• 제목/요약/키워드: SMIC

검색결과 22건 처리시간 0.02초

Goal Programming을 이용한 상호영향도 분석 (Cross Impact Analysis Using Goal Programming)

  • 김연민;이진주
    • 한국경영과학회지
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    • 제6권1호
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    • pp.15-23
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    • 1981
  • This paper deals with cross impact analysis for technology assessment. The focus of the paper is to develop new technique of cross impact matrix using goal programming method. In this study, the idea of cross impact analysis based on scenario generation method especially SMIC-74 (2) is expanded. Critical literature review on SMIC-74 is presented to discuss the mathematical rationale of consistent probability in cross impact analysis. A new model of cross impact analysis using goal programming to overcome the shortcomings of the scenario generation technique especially SMIC-74 is developed. This new technique is also applied to the assessment of the air pollution problems in Seoul Metropolitan area in Korea. The results of analysis give us following findings 1) Cross impact analysis using goal programming produce more meaningful solutions comparing to those of SMIC-74 2) Theoretical rationale of the objective function in the newly developed technique is more appropriate than that of SMIC-74.

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An Innovation Path of Catch-up by Semiconductor Latecomers: The Semiconductor Manufacturing International Corporation Case

  • Qing, Lingli;Ma, Xiang;Zhang, Xuming;Chun, Dongphil
    • Journal of East Asia Management
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    • 제3권2호
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    • pp.43-64
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    • 2022
  • Exploring innovations for latecomers to catch up has been a popular concern in industry and academia. Over the last decade, more and more East Asian latecomer firms have moved beyond imitation and are delivering innovative products and services to the market. However, the semiconductor latecomers from China have limited success in catching up with more mature semiconductor firms. Our study examines how semiconductor latecomers to break through the latecomer's dilemma by innovation and achieve catch-up. We use a single-case approach for the Semiconductor Manufacturing International Corporation (SMIC) vertical development process to analysis its innovation path of catching up. The study's results showed that SMIC relied on the government's policy and funding support, and based on the strategic endurance of entrepreneurs, it persisted in technology R&D investment and independent innovation for 20 years. SMIC finally smashed the dilemma of latecomers and successfully achieved catch-up. With these findings, we believe that the path of catching up innovation for semiconductor latecomers should be equipped with independent innovation of technology, strategic leadership of entrepreneurs and support of government policies. As these factors are combined, latecomer firms' position is expected to rise and catch-up will become visible. Our study contributes to some enlightenment on the innovation path for latecomers in China and global semiconductors to achieve their catch-up.

Fuzzy Simulation of a Multi-electronic Acupuncture System and Clip-type Pulsimeter Equipped with a Magnetic Sensing Hall Device

  • Hong, You-Sik;Rhee, Jin-Kyu;Kim, Han-Kyu;Son, Il-Ho;Yoon, Woo-Sung;Lee, Nam-Kyu;Park, Do-Young;Kim, Keun-Ho;Kim, Yong-Jin;Khajidmaa, P.;Lee, Sang-Suk
    • Journal of Magnetics
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    • 제19권3호
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    • pp.255-260
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    • 2014
  • A portable clip-type pulsimeter equipped with a magnetic sensing Hall device has been developed to raise the accuracy of oriental disease diagnosis and therapy by convergence of magnetism and oriental medicine. To improve accuracy and reliability of conventional pulsimeter due to subjective analysis of the pulse wave and measuring position dependency of the arterial pulse sensor, the fuzzy algorithm was applied to analyze the strong- and weak-pulse wave symptom. Optimal time for electronic acupuncture was calculated using fuzzy rules and interference were drawn from objective data in view of pre-treatment. Moreover, the electrical characteristics of the pain parts that respond to acupuncture point were applied in view of post-treatment to propose the scientific pulse wave algorithm and simulation experiment.

사출 성형기 제어/감시용 Embedded Controller 기술 (Embedded Controller Technology of Injection Molding Machine for Control and Monitoring)

  • 김한규;손일호;송준엽;하태호
    • 한국정밀공학회지
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    • 제31권7호
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    • pp.577-583
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    • 2014
  • In this study, we introduce how to apply "Information and Communication Technology (ICT) to injection molding system. We report the current state of IT technology applied to produce their products in micro lens injection molding system. And we explain key technology of ICT for injection molding system and how to implement. Especially, we also mention about an embedded controller, also called as "M2M device". It provides programmable intelligent functions, communication, various interfaces, amplifier functions and mobile device connection to our application.

