• 전기의세계
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• v.28 no.7
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• pp.60-66
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• 1979

In this paper we deal with a hardware redundency, using the replications of an original module to enhance the reliability of the system in view of static and dynamic redundancy. As results of the study the following facts have been proved that (1) if the mission time is small (T .neq. 0.5), the effect of spare modules cannot be expected significantly, (2) for the small mission time (0.1 .neq. T .neq. 0.3) the SPR system is more reliable than the other redundant systems. In addition to above facts, it is also proved that for the large mission time (T=1), the dynamic redundant system is more reliable than the static redundant system, and that the SR system is more reliable than the HR system in the dynamic redundant system.

• Journal of the Korea Society for Simulation
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• v.18 no.4
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• pp.59-66
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• 2009

This has been possible by integration techniques such as very large scale integration (VLSI) and wafer scale integration (WSI). Redundancy has been extensively used for manufacturing memory chips and to provide repair of these devices in the presence of faulty cells. If there are too many defects, the momory has to be rejected. But if there are a few defects, it will be more efficient and cost reducing for the company to use it by repairing. Therefore, laser-repair process is nedded for such a reason and redundancy analysis is needed to establish correct target of laser-repair process. The proposed CRA (Correlation Repair Algorithm) simulation, beyond the idea of the conventional redundancy analysis algorithm, aims at reducing the time spent in the process and strengthening cost competitiveness by performing redundancy analysis after simulating each case of defect.