• Journal of Adhesion and Interface
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• v.5 no.4
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• pp.1-8
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• 2004

UV-curable pressure sensitive adhesives were prepared by blending acrylic copolymer, copolymerized with butyl acrylate, acrylic acid and methyl methacrylate by solution polymerization, and trimethylolpropane triacrylate. The PSAs were evaluated by adhesion strength with varying UV dose, and also glass transition temperature ($T_g$) of PSAs were measured. When exposed on UV irradiation, the PSAs showed the decreased adhesion strength and increased $T_g$. And following UV irradiation, the PSAs did not leave any residue on wafer after peel off PSA.

• Journal of the Korean Ceramic Society
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• v.53 no.6
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• pp.700-706
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• 2016

Etch rate, surface roughness and microstructure as plasma resistance were evaluated for six kinds of oxide glass with different compositions. Borosilicate glass (BS) was found to be etched at the highest etch rate and zinc aluminum phosphate glass (ZAP) showed a relatively lower etch rate than borosilicate. On the other hand, the etching rate of calcium aluminosilicate glass (CAS) was measured to be similar to that of sintered alumina while yttrium aluminosilicate glass (YAS) showed the lowest etch rate. Such different etch rates by mixture plasma as a function of glass compositions was dependent on whether or not fluoride compounds were formed on glass and sublimated in high vacuum. Especially, in view that $CaF_2$ and $YF_3$ with high sublimation points were formed on the surface of CAS and YAS glasses, both CAS and YAS glasses were considered to be a good candidate for protective coating materials on the damaged polycrystalline ceramics parts in semi-conductor and display processes.

• Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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• 2008.10a
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• pp.319-322
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• 2008

This paper introduces experimental investigates of an accident pattern for the distributing XLPE cable terminations considering PL law environment. The influence of defects such as thickness and length decrease of XLPE, the impurity on XLPE and the gap between stress-con of housing and semi-conductor on insulating properties of the termination have been studied. The thickness and length decrease of XLPE decrease ac breakdown strengths. Dielectric breakdown traces of XLPE that is damaged by knife displayed other shape. The gap of between housing and semiconductor deteriorates dielectric strength of XLPE seriously.

• Proceedings of the KIEE Conference
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• 2000.07b
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• pp.1327-1329
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• 2000

The thyristor among the power-semi-conductor elements, which has large current capacity and high voltage, is used widely nowadays. When the thyristor was being used to the long time, this element may be able to arise the system trip caused by changing the characteristic and dropping the performance. Therefore, it would be necessary to analyze the characteristic of element to maintain the stable operation of the system. In oder to analyze this characteristic, it would be need to test forward direction, reverse direction and leakage current by supplying the half-sine wave voltage. Among these testing, transient current condition is generated from the testing of leakage current. This transient current may be the main factor of the error in the precise measurement of leakage current. Therefore, this paper analyzes the relationship between supply voltage and transient current in measuring leakage current of the SCR, and then suggests the condition and cause of transient current as appearing the leakage current in the testing the leakage current.

• Proceedings of the SAREK Conference
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• 2007.11a
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• pp.387-392
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• 2007

In this study performance evaluation of filtering system were made on the clean air supply system to show it's ability to eliminate the air contaminants. The evaluation was conducted inside the 3,200CMH scale wind tunnel and under the same environment that is effected by yellow dust and similar particle and gas phase contaminants in semi-conductor and FPDs industries. (1) The result of experimental for particle contaminants, the particle removing efficiency was 40% on condition that the air velocity is 2.5m/s, L/G ratio : 0.05, electrified voltage : (+)5.8kV with electric charger and (-)3.5kV with eliminator. (2) The gas phase removing efficiency for $NH_3$ : 80%, $SO_X$ : 70% and $NO_X$ : 40% on condition that the air velocity is 2.5m/s, L/G ratio : 0.05.

• Journal of Institute of Control, Robotics and Systems
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• v.15 no.9
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• pp.916-921
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• 2009

The technology to inspect and measure an inner structure of micro parts has become an important tool in the semi-conductor industrial field with the development of automation and precision manufacturing. Especially, the inspection skill on the inside of highly integrated electronic device becomes a key role in detecting defects of a completely assembled product. X-ray inspection technology has been focused as a main method to inspect the inside structure. However, there has been insufficient research done on the customized inspection technology for the flip-chip assembly due to the interior connecting part of flip chip which connects the die and PCB electrically through balls positioned on the die. In this study, therefore, it is implemented to detect shape error of flip chip bonding without damaging chips using an x-ray inspection system. At this time, it is able to monitor the solder bump shape by introducing an edge-extracting algorithm (exponential approximation function) according to the attenuating characteristic and detect shape error compared with CAD data. Additionally, the bonding error of solder bumps is automatically detectable by acquiring numerical size information at the extracted solder bump edges.

