• Title/Summary/Keyword: Residual stress profile

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The Effect of Drive-in Process Temperature on the Residual Stress Profile of the p+ Thin Film (후확산 공정 온도가 p+ 박막의 잔류 응력 분포에 미치는 영향)

  • Jeong, O.C.;Park, T.G.;Yang, S.S.
    • Proceedings of the KIEE Conference
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    • 1998.07g
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    • pp.2533-2535
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    • 1998
  • In this paper, an effect of drive-in process temperature on the residual stress profile of the p+ silicon film has been investigated. The residual stress profile has been calculated as the fourth-order polynomials. All coefficients of the polynomials have been determined from the measurement of the vertical deflections of the p+ silicon cantilevers with various thickness and the tip displacement of the p+ silicon rotating beam. From the determination results of the residual stress profile, the average stress of the film thermally oxidized at 1000 $^{\circ}C$ is 15 MPa and that of the film oxidized at 1100 $^{\circ}C$ is 25 MPa. The profile of the residual stress through the high temperature drive-in process has a steeper gradient than the other case.

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Influence of residual stress due to shot peening on fatigue strength and life (피로강도 및 수명에 미치는 Shot Peening에 의한 잔류응력의 영향)

  • Lee, Jong-Gyu;Kim, Jeong-Gyu
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.21 no.9
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    • pp.1498-1506
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    • 1997
  • Procedures are presented for influence of shot peening on fatigue strength, fatigue life and effects of shot peening are discussed from experiments were taken between shot peened and unpeened SPS5, SM45C specimens. After the residual stress on shot peened specimens was measured by X-ray diffractometer, rotating bending fatigue tests were carried out. In addition, the compressive residual stress profile was obtained by the superposition method of three stresses which is based on Al-Obaid's equation. Predicted fatigue life considering residual stress profile which was obtained by the Al-Obaid's equation and another predicted fatigue life considering residual stress profile which was measured in test were compared. For the purpose of predicting fatigue life, Morrow's equation considering the residual stress and mean stress was used.

The Effects of the Drive-in Process Parameters on the Residual Stress Profile of the $p^+$ Silicon Thin Film (후확산 공정 조건이 $p^+$ 실리콘 박막의 잔류 응력 분포에 미치는 영향)

  • Jeong, Ok-Chan;Park, Tae-Gyu;Yang, Sang-Sik
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.48 no.9
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    • pp.665-671
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    • 1999
  • The paper represents the effects of the drive-in process parameters on the residual stress profile of the $p^+$ silicon film. Since the residual stress profile is notuniform along the direction normal to the surface, the residual stress is assumed to be a polynomial function of the depth. All the coefficients of the polynomial can be determined by measuring of the thicknesses and the deflections of cantilevers and the deflection of a rotating beam with a surface profiler meter and a microscope. As the drive-in temperature or the drive-in time increases, the boron concentration decreases and the magnitude of the average residual tensile stress decreases. Then, near the surface of the $p^+$ film the residual tensile stress is transformed into the residual compressive stress and its magnitude increases.

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Effects of Drive-in Process Parameters on the Residual Stress Profile of the p+ Silicon Film (후확산 공정 변수가 p+ 실리콘 박막의 잔류 응력 분포에 미치는 영향)

  • Jeong, Ok-Chan;Yang, Sang-Sik
    • Proceedings of the KIEE Conference
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    • 2002.11a
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    • pp.245-247
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    • 2002
  • The paper represents the effects of the drive-in process parameters on the residual stress profile of the p+ silicon film. For the quantitative determination of the residual stress profiles, the test samples are doped via the fixed boron diffusion process and four types of the thermal oxidation processes and consecutively etched by the improved process. The residual stress measurement structures with the different thickness are simultaneously fabricated on the same silicon wafer. Since the residual stress profile is not uniform along the direction normal to the surface, the residual stress is assumed to be a polynomial function of the depth. All of the coefficients of the polynomial are determined from the deflections of cantilevers and the displacement of a rotating beam structure. As the drive-in temperature or the drive-in time increases, the boron concentration decreases and the magnitude of the average residual tensile stress decreases. Also, near the surface of the p+ film the residual tensile stress is transformed into the residual compressive stress and its magnitude increases.

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The Effects of the Drive-in Process Parameters on the Residual Stress Profile of the p+ Thin Film (후확산 공정 조건이 p+ 박막의 간류 응력 분포에 미치는 영향)

  • Park, T.G.;Jeong, O.C.;Yang, S.S.
    • Proceedings of the KIEE Conference
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    • 1998.11c
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    • pp.1007-1009
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    • 1998
  • In this paper, the effects of the drive-in process parameters on the residual stress profile of the p+ silicon film has been investigated. All the residual stress profile has been estimated by the second-order polynomial. All the coefficients of the polynomial have been determined from the measurement of the deflections of cantilevers and a rotating beam by using a surface profiler meter and by means of focusing a calibrated microscope. As the drive-in temperature or the drive-in time increases, the boron concentration decreases and the magnitude of the average residual stress decreases. If the boron concentration decreases the tensile residual stress decreases except near the surface where the magnitude of compressive residual stress increases.

