• 한국재료학회지
• /
• 제3권5호
• /
• pp.443-450
• /
• 1993

실리콘이 주입된 CaAs 기판위에 플라즈마 화학 증착법으로 자기정렬 gate구조의 Schottky contact을 형성하였다. 갈륨비소 소자 제조를 위하여 두께 1600$\AA$의 턴스텐질화막을 $350^{\circ}C$에서 증착하여 $750^{\circ}C$에서 $900^{\circ}C$까지 급속 열처리 하였다. 텅스텐 질화막과 GaAs계면의 열적 안정성을 XRD(X-ray diffraction), PL(photoluminescence),ODLTS(optical deep livel transient spectroscopy)측정으로 조사하였으며, W보다 $W_{67}N_{33}$ gate를 형성시킬 경우에 GaAs에 미치는 열적손상이 적음을 알 수 있으며 이온 주입한 Si이온이 활성화 되는 것으로 생각된다. $W_{67}N_{33}$ GaAs 다이오드가 약 800-$900^{\circ}C$의 고온열처리 온도에서 W/GaAs 다이오드의 경우보다 열적 안정성이 우수하였다.

• 한국레이저가공학회지
• /
• 제8권3호
• /
• pp.5-10
• /
• 2005

[ $InxGa_{1-x}P/GaAs$ ] structures were grown by chemical beam epitaxy(CBE), Pure phosphine($PH_3$) gases were used as group V sources. for the group III sources, TEGa, TmIn were used. $InxGa_{1-x}P$ epilayer was grown on SI-GaAs substrate and has a 1-${\mu}m$ thick. We have investigated the characteristics of $InxGa_{1-x}P$ by the photoreflectance(PR) spectroscopy, The PR spectrum of $InxGa_{1-x}P$ shows third-derivative feature whose Peaks Provide energy gap. The energy gap of $InxGa_{1-x}P$ has deduced composition x. From temperature dependance of PR spectra, temperature coefficient is $dEg/dT=-3.773{\times}10^{-4}$ eV/K, and Varshni coefficients $\alpha$ and $\beta$ values obtained $4{\times}10^4$ eV/K and 267 K respectively. Also, interaction $\alpha$B was 19.4 meV using the Bose-Einstein temperature relation, and $\Theta$ value related the average phonon frequency were 101.4 K. In particular, shoulder peak related to defects observed in PR signal that measured in temperature 82 K.

• 전기전자학회논문지
• /
• 제22권2호
• /
• pp.427-431
• /
• 2018

본 논문에서는 최근 전력반도체 산업에서 활용되어지는 와이드밴드갭 반도체 중에 하나인 $Ga_2O_3$를 이용한 에피웨이퍼 성장에 관련되어 서술하였다. GaN 성장시 활용되어지는 HVPE법을 이용하여 Sn이 도핑된 $Ga_2O_3$ 기판웨이퍼에 평균 $5.3{\mu}m$ 두께로 성장시켰다. 일반적으로 화합물반도체의 에피 두께가 $5{\mu}m$일 경우 SiC의 경우 600V 전력반도체소자를 제작할 수 있으며, $Ga_2O_3$ 에피웨이퍼의 경우에는 1000V이상의 전력소자를 제작할 수 있다. 성장된 에피웨이퍼의 J-V 측정 결과 $2.9-7.7m{\Omega}{\cdot}cm^2$의 온저항을 얻을 수 있었으며, 역방향의 경우 상당히 높은 전압에서도 누설전류가 거의 없음을 알 수 있었다.

• 전자통신동향분석
• /
• 제32권6호
• /
• pp.8-16
• /
• 2017

In this paper, we review studies attempting to triumph over the limitation of Si-based semiconductor technologies through a heterogeneous integration of high mobility compound semiconductors on a Si substrate, and the co-integration of electronic and/or optical devices. Many studies have been conducted on the heterogeneous integration of various materials to overcome the Si semiconductor performance and obtain multi-purpose functional devices. On the other hand, many research groups have invented device fusion technologies of electrical and optical devices on a Si substrate. They have co-integrated Si-based CMOS and InGaAs-based optical devices, and Ge-based electrical and optical devices. In addition, chip and wafer bonding techniques through TSV and TOV have been introduced for the co-integration of electrical and optical devices. Such intensive studies will continue to overcome the device-scaling limitation and short-channel effects of a MOS transistor that Si devices have faced using a heterogeneous integration of Si and a high mobility compound semiconductor on the same chip and/or wafer.

