• Journal of the Korean Wood Science and Technology
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• v.35 no.5
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• pp.76-86
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• 2007

This study was conducted to investigate the effects of formaldehyde to urea (F/U) mole ratio on thermomechanical curing of UF resin adhesives with different F/U mole ratios. Thermomechanical curing of these UF resin adhesives was characterized using parameters of dynamic mechanical analysis (DMA) such as the gel temperature, maximum storage modulus, and peak temperatures of storage and loss modulus. As the F/U mole ratio decreased, the gel temperature of UF resin adhesives increased. The maximum storage modulus as an indicator of the rigidity of UF resin adhesives decreased with decreasing F/U mole ratio. The peak temperature of tan $\delta$ increased with decreasing F/U mole ratio, indicating that the vitrification occurred faster for high F/U mole ratio of UF resin adhesives than for the one of lower F/U mole ratio. These results partially explained the reason why UF resin adhesives with lower F/U mole ratio resulted in relatively poor adhesion performance when they were applied.

• Journal of the Korean Wood Science and Technology
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• v.21 no.1
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• pp.51-58
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• 1993

The phenol resorcinol formaldehyde resin (PRF) adhesives which are curing at ambient temperature for structural purposes were synthesized. A PRF resin is produced according to the two-stage reaction system. In first stage, a low-condensed resol or methylolated phenol were prepared from phenol by reaction with a formaldehyde in alkaline condition. The molar ratio of phenol to formaldehyde was 1.0~1.4. And in second-stage, resorcinol was added to combine with the methylol group of a low-condensed resol(R/P molar ratio 0.3). The glue-joint strength, pot-life and workability of this synthetic PRF resin were superior to conventional ambient temperature setting adhesives such as oilic urethane or water based polymer-isocyanate resin for wood adhesives.

• Journal of the Korean Wood Science and Technology
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• v.35 no.5
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• pp.67-75
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• 2007

As a part of abating the formaldehyde emission of urea-formaldehyde (UF) resin adhesive by lowering formaldehyde to urea (F/U) mole ratio, this study was conducted to investigate properties of UF resin adhesive with different F/U mole ratios. UF resin adhesives were synthesized at different F/U mole ratios of 1.6, 1.4, 1.2, and 1.0. Properties of UF resin adhesives measured were non-volatile solids content, pH level, viscosity, water tolerance, specific gravity, gel time and free formaldehyde content. In addition, a linear relationship between non-volatile solids content and sucrose concentration measured by a refractometer was established for a faster determination of the non-volatile solids content of UF resin. As F/U mole ratio was lowered, non-volatile solids content, pH, specific gravity, water tolerance, and gel time increased while free formaldehyde content and viscosity were decreased. These results suggested that the amount of free formaldehyde strongly affected the reactivity of UF resin. Lowering F/U mole ratio of UF resin as a way of abating formaldehyde emission consequently requires improving its reactivity.

• Journal of the Korean Wood Science and Technology
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• v.33 no.5 s.133
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• pp.66-75
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• 2005

Soybean-based adhesives have recently been reconsidered as alternatives to petroleum-based adhesives due to the uncertainty of availability of petrochemical products and the increased demand for wood adhesives. This study was conducted to investigate the adhesive properties of alkaline phenolic soy (APS) resin for hybrid poplar flakeboard. The APS resin was formulated by crosslinking an alkaline soy flour hydrolyzate with lab-prepared PF resin in the soy hydrolyzate to PF resin weight ratios of 70/30, 60/40, and 50/50. The APS resins were used to fabricate homogeneous hybrid poplar flakeboards with different resin solid levels (5%, 7%, and 9%), press temperatures (175 and $200^{\circ}C$), and press times of 8 and 10 minutes. The IB, wet MOR, and dimensional stability properties of board improved with increasing press time, press temperature, and PF level in APS resins. Increasing press time can be used to offset poor IB strength associated with a 9% resin solid level and the excessive moisture content in the mat. The following conditions were concluded to meet the requirements of the CSA standard for exterior-grade flakeboard: a 50% PF level, a 5% resin content, a $200^{\circ}C$ press temperature, and an 8 minute press time.

