weglein, R. D. (1980) Acoustic Microscopy Applied to SAW Dispersion and Film Thickness Measurement, IEEE Transaction on Sonics and Ultrasonics, Vol. 27, No. 2, pp. 82-86 https://doi.org/10.1109/T-SU.1980.31152
  44. Weglein, R. D. (1982) Nondestructive Film Thickness Measurements on Industrial Diamond, Electronics Letters, Vol. 18, No. 23, pp. 1003-1004 https://doi.org/10.1049/el:19820687
  45. Weglein, R. D. and Mal, A. K. (1987) A Study of Layer Adhesion by Acoustic Microscopy, in: McAvoy, B. R. (Eds.), Proceedings of IEEE Ultrasonic Symposium, Denver, U.S.A, October 14-16, pp. 823-827
  46. Xu, P. C., Lindenschmidt, K. E. and Meguid, S. A. (1993) A New High-Frequency Analysis of Coatings Using Leaky Lamb Waves, Journal of Acoustic Society of America, Vol. 94, No. 5, pp. 2954-2962 https://doi.org/10.1121/1.407326