• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.14 no.4
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• pp.323-327
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• 2021

This paper produced SUS MASK, which is used for OLEDs, using an automatic liquid management system. The SUS MASK was tested by setting the hole diameter to 0.4 mm. The additive F300 was found to be excellent as the hole diameter was close to 0.4 mm and the error range was measured to be 0.08 on average. And as a result of measuring the weight reduction amount of CuCl2 and FeCl3 according to the change in oxidation-reduction potential (ORP), FeCl3 is relatively sensitive to ORP changes. Experiments were conducted on whether ORP (610 mV) and specific gravity (1.463) were automatically controlled while continuously etching the SUS Mask. Experimental results show that the automatic liquid management system is well controlled because the setting value is not significantly changed. After setting the hole diameter to 0.4 mm as the target, the experiment results were measured from 0.36 to 0.44. Therefore, it is expected that etching processing in the manufacturing process of SUS MASK can be improved with higher precision by applying the manufactured automatic liquid management system.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.15 no.4
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• pp.243-248
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• 2022

The purpose of this paper is to etching SUS MASK by adding an additive (F300) to FeCl3. The equipment used in the experiment is a self-made automatic liquid management system. The automatic liquid management system is a device capable of controlling the Oxidation Reduction Potential (ORP) and specific gravity in real time and supplying FeCl3 and additives in a quantitative manner. SUS MASK was etched in units from 10 sheets up to 200 sheets for 1 minute. It was confirmed that when the initial SUS MASK was 10 sheets, the ORP value started with 628 mV and measured at 611 mV from the time of 40 sheets being injected, and maintained close to 610 mV up to 200 sheets. The specific gravity was maintained near 1.640. And the SUS MASK was measured close to 0.4 mm from 50 sheets to 200 sheets. The experimental conditions of ORP had a specific gravity of 610 mV, 1.463, an etching pressure of 3.0 kg/cm2, an additive (F300) ratio of 1.2%, and the hole size was measured by up to 200 sheets of 10 sheets at once etching. As a result, the diameter approached 0.4 mm from 20 sheets. Even if the number of SUS MASK was increased, the ORP and specific gravity were well controlled, and it was confirmed that the experimental target value was close to 0.4 mm.

• Proceedings of the Korean Printing Society Conference
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• 2002.05a
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• pp.19-24
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• 2002

• Journal of Distribution Science
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• v.17 no.4
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• pp.51-57
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• 2019

Purpose - This study aims to improve the distribution structure of the OLED market and develop cost-effective optimization techniques. Specifically, it is a study on the optimization of ferric chloride to improve the etch of SUS MASK for OLED. Research design, data, and methodology - Applying the optimal conditions of the experiment, the final confirmation was evaluated for improvement by the Process Capability Index (Cpk). It is possible to derive social performance such as improvement of precision of SUS MASK manufacturing, economic performance such as defect rate, reduction of waste generation and treatment cost, technological achievement such as SUS MASK production technology, improvement of profit structure of technology development and process improvement do. Results - The improvement of the Cpk before the improvement was made was confirmed to be 0.57% with a defect estimate of 25.07% with a failure estimate of 0.57% after the improvement, and 8.84% with a failure estimate of 0.57% level after the improvement. Conclusions - If the conclusions obtained from the specimen experiment are applied to the manufacturing process of SUS MASK, it will be possible to expect excellent cost-effective competitiveness due to the improvement of precision and reduction of defect rate to enhance the OLED market penetration.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.13 no.5
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• pp.412-418
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• 2020

This paper produced an automatic fluid management system that can accurately control the specific gravity of etching solution(FeCl₃), and produced a SUS MASK applied to OLED. The target was set at 0.4 mm in diameter of the hole. As a result of this misconception, the etching speed increased when the specific gravity(S.G) value of FeCl₃ was changed from 1.43 to 1.49. And when the weight was 1.49, it was found that the vertical diameter was 0.405 mm, approaching the target. When pressure injection was varied from 2.0kg/cm2 to 3.5kg/cm2, the hole diameter at 3.0 kg/cm2 averaged 0.4mm, matching the target. The characteristics of the change in gravity were analyzed by applying the additive 1.2% and setting the weight at 1.430 by mixing HCl and H2O in FeCl₃ and fixing the injection pressure at 3.0 kg/cm2. When the weight changed from 1.460 to 1.469 the etching speed increased from 0.564 to 0.540. When the weight was 1.467, the hole diameter was measured at 0.4 mm and the target was reached.