• 한국결정학회지
• /
• 제14권2호
• /
• pp.93-104
• /
• 2003

The crystals of group-Ⅲ nitride semiconductors with wurtzite structure exhibit a strong polarity. Especially, GaN has characteristics of different growth rate, anisotropic electrical and optical properties due to the polarity. In this work, GaN epilayer was grown and the polarities of the crystals were observed by the chemical wet etching and SP-EFM. GaN thin films were deposited on c-plane A1₂O₃ substrate under the variations of growth conditions by HVPE such as the deposition temperature of the buffer layer, the deposition time, the ratio of Group-V and Ⅲ and the deposition temperature of the film. The adquate results were obtained under the conditions of 500℃, 90 seconds, 1333 and 1080℃, respectively. It is observed that the GaN layer grown without the buffer layer has N-polarity and the GaN layer grown on the buffer layer has Ga-polarity. Fine crystal single particles were grown on c-plane A1₂O₃ and SiO₂, layer. The external shape of the crystal shows ｛10-11｝｛10-10｝(000-1) planes as expected in the PBC theory and anisotropic behavior along c-axis is obvious. As a result of etching on each plane, (000-1) and ｛10-11｝planes were etched strongly due to the N-polarity and ｛10-10｝ plane was not affected due to the non-polarity. In the case of the crystal grown on c-plane A1₂O₃, two types of crystals were grown. They were hexagonal pyramidal-shape with ｛10-11｝plane and hexagonal prism with basal plane. The latter might be grown by twin plane reentrant edge (TPRE) growth.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
• /
• pp.408-409
• /
• 2008

In this paper the power divider is realized using the IPD processes for 900/1800 MHz; the designed power divider achieved the isolation of more than -24 dB. the insertion loss of nearly -3.5 dB, and the return loss of about -25 dB. The simple dual-band power divider based on SI-GaAs substrate is realized within the die size of about $2.5\times2mm^2$.

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
• /
• pp.180-180
• /
• 2012

Heteroepitaxial GaN nano- and micro-rods (NMRs) are one of the most promising structures for high performance optoelectronic devices such as light emitting diodes, lasers, solar cells integrated with Si-based electric circuits due to their low dislocation density and high surface to volume ratio. However, heteroepitaxial GaN NMRs growth using a metal-organic vapor phase epitaxy (MOVPE) machine is not easy due to their long surface diffusion length at high growth temperature of MOVPE above $1000^{\circ}C$. Recently some research groups reported the fabrication of the heteroepitaxial GaN NMRs by using MOVPE with vapor-liquid-solid (VLS) technique assisted by metal catalyst. However, in the case of the VLS technique, metal catalysts may act as impurities, and the GaN NMRs produced in this mathod have poor directionallity. We have successfully grown the vertically well aligned GaN NMRs on Si (111) substrate by means of self-catalystic growth methods with pulsed-flow injection of precursors. To grow the GaN NMRs with high aspect ratio, we veried the growth conditions such as the growth temperature, reactor pressure, and V/III molar ratio. We confirmed that the surface morphology of GaN was strongly influenced by the surface diffusion of Ga and N adatoms related to the surrounding environment during growth, and we carried out theoretical studies about the relation between the reactor pressure and the growth rate of GaN NMRs. From these results, we successfully explained the growth mechanism of catalyst-free and mask-free heteroepitaxial GaN NMRs on Si (111) substrates. Detailed experimental results will be discussed.