포스트 코로나와 반도체 산업 : 코로나19로 촉발된 반도체 밸류체인 분리 위험과 한국 반도체 산업의 대응전략 (Post-corona and semiconductor industry: The risk of separation of the semiconductor value chain triggered by Corona 19 and the response strategy of the Korean semiconductor industry)

  • 김기섭;한승헌
    • 기술혁신연구
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    • 제28권4호
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    • pp.127-150
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    • 2020
  • 세계보건기구(WHO)는 홍콩독감과 신종플루 이후 역사상 세 번째 팬데믹을 선언했다. 코로나19의 발생으로 국가 간 교류는 극도로 위축되는 한편 빠른 전염성으로 국가별 경기변동의 시간차를 만들어 냈다. 2020년 1월 미·중 무역 분쟁은 합의국면으로 접어들었으나 코로나19로 발생한 경제 디커플링 현상은 중국이 미국과의 무역균형을 맞추기 어렵게 만들었고 미·중 무역 분쟁 합의 조건을 지키기 어렵게 만들었다. 트럼프 대통령은 코로나19 확산의 책임을 중국에 돌렸고 경기 침체의 원인도 중국의 영업비밀 침해, 불법복제품 등으로 지목하면서 보호주의가 대두되었다. 이에 중국은 거세게 반발하면서 미국과 갈등이 깊어졌다. 미국은 중국 반도체 굴기의 핵심기업인 화웨이와 SMIC에 무역재제를 선언했고 미·중 간 반도체 밸류체인 단절 위험을 예고하고 있다. 반도체 산업의 밸류체인 분리는 특정 국가와 기업이 가치사슬에 고도로 전문화되어 독점하는 구조인 반도체 산업에 큰 충격을 줄 가능성이 있다. 본 논문은 코로나19로 인해 재점화된 미·중 간 반도체 밸류체인 단절 위험과 반도체 글로벌 산업 가치사슬의 충격과 변화, 한국 반도체 기업의 대응전략을 다루고자 한다.

Impedance Control of Flexible Base Mobile Manipulator Using Singular Perturbation Method and Sliding Mode Control Law

  • Salehi, Mahdi;Vossoughi, Gholamreza
    • International Journal of Control, Automation, and Systems
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    • 제6권5호
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    • pp.677-688
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    • 2008
  • In this paper, the general problem of impedance control for a robotic manipulator with a moving flexible base is addressed. Impedance control imposes a relation between force and displacement at the contact point with the environment. The concept of impedance control of flexible base mobile manipulator is rather new and is being considered for first time using singular perturbation and new sliding mode control methods by authors. Initially slow and fast dynamics of robot are decoupled using singular perturbation method. Slow dynamics represents the dynamics of the manipulator with rigid base. Fast dynamics is the equivalent effect of the flexibility in the base. Then, using sliding mode control method, an impedance control law is derived for the slow dynamics. The asymptotic stability of the overall system is guaranteed using a combined control law comprising the impedance control law and a feedback control law for the fast dynamics. As first time, base flexibility was analyzed accurately in this paper for flexible base moving manipulator (FBMM). General dynamic decoupling, whole system stability guarantee and new composed robust control method were proposed. This proposed Sliding Mode Impedance Control Method (SMIC) was simulated for two FBMM models. First model is a simple FBMM composed of a 2 DOFs planar manipulator and a single DOF moving base with flexibility in between. Second FBMM model is a complete advanced 10 DOF FBMM composed of a 4 DOF manipulator and a 6 DOF moving base with flexibility. This controller provides desired position/force control accurately with satisfactory damped vibrations especially at the point of contact. This is the first time that SMIC was addressed for FBMM.

제한된 범위의 Signed-Digit Number 인코딩을 이용한 병렬 십진 곱셈기 설계 (Design of Parallel Decimal Multiplier using Limited Range of Signed-Digit Number Encoding)

