• Journal of the Korea Society of Computer and Information
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• v.18 no.9
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• pp.63-70
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• 2013

The multimedia data of game affects the immersion of the game depending on its quality. It is difficult to design the evaluation criteria of artistic quality of the data. But, in a technical point of view, it is possible to evaluate its quality. Thus, the design of evaluation standard can ensure the reliability and objectivity of quality. However, multimedia data quality evaluation metrics had not yet been designed. Therefore, in this study, we extracted quality evaluation elements of Game Multimedia Data, and verified the reliability of the elements. And we defined detailed evaluation items of each element, developed Multimedia Data Quality Evaluation Metrics. We expect that the results of this study will serve as a guide in the development of high-quality games, have a positive impact on the growth of the game industry.

• Journal of IKEEE
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• v.9 no.2 s.17
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• pp.143-151
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• 2005

Finite failure NHPP models proposed in the literature exhibit is either constant, monotonic increasing or monotonic decreasing failure occurrence rates per fault. For the sake of proposing shape parameter of the Gamma family distribution, used the special pattern. Data set, where the underlying failure process could not be adequately described by the knowing models, which motivated the development of the Gamma or Weibull model and Gompertz model. Analysis of failure data set that led us to the Gamma or Weibull model and Gompertz model using arithmetic and Laplace trend tests, bias tests was presented in this Paper.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.3
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• pp.67-74
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• 2011

Keys to high wiring density semiconductor packages include flip-chip bonding and build-up substrate technologies. The current issues are the establishment of a fine pitch flip-chip bonding technology and a low coefficient of thermal expansion (CTE) substrate technology. In particular, electromigration and thermomigration in fine pitch flipchip joints have been recognized as a major reliability issue. In this paper, electromigration and thermomigration in Cu/Sn-3Ag-0.5Cu (SAC305)/Cu flip-chip joints and electromigration in Cu/In/Cu flip chip joints are investigated. In the electromigration test, a large electromigration void nucleation at the cathode, large growth of intermetallic compounds (IMCs) at the anode, a unique solder bump deformation towards the cathode, and the significantly prolonged electromigration lifetime with the underfill were observed in both types of joints. In addition, the effects of crystallographic orientation of Sn on electromigration were observed in the Cu/SAC305/Cu joints. In the thermomigration test, Cu dissolution was accelerated on the hot side, and formation of IMCs was enhanced on the cold side at a thermal gradient of about $60^{\circ}C$/cm, which was lower than previously reported. The rate of Cu atom migration was found comparable to that of electromigration under current conditions.

• Structural Engineering and Mechanics
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• v.63 no.6
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• pp.703-712
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• 2017

The composite blades of offshore wind turbines accumulate structural damage such as fatigue cracking due to harsh operation environments during their service time, leading to premature structural failures. This paper investigates various fatigue crack models for reproducing crack development in composite blades and proposes a stochastic approach to predict fatigue crack evolution and to analyse failure probability for the composite blades. Three typical fatigue models for the propagation of fatigue cracks, i.e., Miner model, Paris model and Reifsnider model, are discussed to reproduce the fatigue crack evolution in composite blades subjected to cyclical loadings. The lifetime probability of fatigue failure of the composite blades is estimated by stochastic deterioration modelling such as gamma process. Based on time-dependent reliability analysis and lifecycle cost analysis, an optimised maintenance policy is determined to make the optimal decision for the composite blades during the service time. A numerical example is employed to investigate the effectiveness of predicting fatigue crack growth, estimating the probability of fatigue failure and evaluating an optimal maintenance policy. The results from the numerical study show that the stochastic gamma process together with the proper fatigue models can provide a useful tool for remaining useful life predictions and optimum maintenance strategies of the composite blades of offshore wind turbines.

• The KIPS Transactions:PartD
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• v.8D no.4
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• pp.387-392
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• 2001

This Many software projects collect grouped failure data (failures in some failure interval or in variable time interval) rather than individual failure times or failure count data during the testing or operational phase. This paper presents the neural network (NN) modeling for grouped failure data that is able to predict cumulative failures in the variable future time. The two variant models of cascade-correlation learning (CasCor) algorithm are presented. Suggested models are compared with other well-known NN models and statistical software reliability growth models (SRGMs). Experimental results show that the suggested models show better predictability.

• Journal of Welding and Joining
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• v.18 no.3
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• pp.89-96
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• 2000

As solder becomes small and fine, the reliability and solderability of solder joint are the critical issue in present electronic packaging industry. Besides the use of lead(Pb) containing solders for the interconnections of microelectronic subsystem assembly and packaging has enviromental problem. In this study, using Sn/Pb and Sn/Ag eutectic solder paste, in order to obtain decrease of solder joint strength with increasing aging time, initial solder joint strength and aging strength after 1000 hour aging at $100^{\circ}C$ were measured by peel test. And in order to obtain the growth of intermetallic compound(IMC) layer thickness, IMC layer thickness was measured by scanning electron microscope(SEM). As a result, solder joint strength was decreased with increasing aging time. The mean IMC layer thickness was increased linearly with the square root of aging time. The diffusion coefficient(D) of IMC layer was found to $1.29{\times}10^{-13}{\;}cm^2/s$ at using Sn/Pb solder paste, 7.56{\times}10^{-14}{\textrm}{cm}^2/s$ at using Sn/Ag solder paste.

