• 한국정보통신학회:학술대회논문집
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• 한국해양정보통신학회 1999년도 춘계종합학술대회
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• pp.403-406
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• 1999

고상결정화(SPC)로 제작된 다결정 박막의 전기적 특성 변화를 측정함으로서 다결정 박막 트랜지스터(poly-Si TFT's)에 대한 온도 변화 (25～1$25^{\circ}C$)의 영향을 연구하였다. 채널 길이가 각각 1.5, 10 $\mu\textrm{m}$인 SPC로 제작된 n-채널 poly-Si TFT는 온도 변화에도 불구하고 높은 전계 효과 이동도 ($\mu$$_{FE}$ : 1.5와 10$\mu\textrm{m}$에서 각각 $\geq$82 and $\geq$60$\textrm{cm}^2$/V-s), 낮은 문턱전압 (V$_{th}$ : 1.5 와 10$\mu\textrm{m}$에서 각각 $\leq$ 1.52 and $\leq$ 2.75V), 낮은 Subthreshold swing (S$_{t}$), 그리고 양호한 ON-OFF 특성이 나타났다. 따라서, SPC로 제작된 poly-Si TFT는 액정표시장치의 주변회로에 적용할 수 있다.

• 한국진공학회지
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• 제11권3호
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• pp.135-140
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• 2002

본 논문에서는 p-type (100)Si, (100)MgO 그리고 MgO/si 기판 위에 RF Magnetron sputtering 법으로 $Ba_{0.5}Sr_{0.5}TiO_3$(BST)박막을 증착하였다. BST 박막 증착 후 RTA(Rapid Thermal Annealing)를 이용하여 $600^{\circ}C$에서 산소분위기로 1분간 고온 급속 열처리를 하였다. 증착된 BST박막의 결정화를 조사하기 위해 XRD(X-Ray Diffraction)측정을 한 결과 모든 기판에서 (110) $Ba_{0.5}Sr_{0.5}TiO_3$(의 주피크가 관찰되어졌고, 열처리 후 재결정화에 기인하여 피크 세기가 증가함을 관찰할 수 있었다. Al 전극을 이용한 커패시터 제작 후 측정한 C-V(Capacitance-Voltage) 특성에서 각각의 기판에서 측정된 커패시턴스 값으로 계산된 유전율은 120(bare Si), 305(Mgo/Si) 그리고 310(MgO)이었다. 누설 전류 특성에서는 0.3 MV/cm이내의 인가전계에서 1 $\mu\textrm{A/cm}^2$ 이하의 안정된 값을 보여주었다. 결론적으로 MgO 버퍼층을 이용한 기판이 BST 박막의 증착을 위한 기판으로써 효과적임을 알 수 있었다.

• 한국주조공학회지
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• 제24권3호
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• pp.145-152
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• 2004

The eutectic Si in Al-8.5wt.%Si alloy was changed from large flake to fine lemellar(or fibrous) shape when the Sc amount in the Al-Si alloy reaches 0.2wt.%. The optimum amount of Sc for the best modification effect was 0.8wt.% and slight decrease of modification effect occurred over this value. The study on the distribution of the modifiers(Sr, Na, and Sc) and the measurement of the surface tension of the Al-8.5wt.%Si alloy melt added with Sr, Na, and Sc modifier, respectively, reveals that Sc modifies the eutectic Si by the decrease of surface tension, while Sr and Na modify the eutectic Si mainly by impurity induced twinning mechanism.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2002년도 하계학술대회 논문집 C
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• pp.2020-2022
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• 2002

SiC direct bonding technology is very attractive for both SiCOI(SiC-on-insulator) electric devices and SiC-MEMS fileds because of its application possibility in harsh environements. This paper presents on pre-bonding according to HF pre-treatment conditions in SiC wafer direct bonding using PECVD oxide. The PECVD oxide was characterized by XPS and AFM, respectively. The characteristics of bonded sample were measured under different bonding conditions of HF concentration and applied pressure, respectively. The bonding strength was evaluated by tensile strength method. Components existed in the interlayer were analyzed by using FT-IR. The bond strength depends on the HF pre-treatment condition before pre-bonding (Min : 5.3 kgf/$cm^2{\sim}$ Max : 15.5 kgf/$cm^2$).

