• 제목/요약/키워드: SPICE modeling

검색결과 91건 처리시간 0.025초

SPICE를 이용한 커패시터 방전 임펄스 착자 회로의 특성 해석 (Characteristics Analysis of Capacitor Discharge Impulse Magnetizing Circuit using SPICE)

  • 백수현;김필수
    • 대한전기학회논문지
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    • 제43권2호
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    • pp.206-215
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    • 1994
  • A method for simulating general characteristics and temperature characteristics of discharging SCR of the capacitor discharge impulse magnetizer-magnetizing fixture system using SPICE is presented. This method has been developed which can aid the design, understanding and inexpensive, time-saving of magnetizing circuit. As the detailed characteristic of magnetizing circuit can be obtained, the efficient design of the magntizing circuit which produce desired magnet will be possible using our SPICE modeling. Especially, computation of the temperature rise of discharging SCR is very important since it gives some indication of thermal characteristic of discharging circuit. It is implemented on a 486 personal computer, and the modeling results are checked against experimental measures. The experimental results have been achived using 305[V] and 607[V] charging voltage, low-energy capacitor discharge impulse magnetizer-magnetizing fixture of air cleaner DC motor.

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CMOS 이미지센서 SPICE 회로 해석을 위한 포토다이오드 및 픽셀 모델링 (Photo Diode and Pixel Modeling for CMOS Image Sensor SPICE Circuit Analysis)

  • 김지만;정진우;권보민;박주홍;박용수;이제원;송한정
    • 전자공학회논문지 IE
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    • 제46권4호
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    • pp.8-15
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    • 2009
  • 본 논문은 CMOS 이미지센서 SPICE 회로 해석을 위한 포토다이오드 및 픽셀 모델링을 나타내었다. 소자 시뮬레이터인 메디치(Medici)를 이용하여 입사광의 세기에 따른 광전류 특성을 확보하고 SPICE 시뮬레이션에서 활용하기 위한 SPICE용 포토 다이오드 모델을 개발하였다. 그리고 그 결과를 검증하기 위하여 포토다이오드와 NMOS로 구성된 시험용 회로구조에 대한 메디치(Medici)의 mixed mode 시뮬레이션 결과와 SPICE 시뮬레이션 결과를 비교하였다.

General SPICE Modeling Procedure for Double-Gate Tunnel Field-Effect Transistors

  • Najam, Syed Faraz;Tan, Michael Loong Peng;Yu, Yun Seop
    • Journal of information and communication convergence engineering
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    • 제14권2호
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    • pp.115-121
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    • 2016
  • Currently there is a lack of literature on SPICE-level models of double-gate (DG) tunnel field-effect transistors (TFETs). A DG TFET compact model is presented in this work that is used to develop a SPICE model for DG TFETs implemented with Verilog-A language. The compact modeling approach presented in this work integrates several issues in previously published compact models including ambiguity about the use of tunneling parameters Ak and Bk, and the use of a universal equation for calculating the surface potential of DG TFETs in all regimes of operation to deliver a general SPICE modeling procedure for DG TFETs. The SPICE model of DG TFET captures the drain current-gate voltage (Ids-Vgs) characteristics of DG TFET reasonably well and offers a definite computational advantage over TCAD. The general SPICE modeling procedure presented here could be used to develop SPICE models for any combination of structural parameters of DG TFETs.

SPICE를 사용한 3D NAND Flash Memory의 Channel Potential 검증 (The Verification of Channel Potential using SPICE in 3D NAND Flash Memory)

  • 김현주;강명곤
    • 전기전자학회논문지
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    • 제25권4호
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    • pp.778-781
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    • 2021
  • 본 논문에서는 SPICE를 사용한 16단 3D NAND Flash memory compact modeling을 제안한다. 동일한 structure와 simulation 조건에서 Down Coupling Phenomenon(DCP)과 Natural Local Self Boosting(NLSB)에 대한 channel potential을 Technology Computer Aided Design(TCAD) tool Atlas(SilvacoTM)와 SPICE로 simulation하고 분석했다. 그 결과 두 현상에 대한 TCAD와 SPICE의 channel potential이 매우 유사한 것을 확인할 수 있었다. SPICE는 netlist를 통해 소자 structure를 직관적으로 확인할 수 있다. 또한, simulation 시간이 TCAD에 비해 짧게 소요된다. 그러므로 SPICE를 이용하여 3D NAND Flash memory의 효율적인 연구를 기대할 수 있다.

액체질소하에서 CMOS 소자의 SPICE modeling (SPICE modeling of CMOS devices at liquid nitrogen temperature)

  • 정덕진
    • E2M - 전기 전자와 첨단 소재
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    • 제6권5호
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    • pp.417-427
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    • 1993
  • 액체질소하에서의 물리적인 현상 및 실험결과를 통하여 캐리어 냉동현상, 좁은 폭 및 숏트 채널효과를 포함한 문턱전압 모델, Surface Roughness Scattering 및 Ioniaed Impurity Scattering을 포함한 이동도 모델과 적합한 기판 전류모델이 제안되었으며 이 모델들은 모의실험 프로그램인 BSIM과 SPICE에 이식되었다. 제작된 링 오실레이터와 리플 가산기에 적용한 결과 측정한 데이타와 잘 부합되었다.