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
• /
• pp.327.1-327.1
• /
• 2014

Nitrides-on-silicon structures are considered to be an excellent candidate for unique design architectures and creating devices for high-power applications. Therefore, a lot of effort has been concentrating on growing high-quality III-nitrides on Si substrates, mostly Si(111) and Si(001) substrates. However, there are several fundamental problems in the growth of nitride compound semiconductors on silicon. First, the large difference in lattice constants and thermal expansion coefficients will lead to misfit dislocation and stress in the epitaxial films. Second, the growth of polar compounds on a non-polar substrate can lead to antiphase domains or other defective structures. Even though the lattice mismatches are reached to 16.9 % to GaN and 19 % to AlN and a number of dislocations are originated, Si(111) has been selected as the substrate for the epitaxial growth of nitrides because it is always favored due to its three-fold symmetry at the surface, which gives a good rotational matching for the six-fold symmetry of the wurtzite structure of nitrides. Also, Si(001) has been used for the growth of nitrides due to a possible integration of nitride devices with silicon technology despite a four-fold symmetry and a surface reconstruction. Moreover, Si(110), one of surface orientations used in the silicon technology, begins to attract attention as a substrate for the epitaxial growth of nitrides due to an interesting interface structure. In this system, the close lattice match along the [-1100]AlN/[001]Si direction promotes the faster growth along a particular crystal orientation. However, there are insufficient until now on the studies for the growth of nitride compound semiconductors on Si(110) substrate from a microstructural point of view. In this work, the microstructural properties of nitride thin layers grown on Si(110) have been characterized using various TEM techniques. The main purpose of this study was to understand the atomic structure and the strain behavior of III-nitrides grown on Si(110) substrate by molecular beam epitaxy (MBE). Insight gained at the microscopic level regarding how thin layer grows at the interface is essential for the growth of high quality thin films for various applications.

• 센서학회지
• /
• 제5권5호
• /
• pp.79-84
• /
• 1996

$n^{+}$형 GaAs 기판위에 MBE로 $1\;{\mu}m$ 두께의 GaAs층과 AlAs층 및 GaAs cap 단결정층을 차례로 성장시켰다. AlAs/GaAs epi층을 $400^{\circ}C$에서 각각 2시간 및 3시간동안 $N_{2}$로 bubbled된 $H_{2}O$ 수증기(水蒸氣)($95^{\circ}C$)에서 산화시켰다. 산화시간에 따른 산화막의 XPS 분석결과, 작은 양의 $As_{2}O_{3}$ 및 AlAS 그리고 원소형 As들이 2시간동안 산화된 시편에서 발견되었다. 그러나 3시간동안 산화시킨 후에는, 2시간동안 산화시켰을 때 산화막내에 존재하던 소량의 As 산화물과 As 원자들은 발견되지 않았다. 따라서 As-grown된 AlAs/GaAs epi층은 3시간동안 $400^{\circ}C$의 산화온도에서 선택적으로 $Al_{2}O_{3}/GaAs$으로 변화되었다. 그러므로 산화온도 및 산화시간은 AlAs/GaAs 계면에서 결함이 없는 표면을 형성하고 기판쪽으로 산화가 진행되는 것을 멈추기 위해서는 매우 결정적으로 작용하는 것으로 조사되었다.

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
• /
• pp.292-292
• /
• 2014

Wide band gap semiconductors, such as III-nitrides (GaN, AlN, InN, and their alloys), SiC, and diamond are expected to play an important role in the next-generation electronic devices. Specifically, GaN-based high electron mobility transistors (HEMTs) have been targeted for high power, high frequency, and high temperature operation electronic devices for mobile communication systems, radars, and power electronics because of their high critical breakdown fields, high saturation velocities, and high thermal conductivities. For the stable operation, high power, high frequency and high breakdown voltage and high current density, the fabrication methods have to be optimized with considerable attention. In this study, low ohmic contact resistance and smooth surface morphology to AlGaN/GaN on 2 inch c-plane sapphire substrate has been obtained with stepwise annealing at three different temperatures. The metallization was performed under deposition of a composite metal layer of Ti/Al/Ni/Au with thickness. After multi-layer metal stacking, rapid thermal annealing (RTA) process was applied with stepwise annealing temperature program profile. As results, we obtained a minimum specific contact resistance of $1.6{\times}10^{-7}{\Omega}cm2$.