• Journal of the Korea Society of Computer and Information
• /
• v.1 no.1
• /
• pp.195-210
• /
• 1996

For predicting the parameters and estimating the goodness of fit reliability growth model based on NHPP(Non Homogeneous Poission Process) among various reliability growth models, a Delayed S Shaped SRGM Tool is designed and Implemented. The Implemented tool is applied to real software error data, and the result Is compared and annalized.

• Journal of Korean Society for Quality Management
• /
• v.21 no.2
• /
• pp.131-139
• /
• 1993

The newly proposed model of the future reliability results in earlier fault-fixes having a greater effect than the fault which make the greatest contribution to the overall failure rate tend to show themselves earlier, and so are fixed earlier. The suggested model allows a variety of reliability measures to be calculated. Predictions of total execution time(debugging time) is to achieve a target reliability. This model could also apply to computer-hardware reliability growth resulting from the elimination of design error and fault.

• The Korean Journal of Applied Statistics
• /
• v.21 no.5
• /
• pp.813-823
• /
• 2008

The non-homogeneous Poisson process(NHPP) based software reliability growth models are proved quite successful in practical software reliability engineering. The fault detection rate is usually assumed to be the continuous and monotonic function. However, the fault detection rate can be affected by many factors such as the testing strategy, running environment and resource allocation. This paper describes a parameter estimation of software reliability growth model with change-point problem. We obtain the maximum likelihood estimate(MLE) and least square estimate(LSE), and compare goodness-of-fit.

• Current Photovoltaic Research
• /
• v.8 no.4
• /
• pp.124-128
• /
• 2020

Output power of photovoltaic (PV) modules installed outdoors decreases every year due to environmental conditions such as temperature, humidity, and ultraviolet irradiations. In order to promote the installation of PV modules, the reliability must be guaranteed. One of the important factors affecting reliability is intermetallic compounds (IMC) layer formed in ribbon solder joint. For this reason, various studies on soldering properties between the ribbon and cell have been performed to solve the reliability deterioration caused by excessive growth of the IMC layer. However, the IMC layer of the PV module interconnected by multi-wires has been studied less than using the ribbon. It is necessary to study soldering characteristics of the multi-wire module for improvement of its reliability. In this study, we analyzed the growth of IMC layer of the PV module with multi-wire and the degradation of output power through damp-heat test. The fabricated modules were exposed to damp-heat conditions (85 ºC and 85 % relative humidity) for 1000 hours and the output powers of the modules before and after the damp-heat test were measured. Then, the process of dissolving ethylene vinyl acetate (EVA) as an encapsulant of the modules was performed to observe the IMC layer. The growth of IMC layer was evaluated using OM and FE-SEM for cross-sectional analysis and EDS for elemental mapping. Based on these results, we investigated the correlation between the IMC layer and output power of modules.

• Journal of the Korean Data and Information Science Society
• /
• v.19 no.4
• /
• pp.1361-1369
• /
• 2008

The analysis of software reliability model provides the means to analysts, software engineers, and systems analysts and developers who want to predict, estimate, and measure failure rate of occurrences in software. In this paper, reliability growth model, in which the operating time between successive failure is a continuous random variable, is proposed. This model is based on order statistics of two parameters Burr type XII distribution. We propose the measure based on U-plot. Also the performance of the suggested model is tested on real data set.

• The KIPS Transactions:PartD
• /
• v.8D no.4
• /
• pp.409-420
• /
• 2001

Recently a new approach to evaluation of software reliability, one of important attributes of a software system, during testing has been devised. This approach utilizes test coverage information. The coverage-based software reliability growth models recently appeared in the literature are first reviewed and classified into two classes. Inherent problems of each of the two classes are then discussed and their validity is empirically investigated. In addition, a new mean value function in coverage and a heuristic procedure for selecting the best coverage are proposed.

• Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
• /
• 2000.04a
• /
• pp.40-45
• /
• 2000

Presented are the estimation of the probability distribution of fatigue crack growth life and reliability assessment of structures by simulating material resistance to fatigue crack growth along a crack path. The material resistance is treated as a Weibull stochastic process. A non-Gaussian stochastic fields simulation method proposed by Shimozuka, et al is applied with the statistical data obtained experimentally. Test results are obtained for $\Delta$K constant amplitude load in tension with stress ratio of R=0.2 and three specimen thicknesses of 6, 12 and 18mm. This simulation method is useful to estimate the probability distribution of fatigue crack growth life and the smallest life.

• Journal of Ocean Engineering and Technology
• /
• v.14 no.4
• /
• pp.73-78
• /
• 2000

Presented are the estimation of the probability distribution of fatigue crack growth life and reliability assessment of structures by simulating material resistance to fatigue crack growth along a crack path. The material resistance is treated as a Weibull stochastic process. A non-Gaussian stochastic fields simulation method proposed by shimozuka, et al is applied with the statistical data obtained experimentally. Test results are obtained for $\delta K$ constant amplitude load in tension with stress ratio of R=0.2 and three specimen thicknesses of 6,12 and 18mm. This simulation method is useful to estimate the probability distribution of fatigue crack growth life and the smallest life.

• Convergence Security Journal
• /
• v.11 no.4
• /
• pp.85-91
• /
• 2011

Due to the large-scale application software syslmls, software reliability, software development has animportantrole. In this paper, software truncated software reliability growth model was proposed based on log-logistic distribution. According to fixed time, the intensity function, the mean value function, the reliability was estimated and the parameter estimation used to maximum likelihood. In the empirical analysis, Poisson execution time model of the existiog model in this area and the log-logistic model were compared Because log-logistic model is more efficient in tems of reliability, in this area, the log-logistic model as an alternative 1D the existiog model also were able to confim that you can use.

• Journal of the Korean Data and Information Science Society
• /
• v.17 no.3
• /
• pp.727-742
• /
• 2006

In general, weapon systems require very high reliability. Recently Korean defense reliability technologies growth rapidly. However, there are some matters of reform in reliability management, reliability assurance, and defense acquisition environment, etc. In this paper, we propose the reliability development plan for Korean defense system as follows; 1) reliability improvement programs for each acquisition stages, 2) reliability improvement methods for logistics support, 3) reliability improvement programs for developers and manufacturers, 4) reform matters for the defense acquisition law, 6) establishment of defense reliability assessment center and defense reliability committee.