• Archives of Pharmacal Research
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• v.19 no.6
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• pp.551-553
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• 1996

A genuine dammarane glycoside, named ginsenoside $Rg_{5}$, has been isolated by repeated column chromatography and preparative HPLC from the MeOH extract of Korean red ginseng (Panax ginseng C.A. Meyer). The chemical structure of ginsenoside$ Rg_{5}$ was determined as $3-O-[{\beta}-D-glucopyranosyl (1{\rightarrow}2)-{\beta}-D-glucopyranosyl]$ dammar-20(22), $24-diene-3{\beta},12{\beta}-diol$ by spectral and chemical methods. The stereostructure of a double bond at C-20(22) of ginsenoside $Rg_{5}$ was characterized as (E) from the chemical shift of C-21 in the $^{13}C-NMR $and a NOESY experiment in the $^{1}H-NMR$.

• Journal of the Korean Society for Railway
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• v.10 no.1 s.38
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• pp.39-44
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• 2007

This rafer explains a durability test of a large train car body made of carbon/epoxy composite material. The composite car body with the length of 23m was manufactured as a sandwich structure composed of an aluminum honeycomb core and CF1263 woven fabric carbon/epoxy faces. In order to evaluate durability of the composite car body, it was excited by two 500kN capacity hydraulic actuators installed underneath the body bolster. The natural frequency of the composite car body under full weight condition was found to be 4.33Hz. Based on this result, the excitation frequency and displacement of 5Hz and ${\pm}1.0mm$, respectively, were used as inputs for the durability test. The test was conducted for $2{\times}10^6$ cycles. During the test, the nondestructive tests using X-ray radiography and dye penetration method was performed to determine the presence of the cracks. Upon completion of the test, no cracks were found.

• Journal of the Korea Fashion and Costume Design Association
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• v.16 no.4
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• pp.137-156
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• 2014

This study focuses on the middle school textbook Technology Home Economics 2, revised in 2009, and aims to analyze the clothing-related contents within the Technology and Home Economics curriculum. All Korean elementary, middle and high school curricula have evolved through a number of changes and repeated revisions from their first versions, and reached their current seventh revised edition in 2009. Over this process, subjects connected to home economics have formed the following structure: Practical Courses in elementary school (5thand6thgrade)and Technology and Home Economics in middle and high school. The curriculum contents of the subjects Technology and Home Economics are divided into Development and Family, Clothing, Dietary Life, Habitation, Home Management and Consumption. Each curriculum teaches the students about its respective contents, e.g. Clothing brings the students in contact with clothing-related matters. Curricula and education methods help students find their own interests during middle and high school. Their school studies determine what majors they are seeking to choose in college and university. There are diverse university programs in Korea that are related to clothing. The above-mentioned textbook deals with clothing in the chapter Eco-friendly Clothing and Mending Habits. The results of this analysis shall help the development of the constantly changing textbook curricula, and furthermore become a reference to middle and high school students who aspire a practical and creative clothing education.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.11a
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• pp.132-135
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• 1999

Recently, the ceramics of high permittivity are applied to DRAM and FRAM. In this study, (B $a_{x}$ S $r_{l-x}$)Ti $O_3$(BST) ceramics thin films were prepared by Sol-Gel method. BST solution was made and spin-coated on Pt/ $SiO_2$/Si substrate at 4000 [rpm] for 10 seconds. Coated specimens were dried at 150[$^{\circ}C$] for 5 minutes. Coating process was repeated 3 times and then sintered at 750[$^{\circ}C$] for 30 minutes. Each specimen was analyzed structure and electrical characteristics. Thickness of BST ceramics thin films are about 2000($\AA$). Dielectric constant and loss of thin films was little decreased at 1[KHz] ~1[KHz]. Dielectric constant and loss to frequency were 250 and 0.02 in $Ba_{0.7}$S $r_{0.3}$Ti $O_3$. The properly of leakage current as the realation between the current and the voltage was that change of the leakage current was stable when the applied voltage was 0~3[V].

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05c
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• pp.149-153
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• 2003

Chemical mechanical polishing (CMP) technology for global planarization of multi-level inter-connection structure has been widely studied for the next generation devices. CMP process has been paid attention to planarized pre-metal dielectric (PMD), inter-layer dielectric (ILD) interconnections. Expecially, shallow trench isolation (STI) used to CMP process on essential. Recently, the direct STI-CMP process without the conventional complex reverse moat etch process has established by using slurry additive with the high selectivity between $SiO_2$ and $Si_3N_4$ films for the purpose of process simplification and n-situ end point detection(EPD). However, STI-CMP process has various defects such as nitride residue, tom oxide and damage of silicon active region. To solve these problems, in this paper, we studied the planarization characteristics using a high selectivity slurry(HSS). As our experimental results, it was possible to achieve a global planarization and STI-CMP process could be dramatically simplified. Also we estimated the reliability through the repeated tests with the optimized process conditions in order to identify the reproducibility of HSS STI-CMP process.