• 한국세라믹학회지
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• 제36권6호
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• pp.640-645
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• 1999

Recently rapid progress of electronic and telecommunication technology requires the development of new piezoelectric materials and cellular communication is more and more used in various fields. Langasite(La3Ga5SiO14) is suitable for new piezoelectric properties. Langastie can be applied as communication devices due to intermediate piezoelectric properties which are similar to those of quartz and LiTaO3 in its acoustic characteristics. So in this study Langastie(La3Ga5SiO14) single crystal with 47 mm in diameter and 25mm in length were sucessfully grown by using self-designed Czochralski system. In addition optimum growth conditions for the piezoelectric applications throughout estimation of crystal quality and frequency characteristics were investigated.

• 한국세라믹학회지
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• 제36권12호
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• pp.1364-1368
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• 1999

Langasite( La3Ga5SiO14) is suitable for new piezoelectric properties. Langasite can be applied for communication de-vices due to intermediate piezoelectric properties which are similar to those of quartz and LiTaO3 in its acoustic cha-racteristics. In this study Langasite( La3Ga5SiO14) single crystals were successfully grown by using self-designed Czo-chralski system. From the results of optical properties it was found that crystals having a high quality and higher optical transmittance were grown at atmosphere of 1 to 30 vol% of oxygen content.

• 한국분말재료학회지
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• 제6권1호
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• pp.96-102
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• 1999

The effect of Pb addition on microstructure and wear resistance was studied in rapidly solidified Al-20Si-5Fe-xPb(x=2, 4, 6 wt.%) alloys. The R/S Al-20Si-5Fe-xPb (x=2, 4, 6 wt.%) alloys showed a fine and homogeneous microstructure and an improved wear property compared with Al-20Si-5Fe alloy, while no significant change in UTS (Ultimate Tensile Strength) was shown. Contribution of the dispersoids on the wear property was discussed by showing the plastic deformation layers formed during wear track.

• 한국세라믹학회지
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• 제23권5호
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• pp.47-54
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• 1986

The structures of crystalline vitreous and liquid $SiO_2$ were Monte carlo simulated employing the potential energy function comprising Lennard-Jones 2-body and Axilrod-Teller 3-body potentials. Although the Si-O-Si angular distribution functions obtained in the simulation appear to be higher than the experimental results the other simulation results including SiO, O-O and Si-Si radial distribution functions and O-Si-O anglular distribution functions agree well with experimental data within acceptable limits. Themost important outcome in this study is that various $SiO_2$forms were successfully reproduced with the same potential energy function.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.II
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• pp.1338-1342
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• 2005

We have synthesized an $Eu^{2+}$-activated $Sr_3MgSi_2O_8$ blue phosphor and $Ba_2SiO_4$ green phosphor and $Ba^{2+}$ co-doped $Sr_3SiO_5$ red phosphor investigated an attempt to develop white LEDs by combining it with a GaN blue LED $chip(\lambda_{em}=405 nm)$. Three distinct emission bands from the GaN-based LED and the $(Sr_3MgSi_2O_8:Eu\; +\; Ba_2SiO_4:Eu\; +\; Ba^{2+}\; co-doped\; Sr_3SiO_5:Eu)$ phosphor are clearly observed at 460nm, 520 nm and at around 600 nm, respectively. These three emission bands combine to give a spectrum that appears white to the naked eye. Our results show that GaN (405 nm chip)-based $(Sr_3MgSi_2O_8:Eu\; +\; Ba_2SiO_4:Eu\; +\; Ba^{2+}\; co-doped\; Sr_3SiO_5:Eu) exhibits a better luminous efficiency than that of the industrially available product InGaN (460 nm chip)-based YAG:Ce.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1997년도 하계학술대회 논문집 C
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• pp.1361-1363
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• 1997

Zinc oxide-based MOV was fabricated with $SiO_2$ additive ranging from 0.5 to 4.0 mol%, and the microstructure and electrical characteristics were investigated. $Zn_2SiO_4$ phase formed by $SiO_2$ additive was distributed at ZnO grains, grain boundaries, and multiple grain junctions. As the content of $SiO_2$ additive increases, average grain size decreased from 40.6 to $26.9{\mu}m$ due to the Pinning effect by $Zn_2SiO_4$ at grain boundaries Breakdown voltage and nonlinear exponent increased, and leakage current decreased in the range of $11.2{\sim}6.14{\mu}A$ with an increasing $SiO_2$. Donor concentration and interface state density decreased, and barrier height increased in the range of $0.71{\sim}1.04eV$ with an increasing $SiO_2$. While, as the content of $SiO_2$ additive, apparent dielectric constant decreased, peak frequency of dissipation factor decreased in the range of $6.45{\times}10^5{\sim}3.00{\times}10^5Hz$, and dissipation peak was $0.31{\sim}0.22$ at Peak frequency.