• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
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• pp.179.1-179.1
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• 2013

Cylindrical Rotating Magnetron Sputtering Cathode (이하 Rotary Cathode)는 기존에 사용 되던 rectangular type 보다 Target 사용 효율이 높다는 큰 이점을 가지고 있다. 높은 Target 사용 효율은 비용 절감 효과와 직접적으로 관련 된다. 이번 연구는 3D Plasma simulation(PIC-MCC)을 통한 Target 사용 효율 80% 이상의 Rotary Cathode 개발을 목적으로 한다. Plasma simulation에 External Magnetic fields를 접목하여 Electron의 이동 궤적을 제어하였고, 생성된 Ion (Ar+)의 밀도 및 속도로 Plasma의 안정성과 Erosion 계산 구간을 선정 하였다. Target Erosion Profile은 Sputtering yield Data와 Target에 충돌한 Ion 정보를 사용하여 산출 하였으며, Sputtered Particles의 Deposition Profile은 계산된 Target Erosion Profile과 The cosine law of emission을 이용하여 계산 하였다. 실험 조건은 Plasma simulation의 초기조건 바탕으로 하여 2G size의 ITO Target을 대상으로 실험 하였다. 비 Erosion 영역 최소화하기 위해 Magnet Length를 변경하여 제작 적용 하였다. Simulation 계산 시간의 제약으로 인하여 simulation에서 생성된 최대 이온 밀도는 일반적으로 알려진 값 보다 적게 계산 되었지만, Simulation으로 예측한 Erosion Profile 및 Deposition Profile은 실험 값과 유사한 형태를 나타났으며, 실험 결과는 Target 사용 효율 80%이상의 결과를 보였다.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제52권1호
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• pp.19-24
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• 2003

Design and test results of a VRAG(Vacuum Rotary Arc Gap) switch were presented. To control the damage of electrodes caused by the vacuum arc, Lorentz's force by the radial magnetic field between spiral electrodes was used to rotate the vacuum uc. VRAG switch electrodes were made of the material of CuCr and OFHC. Gap distance between two spiral type electrodes for the rotation of the arc discharge is 8, 10, 12mm. In the cathode, one trigger electrode was inserted into each spiral wing. Normal operation of the VRAG switch was confirmed with 10.6[$mutextrm{s}$]of trigger delay and 2~3[$mutextrm{s}$] of the jitter time. The speed of the vacuum arc was measured to be 0.6 ~ 1[km/s] by a motion analyzer.

• Journal of Information Display
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• 제12권2호
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• pp.89-92
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• 2011

Advanced static DC magnetron sputtering methods based on the magnet wobbling technique were investigated to achieve highly uniform and homogeneous metallization layers. The novel split sputter mode (SSM) method, wherein the deposition process is divided into two distinct steps, enables the AKT rotary cathode technology to provide excellent layer properties, while keeping a high production throughput. The effectiveness of theSSMtechnique was demonstrated through copper-coated large-area substrates.

• 한국유체기계학회 논문집
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• 제11권2호
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• pp.29-37
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• 2008

Air supply is required to the cathode of fuel cells for the provision of oxygen to produce electricity through chemical reaction with hydrogen in the cell, and supplied air should be free of impurities such as oil mist and tiny particles separated from sliding surfaces. Hence, air compressor for fuel cell air supply must be oil-less type and have no severe sliding surfaces inside. This paper introduces the concept of single-vane type rotary air compressor whose structure is particularly suitable for the fuel cell application: sliding action of the vane against the cylinder wall, which causes severe friction in the conventional vane rotary compressors, is made to be prevented by attaching the vane to the driving shaft with the compliant device between the vane and the rotor in this new design. For 2 kW fuel cell application, preliminary design has been carried out, and its performance has been estimated by using computer simulation program: for discharge pressure of 2 bar, the volumetric, adiabatic, and mechanical efficiencies are calculated to be 82.5%, 92.5%, and 96.3%, respectively.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2003년도 하계학술대회 논문집 C
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• pp.1692-1694
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• 2003

펄스파워 시스템의 핵심은 스위치로서 현재까지 상당히 많은 종류가 개발되어 왔다. 이들 스위치는 구조 및 성능에 따라 장단점이 다르므로 목적에 적합한 시스템을 고려해 선택하여 사용되어 왔다. 일예로 펄스폭이 긴파형의 전류는 아크를 소화할수 있는 장치가 필요하다. 따라서 본 논문에서는 진공중의 두전극 (anode - cathode)을 나선형으로 제작하여 실험 하였다. 이방식은 결과적으로 아크를 회전시켜서 소호를 시키는 방식을 이용하였는데 전극의 수명을 연장시키는 효과를 얻을수 있었다.