• Proceedings of the KIEE Conference
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• 2005.07c
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• pp.1924-1926
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• 2005

Poly(methyl methacrylate) (PMMA) is one of the promising representive of polymer gate dielectric for its high resistivity and sutible dielectric constant. PMMA (Mw=96700) films were prepared on p-Si by spin coating method. PMMA were coated compactively and flatly as observes by AFM. MIS(Al/PMMA/p-Si) structure was made and capacitance-voltage (C-V) and current-voltage (I-V) measurements were done with PMMA films for repeated annealing cycles at $100^{\circ}C$. 1-V measured at various delay times $(0{\sim}20sec)$ showed little change and the absence of hysteresis in the I-V characteristics with delay times, which eliminate the possibility of deep traps in the PMMA films. The observed thermal stability, smooth surfaces, dielectric constant, I-V behavior implies PMMA formed by spin coating can be used as an efficient gate dielectric layer in OTFTs.

• Journal of the Korean Society of Clothing and Textiles
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• v.24 no.2
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• pp.214-225
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• 2000

The objective of this study was to investigate images of Korean traditional patterns. The subjects consisted of 369 male and 356 female undergraduate students. The experimental materials used in this study were 48 stimuli and questionnaires, composed of 7-point semantic differential scales of 23 bipolar adjectives. Twelve motifs selected from 3 groups of Korean patterns were used as motif stimuli. Twelve repeated patterns were constructed from them to be applied on a CAD-simulated dress. The data was analyzed by factor analysis, ANOVA, Duncan's multiple range test. The major findings were as follows: 1. Four dimensions were emerged accounting for the dimensional structure of the images of Korean traditional patterns. These dimensions were 'simplicity', 'quality', 'interest', and 'modernity' dimension. Among them, 'simplicity' and 'quality' were the major dimensions. 2. Category, interpretation type, composition type, and application object of motif had significant effects on the images of above-mentioned dimensions. The application object had a significant effect on 'simplicity' and 'modernity' image, and the composition type on 'quality' and 'interest' image.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2017.10a
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• pp.575-577
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• 2017

In public key cryptography such as RSA, modular exponentiation is the most time-consuming operation. RSA's modular exponentiation can be computed by repeated modular multiplication. To attain high efficiency for RSA, fast modular multiplication algorithms have been proposed to speed up decryption/encryption. Montgomery multiplication is limited by the carry propagation delay from the addition of long operands. In this paper, we propose a hardware structure that reduces the area of the Montgomery multiplication implementation for lightweight applications of RSA. Experimental results showed that the new design can achieve higher performance and reduce hardware area. A frequency of 884.9MHz and 250MHz were achieved with 84K and 56K gates respectively using the 90nm technology.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07a
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• pp.20-23
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• 2004

As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing(CMP) process was required for the global planarization of inter-metal dielectric(IMD) layer with free-defect. However, as the IMD layer gets thinner, micro-scratches are becoming as major defects. Chemical-Mechanical polishing(CMP) of conductors is a key process in Damascene patterning of advanced interconnect structure. The effect of alternative commercial slurries pads, and post-CMP cleaning alternatives are discuss, with removal rate, scratch dentisty, surface roughness, dishing, erosion and particulate density used as performance metrics. Electroplated copper deposition is a mature process from a historical point of view, but a very young process from a CMP perspective. While copper electro deposition has been used and studied for decades, its application to Cu damascene wafer processing is only now gaining complete acceptance in the semiconductor industry. The polishing mechanism of Cu-CMP process has been reported as the repeated process of passive layer formation by oxidizer and abrasion action by slurry abrasives. however it is important to understand the effect of oxidizer on copper passivation layer in order to obtain higher removal rate and non-uniformity during Cu-CMP process. In this paper, we investigated the effects of oxidizer on Cu-CMP process regarding the additional volume of oxidizer.

• Fire Science and Engineering
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• v.31 no.4
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• pp.65-70
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• 2017

The seismic performance of press fittings is studied, which is one of the weldless joints of stainless steel pipe used in the water piping of recent fire protection system. The piping of this study was constructed based on the piping connection reference of NFPA 13. The permissible displacement of the piping was set as the allowed amount which is given in the Building Structure Standard, and the measurements were repeated 10 times. The Von-mises stress of the piping was 2.48 and 1.25 times of the allowed amount of stress, which was less than the standard, noted three times on the NPPs Allowable Stress for Level D service loading. Therefore, the press fittings shows enough seismic performance.