• International Commerce and Information Review
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• v.2 no.1
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• pp.25-48
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• 2009

With the rapid growth of e-logistics in the global logistics industry, it is important to gain further insight into this growing segment of Chinese logistics industry. The current situation in China consists of many small and medium-sized logistics firms. Furthermore, e-logistics is still relatively undeveloped in the majority of the Chinese logistics companies and presently there are still many problems unresolved. This paper attempted to review the concepts and theoretical background of e-logistics systems from previous studies. After acknowledging the essential issues related to e-logistics systems, a research model based on the theory acceptance model was designed and tested. The key factors to the e-logistics system (reliability, maintainability, software, facility and transportation) were validated through the modeling and testing process. Included in the modelling and testing process are other related factors of e-logistics process, logistics information system and added value as dependent variables in this model. The results of this study confirm that the e-logistics Process is affected by transportation, while maintainability and software factors influence logistics information system. reliability, maintainability, facility and transportation are significant factors associated with added value. This research aimed to provide theoretical and practical contribution to Chinese logistics companies and to give some insights into e-logistics system as a whole. The paper also provided some useful theoretical implication and practical guidelines for the development of e-logistics system in the chinese logistics industry.

• International Commerce and Information Review
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• v.11 no.2
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• pp.3-26
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• 2009

With the rapid growth of e-logistics in the global logistics industry, it is important to gain further insight into this growing segment of Chinese logistics industry. The current situation in China consists of many small and medium-sized logistics firms. Furthermore, e-logistics is still relatively undeveloped in the majority of the Chinese logistics companies and presently there are still many problems unresolved. This paper attempted to review the concepts and theoretical background of e-logistics systems from previous studies. After acknowledging the essential issues related to e-logistics systems, a research model based on the theory acceptance model was designed and tested. The key factors to the e-logistics system (reliability, maintainability, software, facility and transportation) were validated through the modeling and testing process. Included in the modelling and testing process are other related factors of e-logistics process, logistics information system and added value as dependent variables in this model. The results of this study confirm that the e-logistics Process is affected by transportation, while maintainability and software factors influence logistics information system. reliability, maintainability, facility and transportation are significant factors associated with added value. This research aimed to provide theoretical and practical contribution to Chinese logistics companies and to give some insights into e-logistics system as a whole. The paper also provided some useful theoretical implication and practical guidelines for the development of e-logistics system in the chinese logistics industry.

• The Transactions of the Korean Institute of Electrical Engineers A
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• v.50 no.7
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• pp.303-308
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• 2001

This paper presents algorithm to plan construction and expanding of substation considering contingency accidents by proposing utilization factor according to configuration of substation bank system. In this paper, firstly, proper sphere of supply area by each district which could be standardized with respect to its supply capacity is established under assumption of long term load forecasting. Secondly, goal of utilization ratio based on configuration of substation bank was set to keep reliability by remaining sound bank when it happen to one bank accidents. Finally, it is set up for optimal construction and expanding of substation considering economy and reliability simultaneously about substation to exceed these ratio. To verify proposed algorithm, at first, after adopting a part of Kangnam area in Seoul as area for testing, it is divided into several regions for this area according to power branches of power utility. Secondly, by deriving correlation factor between load demand and economic indicators in these region respectively, the regional load forecasting was performed with economic growth and city plan scenario. Finally, based on the predicted load demand by region and land use data which is identified from air-photographic, the load demand by district was predicted. Also, planning for substation considering contingency is formulated to expand taking into account computing utilization factor which is based on configuration of substation bank respectively.

• Structural Engineering and Mechanics
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• v.61 no.3
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• pp.325-334
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• 2017

In the present study, a numerical model for probability analysis of optimal design of fatigue non-uniform crack growth behaviour of a cracked aluminium 2024 T3 plate repaired with a bonded composite patch is investigated. The proposed 3D numerical model has advanced in literatures, which gathers in a unique study: problems of reliability, optimization, fatigue, cracks and repair of plates subjected to tensile loadings. To achieve this aim, a finite element modelling is carried out to determine the evolution of the stress intensity factor at the crack tip Paris law is used to predict the fatigue life for a give n crack. To have an optimal volume of our patch satisfied the practical fatigue life, a procedure of optimization is proposed. Finally, the probabilistic analysis is performed in order to a show that optimized patch design is influenced by uncertainties related to mechanical and geometrical properties during the manufacturing process.