• Korean Journal of Materials Research
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• v.34 no.3
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• pp.163-169
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• 2024

As the limitations of Moore's Law become evident, there has been growing interest in advanced packaging technologies. Among various 3D packaging techniques, Cu-SiO₂ hybrid bonding has gained attention in heterogeneous devices. However, certain issues, such as its high-temperature processing conditions and copper oxidation, can affect electrical properties and mechanical reliability. Therefore, we studied depositing only a heterometal on top of the Cu in Cu-SiO₂ composite substrates to prevent copper surface oxidation and to lower bonding process temperature. The heterometal needs to be deposited as an ultra-thin layer of less than 10 nm, for copper diffusion. We established the process conditions for depositing a Co film using a Co(EtCp)₂ precursor and utilizing plasma-enhanced atomic layer deposition (PEALD), which allows for precise atomic level thickness control. In addition, we attempted to use a growth inhibitor by growing a self-assembled monolayer (SAM) material, octadecyltrichlorosilane (ODTS), on a SiO₂ substrate to selectively suppress the growth of Co film. We compared the growth behavior of the Co film under various PEALD process conditions and examined their selectivity based on the ODTS growth time.

• Research in Community and Public Health Nursing
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• v.13 no.2
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• pp.216-229
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• 2002

Objectives: This study was conducted to investigate the effects of a self growth program through MBTI on interpersonal relationships, and the career identity of nursing college students. Methods: A randomized controlled pre-post test experimental design was used for this study. The 24 nursing students were randomly assigned into two groups: 12 for the experimental group, and 12 for the control group. The subjects were junior nursing students, who were randomly selected from an undergraduate nursing program at K university located in Daegu, Korea. The data was collected from March 18 to April 1, 2002. The MBTI self growth program used in this study was based on the one developed by Shim and Kim (1997). The 12 experimental group students received the group self growth program through MBTI for 15 hours, while the 12 control group students received no treatment, except a series of tests. The Korean version MBTI test used in this study was developed and verified for reliability and validity by Kim and Sim (1990). Change in inter-personal relationships was measured using the Relationship Change Scale developed by Schlein and Guerney (1971), and modified by Lee and Mun (1982). Career identity was measured using the My Vocational Situation developed by Holland. Daiger and Power (1980), and revised by Kim (1997). The data were analyzed with the SPSS Win 10.0 program, through which the 2 test, t-test, and Repeated measures ANOVA were examined. Results: 1) The first hypothesis, 'the experimental group that received the self growth program through MBTI will obtain a higher interpersonal relationship score than the control group', was supported (F=5.295. p=.031. Interaction: p=.000). 2) The second hypothesis, 'the experimental group that received the self growth program through MBTI will obtain a higher career identity score than the control group', was supported (F=28.575, p=.000, Interaction: p=.000). Conclusion: The results showed that the ready planned self growth program through MBTI had positive effects on improving the interpersonal relationships, and the career identity of nursing college students.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.9 no.2
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• pp.171-177
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• 2016

Software reliability in the software development process is an important issue. Software process improvement helps in finishing with reliable software product. Infinite failure NHPP software reliability models presented in the literature exhibit either constant, monotonic increasing or monotonic decreasing failure occurrence rates per fault. In this study, reliability software cost model considering shape parameter based on life distribution from the process of software product testing was studied. The cost comparison problem of the Lomax distribution reliability growth model that is widely used in the field of reliability presented. The software failure model was used the infinite failure non-homogeneous Poisson process model. The parameters estimation using maximum likelihood estimation was conducted. For analysis of software cost model considering shape parameter. In the process of change and large software fix this situation can scarcely avoid the occurrence of defects is reality. The conditions that meet the reliability requirements and to minimize the total cost of the optimal release time. Studies comparing emissions when analyzing the problem to help kurtosis So why Kappa efficient distribution, exponential distribution, etc. updated in terms of the case is considered as also worthwhile. In this research, software developers to identify software development cost some extent be able to help is considered.

• Journal of the Korean Data and Information Science Society
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• v.26 no.4
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• pp.947-956
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• 2015

In the knowledge and information age, to discover and protect Intellectual Properties would be very important for their economic value as a major growth engine. This study evaluated the reliability of a Delphi survey conducted by experts to assess the value of agricultural resources knowledge obtained from literature reviews and field interviews. Delphi method is collecting the opinions of experts for several rounds repeatedly, in the next round the experts have chance to modify their opinion. Scores between two rounds are highly correlated and standard deviations are declined for second round to imply that some correction of their evaluations are made. To check reliability of Delphi survey of two rounds Cronbach's reliability coefficient and Generalizability coefficient are derived. The Cronbach alpha's supported the reliability of the method, but the Generalizability analysis revealed some unexpected results while checking the variance components of sources of measurement errors. Despite the increased reliability coefficients, the deviations between the raters are increased which means that additional rounds are required to get consensus, the goal of Delphi research.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.8 no.6
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• pp.445-452
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• 2015