• Journal of Fashion Business
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• v.23 no.6
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• pp.116-126
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• 2019

South Korea is known for its major manufacturing capabilities in semi-conductor, automobile, and IT industries. However, little is known about the competitive capabilities of South Korea's textile industry. The present study presents information about how Korean textile firms build their competitive capabilities on multiple fronts. Through a case study of two businesses operating in the South Korean textile and apparel industry, this paper illustrates a series of competitiveness enhancing initiatives, starting with the implementation of radio frequency identification (RFID). The main contribution of this article is the focus on how the interdisciplinary nature of the textile and apparel industry can benefit from and optimize the use of Information Technology through sustained efforts on multiple fronts. This study suggests that Korean textile firms approach their competitive capabilities in terms of strategic direction, innovative priorities, and operational focus. In the competitive global business environment, this could be the solution for the textile and apparel industry, by helping for the survival in the upcoming information age. Specifically, by adopting RFID-based SCM, firms can gain a competitive capability that promises sustainable growth in the future.

• Journal of the Korean Society for Precision Engineering
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• v.25 no.1
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• pp.138-144
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• 2008

Micro-machining of a brittle material such as glass, silicon, etc., is important in micro fabrication. Particularly, micro-abrasive jet machining (${\mu}-AJM$) has become a useful technique for micro-machining of such materials. The ${\mu}-AJM$ process is mainly based on the erosion of a mask which protects brittle substrate against high velocity of micro-particle. Therefore, fabrication of an adequate mask is very important. Generally, for the fabrication of a mask in the ${\mu}-AJM$ process, a photomask based on the semi-conductor fabrication process was used. In this research a rapid mask fabrication technology has been developed for the ${\mu}-AJM$. By scanning the focused UV laser beam, a micro-mask pattern was fabricated directly without photolithography process and photomask. Two kinds of mask patterns were fabricated using SU-8 and photopolymer (Watershed 11110). Using fabricated mask patterns, abrasive-jet machining of Si wafer were conducted successfully.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.30 no.9 s.252
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• pp.1148-1153
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• 2006

This paper deals with the effect of the direct heating method(DHM) for straightening the micro wire. Straightened micro wires have been widely used in the fields of the medicine and the semi-conductor. We have developed a micro wire straightening system by using the direct wire heating method. To controling the tension of the micro wire during the heating and straightening process, a precision tension sensor was set up. In order to avoid the surface oxidation during the heating process, the argon inert gas was supplied to the vicinity of the wire. And, this paper shows the correlation between the tension and the current when arson gas supplied to the tungsten wire. Through several experiments, the optimal tension and current were found. Also, higher straightness $({\approx}1{\mu}m/1000{\mu}m)$ and roundness$(<{\Phi}{\pm}2{\mu}m/100{\mu}m)$ founded when $500{\mu}600gf$ tension and 1.5 ampere.

• Journal of the Korean institute of surface engineering
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• v.29 no.5
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• pp.549-555
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• 1996

Diamond Like Carbon film is amorphous film which is considered to consist of three coordinate graphite structure and tetrahedron coordinate diamond structure. Its hardness, thermal conductivity and chemical stability are nearly to one of diamond. It is well known to become semi-conductor by doping of inpurity. In this study Diamond Like Carbon film was synthesized by Microwave Plasma CVD in the gas mixture of hydrogen-methan-nitrogen and doped of nitrogen on the single-crystal silicon or silica glass. The temperature of substrate and nitrogen concentration in the gas mixture had an effect on the bonding state, structural properties and conduction mechanism. The surface morphology was observed by Scanning Electron Microscope. The strucure was analyzed by laser Raman spectrometry. The bonding state was evaluated by electron spectroscopy. Diamond Like Carbon film synthesized was amorphous carbon containing the $sp^2$ and $sp^3$ carbon cluster. The number of $sp^2$ bonding increased as nitrogen concentration increased from 0 to 40 vol% in the feed gas at 1233K substrate temperature and at $7.4\times10^3$ Pa. Increase of nitrogen concentration made Diamond Like Carbon to be amorphous and the doze of nitragen could be controlled by nitrogen concentration of feed gas.