  • 황인국;김강희;윤완오;최상방
    • 전자공학회논문지
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    • 제50권3호
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    • pp.50-58
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    • 2013
  • 본 논문에서는 제한된 범위의 Signed-Digit number 인코딩과 축약 단계를 이용한 고정소수점 병렬 십진 곱셈기를 제안한다. 제안한 병렬 십진 곱셈기는 승수와 피승수를 제한된 범위의 SD number로 인코딩하여 캐리 전달 지연 없이 빠르게 부분곱을 생성한다. 인코딩에 사용하는 숫자의 범위를 줄임으로써 SD number 다중 피연산자 덧셈의 한번에 연산 가능한 피연산자의 개수가 늘어나게 되고, 이에 따라 부분곱 축약 단계의 연산을 빠르게 수행 할 수 있다. 제안한 병렬 십진 곱셈기의 성능 평가를 위해 Design Compiler에서 SMIC사의 180nm CMOS 공정 라이브러리를 이용하여 합성한 결과 기존의 Signed-Digit number를 이용한 병렬 십진 곱셈기보다 전체 지연시간은 4.3%, 전체 면적은 5.3% 감소함을 확인 하였다. 전체 지연시간 및 면적에서 부분곱 축약 단계가 차지하는 비중이 가장 크므로 부분곱 생성 단계에서 약간의 지연시간 및 면적 증가가 있음에도 불구하고 전체 지연시간과 면적이 감소하는 결과를 얻을 수 있다.

동시연산 다중 digit을 이용한 직렬 십진 곱셈기의 설계 (Design of Serial Decimal Multiplier using Simultaneous Multiple-digit Operations)

  • 유창헌;김진혁;최상방
    • 전자공학회논문지
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    • 제52권4호
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    • pp.115-124
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    • 2015
  • 본 논문에서는 직렬 십진 곱셈기의 성능을 향상시키는 방안을 제안하고 다중 digit을 동시에 연산하는 방안을 제안한다. 제안하는 직렬 십진 곱셈기는 부분 곱 생성단계의 2배수, 4배수를 생성하기 위한 인코딩 모듈을 없애고 쉬프트 연산만으로 부분 곱을 생성해 지연시간을 감소시킨다. 또한 다중 digit 연산을 이용해 연산의 횟수를 줄인다. 제안하는 직렬 십진 곱셈기의 성능을 평가하기 위해서 Synopsys사의 Design Compiler를 이용하여 SMIC사의 110nm CMOS 공정 라이브러리로 합성하였다. 그 결과 제안한 곱셈기는 기존의 직렬 십진 곱셈기와 비교해 전체 면적은 4% 증가하였지만, 전체 지연시간은 5% 감소함을 보였다. 또한 동시 연산 수가 증가함에 따른 제안한 다중 digit 곱셈기의 면적과 지연시간의 trade-off를 확인하였다.

진화 하드웨어 시스템을 위한 재구성 가능한 디지털 신호처리 구조 (A Reconfigurable Digital Signal Processing Architecture for the Evolvable Hardware System)

  • 이한호;최창석;이용민;최진택;이종호;정덕진
    • 대한전자공학회:학술대회논문집
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    • 대한전자공학회 2006년도 하계종합학술대회
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    • pp.663-664
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    • 2006
  • This paper presents a reconfigurable digital signal processing(rDSP) architecture that is effective for implementing adaptive digital signal processing in the applications of smart health care system. This rDSP architecture employs an evolution capability of FIR filters using genetic algorithm. Parallel genetic algorithm based rDSP architecture evolves FIR filters to explore optimal configuration of filter combination, associated parameters, and structure of feature space adaptively to noisy environments for an adaptive signal processing. The proposed DSP architecture is implemented using Xilinx Virtex4 FPGA device and SMIC 0.18um CMOS Technology.

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Design of Current-Type Readout Integrated Circuit for 160 × 120 Pixel Array Applications

  • Jung, Eun-Sik;Bae, Young-Seok;Sung, Man-Young
    • Journal of Electrical Engineering and Technology
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    • 제7권2호
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    • pp.221-224
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    • 2012
  • We propose a Readout Integrated Circuit (ROIC), which applies a fixed current bias sensing method to the input stage in order to simplify the circuit structure and the infrared sensor characteristic control. For the sample-and-hold stage to display and control a signal detected by the infrared sensor using a two-dimensional (2D) focal plane array, a differential delta sampling (DDS) circuit is proposed, which effectively removes the FPN. In addition, the output characteristic is improved to have wider bandwidth and higher gain by applying a two-stage variable gain amplifier (VGA). The output characteristic of the proposed device was 23.91 mV/$^{\circ}C$, and the linearity error rate was less than 0.22%. After checking the performance of the ROIC using HSPICE simulation, the chip was manufactured and measured using the SMIC 0.35 um standard CMOS process to confirm that the simulation results from the actual design are in good agreement with the measurement results.