Software reliability in the software development process is an important issue. Software process improvement helps in finishing with reliable software product. Infinite failure NHPP software reliability models presented in the literature exhibit either constant, monotonic increasing or monotonic decreasing failure occurrence rates per fault. In this paper, proposes the reliability model with log and power intensity function (log linear, log power and exponential power), which made out efficiency application for software reliability. Algorithm to estimate the parameters used to maximum likelihood estimator and bisection method, model selection based on mean square error (MSE) and coefficient of determination($R^2$), for the sake of efficient model, was employed. Analysis of failure, using real data set for the sake of proposing log and power intensity function, was employed. This analysis of failure data compared with log and power intensity function. In order to insurance for the reliability of data, Laplace trend test was employed. In this study, the log type model is also efficient in terms of reliability because it (the coefficient of determination is 70% or more) in the field of the conventional model can be used as an alternative could be confirmed. From this paper, software developers have to consider the growth model by prior knowledge of the software to identify failure modes which can be able to help.

• Asia-Pacific Journal of Business Venturing and Entrepreneurship
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• v.14 no.4
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• pp.161-178
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• 2019

The purpose of this study is to analyze the effect of characteristics of the online shopping mall website and the service quality factors required on the online service on the reliability and repurchase intention. Through this, the key customer response service and operation management strategy can be proposed for the growth of kidult online shopping mall which is continuously spreading. Also, implications for development direction can be suggested. For this purpose, the ES-QUAL and E-Rec-S-QUAL factors proposed by Parasuraman et al.(2005) were set as independent variables, as well as professionalism, diversity, playfulness, and personalization, and website reliability as a mediating factor, and repurchase intention as a dependent variable. For the analysis, a structured questionnaires survey was conducted to 200 domestic online shopping mall users. The main results are as follows. First, the professionalism, personalization in the characteristics, and service quality factors had positive effects on website reliability. Second, playfulness, personalization in the characteristics, and service quality factors had positive effects on repurchase intention. Third, website reliability had a positive effect on repurchase intention. Fourth, website reliability was found to mediate the relationship between predictive (independent) variables and dependent variables. The above results show that if a professional online shopping mall is equipped with online service quality and establish personalization through enhancing the professionalism, the online shopping mall can form a website reliability and expect to build continuous relationship with customers. In addition, implications can be suggested for future customer response service and operation management strategies.

• Journal of the Korea Fashion and Costume Design Association
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• v.19 no.2
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• pp.79-90
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• 2017

The main purpose of the study was to explore effects of selection criteria of collaborating fashion companies on the partnership growth of collaborating artists with those companies. Secondly was to find differences in the selection criteria of collaborating fashion companies and the partnership growth of collaborating artists according to the characteristics of artists including gender, age, frequency and time period of collaboration. The questionnaire was developed by the researchers and was collected from 50 artists with experience in collaboration with fashion companies. The questionnaire was composed of three parts including the selection criteria of fashion companies, partnership growth measured by a Likert-type scale, and characteristics of artists measured by a nominal scale. Data were analyzed by a frequency test, factor analysis, reliability test, regression analysis, and independent sample t-test using SPSS Win 18.0. The results of the study showed that significant effects of the selection criteria of collaborating fashion companies on the partnership growth of collaborating artists with the companies. Also, there were differences in the selection criteria of collaborating fashion companies and the partnership growth of collaborating artists between artist groups according to the characteristics of the artists including gender, age, frequency and time period of collaboration.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the KSR Conference
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• 2011.10a
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• pp.2090-2100
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• 2011

Railway rail fastening system is the critical device which gives big influences to not only the vehicle driving stability and the orbit's structural stability against the impulsive load, but also the noise vibration and the ride comfort. As a part of the low-carbon green growth, the importance of the railroad industry is getting highlights on its excellent energy-efficiency and eco-friendliness. However, so far the Korea's domestic rail fastening system technology is not so good and the technical reliance to abroad is very heavy. In this study, we conducted comparative analysis on the rail fastening system with new and used one of the same type. And those systems are imported by Seoul Metro and are being used by it. With this basis, we developed the components and the materials and then, established the durability assessment methods appropriate to the Korean domestic circumstances. And through the reliability qualification test on the 7 parts of the rail fastening system, we've improved the reliability and guaranteed the 15 years of service lifetime. ($B_{10}Life15$) Establishment and standardization of Reliability Standard on the parts of the rail fastening system such as anti-vibration pads, guide-plate, screw spike made it possible to perform the internationally fair assessment. And it is thought that we can satisfy the manufactures' and consumers' needs of cost-cutting and qualification security by shortening of assessment period on rail fastening system.