• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.10a
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• pp.63-63
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• 2003

• 한국도로학회:학술대회논문집
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• 2009.11a
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• pp.493-500
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• 2009

• Transactions of the Korean Society of Machine Tool Engineers
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• v.18 no.1
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• pp.1-12
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• 2009

Presently, the semiconductor industry has the chronic problem. In the semiconductor industry, it has the semiconductor wafer, a package, the optical filter cut by using the saw blade, the mold, a laser etc. The cutting technique has the difficulty due to the rising of the production cost by the wearing of mold, the poor quality problem due to generated heat at the moment of cutting procedure and curve cutting etc. The goal of this time of national research and development project is develop the apparatus for solving the problem that the existing cutting technique has. The technology is so called waterjet abrasive method. This technology will be mainly applied to cut a semiconductor package and a wafer. Two important things to be considered are ripple effect(in other words, the scale of a market) and simplicity of an application.

• Proceedings of the Korean Institute of Industrial Safety Conference
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• 1998.05a
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• pp.77-82
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• 1998

The residual strength of a specimen with MSD was investigated experimentally and numerically. The used materials for specimens are 2024-T3 and S50C. In each specimen, one main crack and 4 small cracks are machined by using electrical discharge wire cutting and saw cutting. The residual strengths are measured for 3 cases of crack configurations, and the measured values are compared with the values obtained numerically by using elasto-plastic average uncracked ligament stress link-up criteria.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.15 no.3
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• pp.66-71
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• 2016

Reducing the wafer breakage rate and sawing thinner wafers will decrease the cost of solar cells. This study was carried out in order to identify ways to achieve this goal. In this study, the cutting force characteristics using an ingot tilting-type diamond multi wire-sawing machine were analyzed. The cutting force was analyzed while varying the tilting angles and wire speed. The obtained data were analyzed by classifying the tangential cutting force and the normal cutting force. In this cutting force experiment, the difference between the forces was confirmed; it was found that it rises with increasing the tilting angles and decreases when the wire speed elevates. The resulting value can be utilized as basic data for the determination of an ideal cutting recipe.

• Journal of the Korea Safety Management & Science
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• v.18 no.1
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• pp.35-43
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• 2016

The past five years, industrial accidents due to food processing machinery have been occurred 725 cases, injury by the food cutter occurred 390 cases in its. On this study, to prevent food cutter injury, an attempt is made to present the improved documentation of fundamental safety of the food cutter workplace through the injury analysis of food cutter injury and surveys on band saw machine business field. Analyzing the result of 390 cases on food cutter injury, amputation, cut, puncture occupied 75.1 percent (293 cases), compressed occupied 23.3% (91 cases), also it showed constant component without reference to gender, age, scale of work place, service period. In the survey, lack of concentration for workers have been pointed out as the biggest factor in the cause of band saw machine injury. Meanwhile, such as the EU and Japan, whereas presents safety standards about band saw machines that are tailored to each country, on the other hand, South Korea doesn't provide the standards. To prevent the food cutter injury, safety standards need to be established in consideration of amputation, cut, puncture, compressed injury and financial support is required to procure protective equipment at each place of business.

• Journal of the Korean Society for Precision Engineering
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• v.12 no.8
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• pp.53-62
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• 1995

In recent years, the rapid development of the machine tool and tough insert has made metal removal rates increase, and automatic system without human supervision requires a higher degree reliability of machining process. Therefore the control of chips is one of the important topics which deserves much attention. The chip classification was made based upon standard deviation of the mean cutting force measured by a tool dynamometer. STS304was chosen as the workpiece which is known as the difficult-to-cut material and mainly saw-toothed chip produced, and the chip type according to the standard deviation of mean cutting force was classified into five categories in this experiment. Long continuous type chip which interrupts the normal cutting process, and damages the operator, tool and workpiece has low standard deviation value, while short broken type chip, which is favourable chip for disposal, has relatively large standard deviation value. In addition, we investigated the possibility that the chip type can be predicted analyzing the relationship between chip type and cutting condition by the trained neural network, and obtained favourable results by which the chip type can be predicted with cutting conditon before cutting process.

• Proceedings of the Korean Nuclear Society Conference
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• 2003.10a
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• pp.477.1-477.1
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• 2003

• Journal of Korean Society of Forest Science
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• v.90 no.3
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• pp.388-397
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• 2001

In forestry, where improvement of labor environment is quite impossible, improved posture would result in direct effects by preventing waste of physical strength, prevention of accidental injury caused by fatigue accumulated on certain body parts, and prevention of human error by inattentiveness due to weakened body. Therefore, this research carried on analysis of working posture in manual forest work(thinning using chain-saw, salvage cutting using chain-saw, clearing using hand saw, clearance of twiner using sickle, pruning using saw with a long handle, and tending of young growth using sickle) using OWAS analysis system. According to the OWAS method, percentage of OWAS action categories III and IV in the tasks using chain-saw and sickle was higher than another tasks. For the compared middle skillful worker group and low skillful worker group at felling work using chain-saw, percentage of OWAS action categories IV in middle skillful worker group was 5.1%, and low skillful worker group was 14.1%.

• Proceedings of the Korean Vacuum Society Conference
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• 1995.06a
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• pp.154-154
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• 1995

The Xu-Tec process is also called the double glow surface alloying technology and is a new method of surface metallurgy which can produce an alloy layers with sp ecial phisical and chemical properties on the surface of common and inexpensive mater ials. Many super alloys and alloy steels, sueh as nickel base alloys, high speed steels and staiinless steels, have been produced by Xu-Tee Process on the surfaces of carbon steels. The depth of the alloy lasyers may vary from several microns up to 300 micr ons with alloying elements in a concentration of few percentage to 100%. World wide patents for Xu-Tec process have been granted in the United states, Canada, United Ki ngdom, Australia and Japan. High performance saw blades have been successfully produced by the Xu-Tee process with much simper processing steps and less cost than bimetal high speed saw blades. A comparison of the cutting times and wear rates of the Xu-Tee blades with the conventional bimetal blades has been made. The Xu-Tee bIases demonstrates sim ilar or better performance than bimetal blades. A Xu-Tec Unit for the commercial pr oduction of Xu-Tec saw blades has been designed and manufactured. This Unit can t reat 10,000 haek saw blades at one time. Three Xu-Tec hack saw blades production I ines have been set up in China. China.