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A Numerical Model for Prediction of Residual Stress Using Rayleigh Waves

  • Yuan, Maodan;Kang, To;Kim, Hak-Joon;Song, Sung-Jin
    • Journal of the Korean Society for Nondestructive Testing
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    • v.31 no.6
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    • pp.656-664
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    • 2011
  • In this work, a numerical model is proposed for the relation between the magnitudes and the depth residual stress with the velocity of Rayleigh wave. Three cases, stress-free, uniform stress and layered stress, are investigated for the change tendency of the Rayleigh wave speed. Using the simulated signal with variation of residual stress magnitude and depth, investigation of the parameters for fitting residual stress and velocity change are performed. The speed change of Rayleigh wave shows a linear relation with the magnitude and an exponential relation with the depth of residual stress. The combination of these two effects could be used for the depth profile evaluation of the residual stress.

Moving Temperature Profile Method for Efficient Three-Dimensional Finite Element Welding Residual Stress Analysis for Large Structures (대형구조물의 효율적 3차원 용접잔류응력해석을 위한 새로운 이동 온도 프로파일 방법)

  • Cheol Ho Kim;Jae Min Gim;Yun Jae Kim
    • Transactions of the Korean Society of Pressure Vessels and Piping
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    • v.19 no.2
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    • pp.75-83
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    • 2023
  • For three-dimensional finite element welding residual stress simulation, several methods are available. Two widely used methods are the moving heat source model using heat flux and the temperature boundary condition model using the temperature profile of the welded beads. However, each model has pros and cons in terms of calculation times and difficulties in determining welding parameters. In this paper, a new method using the moving temperature profile model is proposed to perform efficiently 3-D FE welding residual stress analysis for large structures. Comparison with existing experimental residual stress measurement data of two-pass welding pipe and SNL(Sandia National Laboratories) mock-up canister shows the accuracy and efficiency of the proposed method.

Taper Tension Logic for Optimization of Residual Stresses in Roll-to-Roll Winding Systems (롤투롤 시스템에서 감김롤 내부 잔류응력 최소화를 위한 테이퍼 장력 설정 기법)

  • Lee, Jongsu;Lee, Changwoo
    • Journal of the Korean Society for Precision Engineering
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    • v.32 no.12
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    • pp.1011-1016
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    • 2015
  • In a roll-to-roll continuous system, winding is one of the most important processes since it determines the quality of the final manufactured products such as flexible film and printed electronic devices. Since an adequate winding tension can reduce the incidence of the defects that are derived from the inner stress of the wound roll such as starring and telescoping, it is necessary to determine the optimal taper-tension profile. In this study, an algorithm for the setting of an optimal taper-tension profile in consideration of the residual stress in the wound roll is suggested; furthermore, the algorithm was adjusted for the determination of an optimal taper-tension profile regarding the winding process of $10{\mu}m$ polypropylene (PP) film. As a result of the algorithm-generated, optimal taper-tension profile, the residual stress and radial stress in a PP wound roll were decreased to 27.37 % and 40.05 % (mean value), respectively.

PREDICTION OF RESIDUAL STRESS PROFILE IN SINGLE-SIDED BUTT WELD USING COMPLIANCE METHOD

  • Kim, Yooil;Jeon, Yu-Chul;Kang, Joong-Kyoo;Han, Yong-Sub
    • Proceedings of the KWS Conference
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    • 2002.10a
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    • pp.156-161
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    • 2002
  • It depends on the joint configuration, dimensions and constraints on the joint whether the residual stress at the root of single-sided butt weld is tensile or not. Therefore, recommendation is generally made that high R ratio should be used in the fatigue test of this type of joint in order to prevent excessively long life caused by compressive residual stress. in this research, the residual stress profile in butt weld joint was obtained through compliance method, using successive extension of a slot and measurement of the variation of strain during the slot extension. The residual stress profile was firstly assumed to be the linear summation of Legendre polynomials up to 9th order excluding 0th and 1st order. Strain variation on the surface was measured while the slot was being extended by cutting to find out the 8 unknown coefficients of each polynomial tenn. The cut was made by the electric discharge machine. It was concluded that the residual stress near the surface stayed positive, however, it turned into the negative value as soon as it passed through 2 or 3 mm depth. Several fatigue tests were also carried out under zero stress ratio. Test results showed that fatigue life coincides well with the design cuive of butt joint in British Standards, which supports that it is tensile residual stress that exists near the weld root.

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The Finite Element Analysis for Prediction of Residual Stresses Induced by Cold Expansion (홀확장 잔류응력 예측을 위한 유한요소해석)

  • Kim, Cheol;Yang, Won-Ho;Ko, Myung-Hoon;Heo, Sung-Pil;Hyun, Cheol-Seung
    • Proceedings of the KSME Conference
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    • 2000.11a
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    • pp.470-474
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    • 2000
  • Cold expansion of fastener holes is a mechanical process widely used in the aerospace industry. This treatment leads to an improvement of fatigue behavior due to the developed compressive residual stresses on the hole surface. The residual stress profile depends on the parameters of cold expansion, which are, expanding rate, inserting direction of mandrel, material properties etc. and the method to confirm this profile is only measurement by X-ray diffractometer. Despite its importance to aerospace industries, little attention has been devoted to the accurate modelling of the process. In this paper, Two-dimensional axisymmetric finite element simulations have been conducted for the cold expansion in an aluminium plate in order to predict the magnitude and distribution of the residual stress and plastic deformation. Maximum compressive residual stress could be increase about 7 percent using the 2-step cold expansion method.

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