• Journal of the Korea Furniture Society
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• v.10 no.1
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• pp.65-71
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• 1999

The bending performance of sloped finger-jointed Rhus verniciflua were tested in order to improve the strength properties of finger-joint. Sloped finger-cut pieces were jointed with three kinds of adhesives (polyvinyl acetate, polyvinyl-acryl acetate and oilic resin). The slope ratios of finger joints were 0, 1.0, 1.5, and 2.0. The MOE, MOR and deflection to maximum load in bending of sloped finger-joints and solid wood specimen were measured. The results were : 1) The efficiencies of MOE to finger and sloped finger-joints to the solid wood were almost same in the three kinds of adhesives(polyvinyl acetate, polyvinyl-acryl acetate and oilic urethane resin) and there were some effect of slope on the MOE in a sloped finger-joint for three kinds of resin adhesives. 2) There was the effect of slope on the MOR in sloped finger-joints in every kind of adhesive. The efficiencies of MOR in slope ratios of 0 and 2.0 ranged 65-79%, respectively. There was also a slight effect of the kinds of adhesives on the MOR. However, the efficiencies of deflection to the urethane resin adhesive were much less than those of polyvinyl acetate, polyvinyl-acryl acetate resin adhesives except the slope ratio of 0. 3) It might be impossible to estimate the bending stregth of sloped finger-jointed Rhus verniciflua by using MOE. The correlation coefficient(0.192) between MOE was very low and not significant at 5% level.

• Journal of the Korean Wood Science and Technology
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• v.33 no.5 s.133
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• pp.57-65
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• 2005

Following our previous reports for finger-jointed woods with various finger profiles studied for the efficient use of small diameter logs and woods containing various defects, twelve types of finger-jointed woods glued with three kinds of adhesives and with two sizes of finger pitches were made with sitka spruce and red pine. The effects of the adhesives and finger pitches on bending creep performances of finger-jointed woods were investigated. The shape of creep curves differed among the used adhesives and finger pitches of finger-jointed woods for both tested species. Their creep curves showed a linear behavior beyond about one hour, and the N values fitted to power law increased with increasing finger pitches. The initial deformation increased with increasing finger pitches, regardless of the tested species and kinds of adhesives, whereas the effect of finger pitches on the creep deformation was not clear. For finger-jointed woods glued with polyvinyl acetate (PVAc) resin, creep failure occurred in 106 hours after the load was applied. And the difference of the creep compliance between finger-jointed woods glued with resorcinol-phenol formaldehyde (RPF) resin and aqueous vinyl urethane (AVU) resin was small. The ratios for creep performances of finger-jointed woods glued with RPF resin and AVU resin versus solid wood were higher in creep deformation than initial deformation for both species, and the difference between both adhesives was not found. The relative creep decreased with increasing finger pitches, and the marked differences was not found between RPF resin and AVU resin.

• Journal of the Korean Wood Science and Technology
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• v.36 no.2
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• pp.63-72
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• 2008

As a part of abating formaldehyde emission of urea-formaldehyde (UF) resin adhesive, this study was conducted to investigate chemical structures of UF resin adhesives with different formaldehyde/urea (F/U) mole ratios, using carbon-13 nuclear magnetic resonance ($^{13}C$-NMR) spectroscopy. UF resin adhesives were synthesized at four different F/U mole ratios such as 1.6, 1.4, 1.2, and 1.0 for the analysis. The analysis $^{13}C$-NMR spectroscopy showed that UF resin adhesives with higher F/U mole ratios (i.e., 1.6 and 1.4) had two distinctive peaks, indicating the presence of dimethylene ether linkages and methylene glycols, a dissolved form of free formaldehyde. But, these peaks were not detected at the UF resins with lower F/U mole ratios (i.e., 1.2 and 1.0). These chemical structures present at the UF resins with higher F/U mole ratios indicated that UF resin adhesive with higher F/U mole ratio had a greater contribution to the formaldehyde emission than that of lower F/U mole ratio. Uronic species were detected for all UF resins regardless of F/U mole ratios.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2018.11a
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• pp.79-80
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• 2018

