• 제목/요약/키워드: SEM VDP

검색결과 3건 처리시간 0.02초

Erbium 도핑된 p-GaSe 단결성의 홀 효과 특성 (Hall-effect Properties of Single Crystal Semiconductor p-GaSe Dopes with $Er^{3+}$)

  • 이우선;김남오;손경춘
    • 한국전기전자재료학회논문지
    • /
    • 제13권1호
    • /
    • pp.1-5
    • /
    • 2000
  • Optical and electrical properties of GaSe:Er\ulcorner single crystals grown by the Bridgenman technique have been investigated by using optical absorption and h\Hall-effect measurement system. The Hall coefficients were mea-sured by using a high impedance electrometer in the temperature range from 360K to 150K. The temperature dependence of hole concentration show the characteristic of a partially compensated p-type semiconductor. Carrier density(N\ulcorner) of GaSe doped with Erbium was measured about 3.25$\times$10\ulcorner [cm\ulcorner] at temperature 300K, which was higher than undoped specimen. Photon energy gap (E\ulcorner) of GaSe:Er\ulcorner specimen was measured about 1.79eV.

  • PDF

진공증착중합법을 이용한 6FDA/4-4'DDE 폴리이미드 박막의 제조와 전기적 특성 (Electrical Properties and Preparation of 6FDA/4-4'DDE Polyimide Thin Films by Vapor Deposition Polymerization Method)

  • 황선양;이붕주;김형권;김영봉;박강식;임헌찬;강대하;박광현;이덕출
    • 대한전기학회:학술대회논문집
    • /
    • 대한전기학회 1998년도 하계학술대회 논문집 D
    • /
    • pp.1487-1489
    • /
    • 1998
  • In this paper, thin films of PI were fabricated VDPM of dry processes which are easy to control the film's thickness and hard to pollute due to volatile solvents. From FT-lR, PAA thin films fabricated by VDP were changed to PI thin films by thermal curing. From SEM, AFM and Ellipsometer experimental, as the higher curing temperatures the films thickness decreases and reflectance increases. Therefore, Pl could be fabricated stable by increasing curing temperature. The relative permitivity and dissipation loss factor were 3.7 and 0.008. Also, the resistivity was about $1.05{\times}10^{15}{\Omega}cm$ at $30^{\circ}C$.

  • PDF

자기절연회복법에 의한 폴리아미드 박막의 절연파괴특성 (The Electric Breakdown Chatacteristics of Polyimide Thin Films by Self Healing Method)

  • 김형권;이은학;박종관
    • 전자공학회논문지T
    • /
    • 제36T권2호
    • /
    • pp.1-7
    • /
    • 1999
  • 본 연구는 진공증착중합법에 의해 폴리이미드를 제작하고 박막의 절연파괴특성을 자기절연회복법에 의해 측정하였다. PMDA(Pyromellitic dianhydride)와 DDE(4,4'-diaminodiphenyl ether)를 증착 중합하여 Polyamic-acid(PAA)를 형성하고 이를 열처리함으로서 폴리이미드를 제조하였다. 제조된 박막의 특성을 조사하기 위해 주사형 전자현미경(SEM), 적외선분광장치(FT-IR) 및 오저전자분광장치(AES)를 사용하였다. 절연파괴특성 실험은 동일 시료에서 50회를 반복하였으며 25회 이상에서 절연파괴전계는 포화되었다. 열처리 온도를 200${^\circ}C$, 250$^{\circ}C$, 300$^{\circ}C$ 및 350${^\circ}C$로 변화했을 때 절연파괴전계는 1.21MV/cm, 3.94MV/cm, 4.61MV/cm, 4.55MV/cm로 변화하였다.

  • PDF