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Parameterized Simulation Program with Integrated Circuit Emphasis Modeling of Two-level Microbolometer

  • Han, Seung-Oh;Chun, Chang-Hwan;Han, Chang-Suk;Park, Seung-Man
    • Journal of Electrical Engineering and Technology
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    • 제6권2호
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    • pp.270-274
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    • 2011
  • This paper presents a parameterized simulation program with integrated circuit emphasis (SPICE) model of a two-level microbolometer based on negative-temperature-coefficient thin films, such as vanadium oxide or amorphous silicon. The proposed modeling begins from the electric-thermal analogy and is realized on the SPICE modeling environment. The model consists of parametric components whose parameters are material properties and physical dimensions, and can be used for the fast design study, as well as for the co-design with the readout integrated circuit. The developed model was verified by comparing the obtained results with those from finite element method simulations for three design cases. The thermal conductance and the thermal capacity, key performance parameters of a microbolometer, showed the average difference of only 4.77% and 8.65%, respectively.

임펄스 착자요크의 열전달 모델링 및 특성 해석 (Heat kTransfer Modeling and Characteristics Analysis of Impulsed Magnetizing Fisture)

  • 백수현;김필수
    • 대한전기학회논문지
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    • 제43권3호
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    • pp.381-387
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    • 1994
  • In this paper, we found the improved SPICE heat transfer modeling of impulsed magnetizing fixture system and investigated temperature characteristics using the proposed model. As the detailed thermal characteristics of magnetizing fixture can be obtained, the efficient design of the impulsed magnetizing fixture which produce desired magnet will be possible using our heat transfer modeling. The knowledge of the temperature of the magnetizing fixture is very important of forecast the characteristics of the magnetizing fixture which produce desired magnet will be possible using our heat transfer modeling. The knowledge of the temperature of the magnetizing fixture is very important to forecast the characteristics of the magnetizing circuits under different conditions. The capacitor voltage was not raised above 810[V] to protect the magnetizing fixture from excessive heating. The purpose of this work is to compute the temperature increasing for different magnetizing conditions. The method uses multi-lumped model with equivalent thermal resistance and thermal capacitance. The reliable results are obtained by using iron core fixture (stator magnet of air cleaner DC motor) coupled to a low-voltage magnetizer(charging voltage : 1000[V], capacitor : 3825[$\mu$F]. The modeling and experimental results are in close aggrement.

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열전 냉각기를 포함하는 볼로미터 패키지의 SPICE 등가 모델링 (SPICE-Compatible Modeling of a Microbolometer Package Including Thermoelectric Cooler)

  • 한창석;박승만;김남환;한승오
    • 센서학회지
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    • 제22권1호
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    • pp.44-48
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    • 2013
  • For a successful commercialization of microbolometer, it is required to develop a robust package including thermal stabilizing mechanism. In order to regulate the temperature within some operating range, thermoelectric cooler is generally used but it's not easy to model the whole package due to the coupled physics nature of thermoelectric cooler. In this paper, SPICE-compatible modeling methodology of a microbolometer package is presented, whose steady-state results matched well with FEM results at the maximum difference of 5.95%. Although the time constant difference was considerable as 15.7%, it can be offset by the quite short simulation time compared to FEM simulation. The developed model was also proven to be useful for designing the thermal stabilizer through parametric and transient analyses under the various working conditions.

유기박막 트랜지스터에서 문턱전압 이동의 모델링 및 시뮬레이션 (Modeling and Simulation of Threshold Voltage Shift in Organic Thin-film Transistors)

  • 정태호
    • 한국전기전자재료학회논문지
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    • 제26권2호
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    • pp.92-97
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    • 2013
  • In this paper the author proposes a method of implementing a numerical model for threshold voltage ($V_{th}$) shift in organic thin-film transistors (OTFTs) into SPICE tools. $V_{th}$ shift is first numerically modeled by dividing the shift into sequentially ordered groups. The model is then used to derive a simulations model which takes into simulation parameters and calculation complexity. Finally, the numerical and simulation models are implemented in AIM-SPICE. The SPICE simulation results agree well with the $V_{th}$ shift obtained from an OTFT fabricated without any optimization. The proposed method is also used to implement the stretched-exponential time dependent $V_{th}$ shift in AIM-SPICE and the results show the proposed method is applicable to various types of $V_{th}$ shifts.

S-파라미터 측정을 통한 MOSFET 캐리어 속도의 고온 종속 SPICE 모델링 (High Temperature Dependent SPICE Modeling for Carrier Velocity in MOSFETs Using Measured S-Parameters)

  • 정대현;고봉혁;이성현
    • 대한전자공학회논문지SD
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    • 제46권12호
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    • pp.24-29
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    • 2009
  • $0.18{\mu}m$ deep n-well 벌크 NMOSFET에서 측정된 차단주파수 $f_T$의 고온종속성을 모델화하기 위해, 측정된 S-파라미터를 사용한 정확한 RF 방법으로 $30^{\circ}C$에서 $250^{\circ}C$까지 전자속도 고온 데이터가 추출되었다. 이러한 추출데이터를 사용하여 개선된 온도종속 전자속도 방정식이 높은 온도의 범위에서 생기는 기존 방정식의 모델링 오차를 없애기 위해 개발되었으며 BSIM3v3 SPICE RF 모델에 구현되었다. 개선된 온도 종속 방정식은 기존 모델보다 $30^{\circ}C$에서 $250^{\circ}C$까지 측정된 $f_T$와 더 잘 일치하였으며, 이는 개선된 방정식의 정확성을 입증한다.