• 한국표면공학회지
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• 제8권2호
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• pp.1-6
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• 1975

A novel electroplating process is described and effects of anode lay-out thickness distribution and on platiting rate are discussed. Microphotograhic analysis indicates are compact and less "POROUS " than of barrel and rack. With this process production cost reduction and capacity increase could be achieved by a rate of 60% and 97% respectively, as compared to our present barrel plating process. This process disclose a number of beneficial processes such as color coding system on TO-92 package and development of a new tin bath formula.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2000년도 추계학술발표회 초록집
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• pp.1-2
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• 2000

In chip plating, several parameters must be taken into consideration. Current density, solution concentration, pH, solution temperature, components volume, chip and media ratio, barrel geometrical shape were most likely found to have an effect to the process yields. The 3 types of barrels utilized in chip plating industry are the onventional rotating barrel, vibrational barrel(vibarrel), and the centrifugal type. Conventional rotating barrel is a close type and is commonly used. The components inside the barrel are circulated by the barrel's rotation at a horizontal axis. Process yield has known to have higher thickness deviation. The vibrational barrel is an open type which offers a wide exposure to electrolyte resulting to a stable thickness deviation. It rotates in a vertical axis coupled with multi-vibration action to facilitate mixed up and easy transportation of components. The centrifugal barrel has its plated work centrifugally compacted against the cathode ring for superior electrical contact with simultaneous rotary motion. This experiment has determined the effect of barrel vibration intensity to the plating thickness distribution. The procedures carried out in the experiment involved the overall plating process., cleaning, rinse, Nickel plating, Tin-Lead plating. Plating time was adjusted to meet the required specification. All other parameters were maintained constant. Two trials were performed to confirm the consistency of the result. The thickness data of the experiment conducted showed thatbthe average mean value obtained from higher vibrational intensity is nearer to the standard mean. The distribution curve shown has a narrower specification limits and it has a reduced variation around the target value. Generally, intensity control in vi-barrel facilitates mixed up and easy transportation of components. However, it is desirable to maintain an optimum vibration intensity to prevent solution intrusion into the chips' internal electrode. A cathodic reaction can occur in the interface of the external and internal electrode. 2H20 + e $\rightarrow$M/TEX> 20H + H2.. Hydrogen can penetrate into the body and create pressure which can cause cracks. At high intensity, the chip's motion becomes stronger, its contact between each other is delayed and so plating action is being controlled. However, the strong impact created by its collision can damage the external electrode's structure there by resulting to bad plating condition.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 1999년도 추계학술발표회 초록집
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• pp.15-15
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• 1999

In chip plating, several parameters must be taken into consideration. Current density, solution concentration, pH, solution temperature, components volume, chip and media ratio, barrel geometrical shape were most likely found to have an effect to the process yields. The 3 types of barrels utilized in chip plating industry are the conventional rotating barrel. vibrational barrel (vibarrel), and the centrifugal type. Conventional rotating barrel is a close type and is commonly used. The components inside the barrel are circulated by the barrel's rotation at a horizontal axis. Process yield has known to have higher thickness deviation. The vibrational barrel is an open type which offers a wide exposure to electrolyte resulting to a stable thickness deviation. It rotates in a vertical axis coupled with multi-vibration action to facilitate mixed up and easy transportation of components, The centrifugal barrel has its plated work centrifugally compacted against the cathode ring for superior electrical contact with simultaneous rotary motion. This experiment has determined the effect of barrel vibration intensity to the plating thickness distribution. The procedures carried out in the experiment involved the overall plating process., cleaning, rinse, Nickel plating, Tin-Lead plating. Plating time was adjusted to meet the required specification. All other parameters were maintained constant. Two trials were performed to confirm the consistency of the result. The thickness data of the experiment conducted showed that the average mean value obtained from higher vibrational intensity is nearer to the standard mean. The distribution curve shown has a narrower specification limits and it has a reduced variation around the target value, Generally, intensity control in vi-barrel facilitates mixed up and easy transportation of components, However, it is desirable to maintain an optimum vibration intensity to prevent solution intrusion into the chips' internal electrode. A cathodic reaction can occur in the interface of the external and internal electrode. $2HD{\;}+{\;}e{\;}{\rightarrow}20H{\;}+{\;}H_2$ Hydrogen can penetrate into the body and create pressure which can cause cracks. At high intensity, the chip's motion becomes stronger, its contact between each other is delayed and so plating action is being controlled. However, the strong impact created by its collision can damage the external electrode's structure thereby resulting to bad plating condition. 1 lot of chip was divided into two equal partion. Each portion was loaded to the same barrel one after the other. Nickel plating and tin-lead plating was performed in the same station. Portion A maintained the normal barrel vibration intensity and portion B vibration intensity was increased two steps higher. All other parameters, current, solution condition were maintained constant. Generally, plating method find procedures were carried out in a best way to maintained the best plating condition. After plating, samples were taken out from each portion. molded and polished. Plating thickness was investigated for both. To check consistency of results. 2nd trial was done now using different lot of another characteristics.