Recently, the interest in remodeling of new and old buildings is increasing worldwide. As a result, the frequency of use of architectural adhesives has increased. Currently, adhesives used in buildings are made of organic materials in most cases, and epoxy resin adhesives are most widely used. However, epoxy resin adhesives contain formaldehyde and VOCs in the room during construction, which can cause sick house syndrome. In case of building fire, it may cause damage due to carbon monoxide generated from organic materials. It is urgent to study the problem of epoxy fill adhesive made of such organic materials. Therefore, the purpose of this study is to investigate the effect of the adhesion of epoxy resin adhesive, which is a problem of epoxy resin adhesive, which is an existing organic adhesive by using inorganic materials such as magnesia and phosphate, And the inorganic adhesive which does not emit the release amount as an inorganic material.

• Journal of the Korean Wood Science and Technology
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• v.45 no.4
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• pp.409-418
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• 2017

This work attempted to manufacture glued-laminated timber (Glulam) bonded with melamine-urea-formaldehyde (MUF) resin adhesives at various melamine contents from 20% to 50% under high frequency (HF) heating for a very short time. Two preparation methods were employed to prepare MUF resin adhesives with different melamine contents: one-batch method of synthesizing MUF resins in a single batch, and two-batch method of mixing urea-formaldehyde (UF) resin with melamine-formaldehyde (MF) resin that had been synthesized separately. As the melamine content increased, the gelation time and peak temperature of MUF resins decreased. The adhesion performance of plywood showed that the one-batch MUF resin adhesive with 50% melamine content only satisfied the standard requirement of water resistance. Thus, the one-batch MUF resin adhesive with 50% melamine content was applied for bonding wood lamina from four softwood species such as Japanese larch, Korean red pine, Korean pine and Japanese cedar to manufacture Glulam under HF heating. All Glulam samples bonded with the one-batch MUF resin adhesives with 50% melamine content except those from Korean Red Pine satisfied the requirement in water soaking or boiling water delamination test as an exterior grade Glulam. The presence of rosin in Korean Red Pine was believed to be responsible for its poor adhesion. These results showed that the one-batch MUF resin adhesives with 50% melamine content provided acceptable water resistance with exterior grade Glulam manufactured under HF heating.

• Journal of Adhesion and Interface
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• v.11 no.4
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• pp.155-161
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• 2010

A series of ethylene vinyl acetate (EVA) based hot melt adhesives containing different types and compositions of tackifier resins were prepared to investigate their rheological behavior and T-peel adhesion strength on polyurethane (PU) elastomeric sheets. C5 aliphatic hydrocarbon resin (C5 resin), C9 aromatic hydrocarbon resin (C9 resin), hydrogenated dicyclopentadiene resin ($H_2$-DCPD resin), and dicyclopentadiene and acrylic monomer copolymer resin (DCPD-acrylic resin) were used as the tackifiers for the hot melt adhesives. To determine the polarity of the tackifiers, their oxygen contents were analyzed, and the DCPDacrylic resin was found to contain an oxygen content higher than the other tackifiers. Only the DCPD-acrylic resin showed complete miscibility with EVA and the homogeneous phase of the hot melt adhesive blends at all compositions. The T-peel adhesion strength between the hot melt adhesives and polyurethane elastomeric sheets was mainly affected by the polarity of the tackifier resins in the hot melt adhesives, rather than by the storage moduli, G', of the hot melt adhesives themselves.