• Transactions of the Korean Society of Mechanical Engineers B
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• v.26 no.8
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• pp.1115-1122
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• 2002

The present experiment investigates the effects of pore density f of aluminum foam heat sinks, the jet-to-jet spacing X and the nozzle plate-to-target surface spacing H of 3$\times$3 square impinging arrays on the averaged Nusselt number. The performance of the aluminum foam heat sinks and the rectangular plate heat sink is evaluated in terms of the enhancement factor. /equation omitted/. The multiple impinging jet with X/d=4.0 displays higher Nusselt numbers than single impinging jet for 12.0$\leq$H/d$\leq$20.0. With the variation of the jet-to-jet spacing, the aluminum foam heat sink of 10 PPI show higher Nusselt numbers than the 20 and 40 PPI aluminum foam heat sinks. Further, the 10 PPI aluminum foam heat sink demonstrates 26% higher enhancement factor than the rectangular plate heat sink in the range of 7000$\leq$Re$\leq$11000.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.9 no.2
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• pp.415-421
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• 2005

The radiating or receiving characteristics of array elements (i.e., antennas) are changed from those of isolated elements due to mutual coupling effects and the array performance becomes different from those originally designed by assuming isolated elements. The effects of mutual coupling on the performance of a rectangular array with triangular grid geometry of dipoles above a ground plane are discussed with respect to element pattern. The concept of element gain function is used to examine the effects of mutual coupling on the array performance in terms of sidelobe level in the uniformly spaced and space-tapered rectangular arrays with triangular grid geometry of dipoles. It was shown that the sidelobe performance improved in the space-tapered array compared to the uniformly spaced array in the presence of mutual coupling effects. Computer simulation results are presented.

• Transactions of the Korean Society of Automotive Engineers
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• v.5 no.6
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• pp.128-140
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• 1997

A new super compact condenser(SCC), which has been developed recently is especially suitable for an alternative refrigerant HFC-134a due to its high performance and compactness. The SCC is composed of two pipe headers, baffles, narrow multi-rectangular channels, and louvered fin arrays. Alternating inlet and outlet by the inserted baffles in pipe headers guide refrigerant to and from the narrow multi-rectangular channels. Since the flow rate and its lengh are changed depending on the number and location of baffles, the corresponding pressure drop and heat transfer rate are changed. The present study aims to theoretically and experimentally investigate the effects of baffle location and its number on the pressure drop and thermal performance of the SCC with 40 multi-rectangular channels. The results show that the present method provides an acceptable prediction of pressure drop and heat transfer rate for a 4 pass SCC. However, the model significantly under predicts the performance of a 3 pass SCC, which may be attributed to the phase separation of refrigerant flowing through header pipes. Pressure drop is more signifi- cantly influenced than heat transfer rate by the baffle location.

• Journal of Advanced Marine Engineering and Technology
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• v.36 no.1
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• pp.57-63
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• 2012

In this study, numerical analyses were performed on pressure drop and heat transfer characteristics in a rectangular horizontal channel with dimple and protrusion arrays of different height. The dimples/protrusions were installed at both top and bottom walls of the rectangular channel. The dimple and protrusion depths are 0.125, 0.2, 0.25, 0.3, and 0.375 times diameter. In case of the dimple, the highest Nusselt number occurred at the rear side of the dimple, and the average Nusselt number tended to decrease slightly with increase of depth. In case of protrusion, on the other hand, the highest Nusselt number occurred at the front side of the protrusion, and the average Nusselt number was increased with the increase of height. In both dimple and protrusion, the average Nusselt number and pressure drop were increased with the increase of velocity. Performance factor was decreased with the increase of velocity, and it was found that the best performance factor was obtained in the low velocity region.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.11
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• pp.2450-2456
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• 2002

Microlenses and microlens arrays are fabricated using a novel fabrication technology based on the exposure of a resist (usually PMMA) to deep X-rays and subsequent thermal treatment. The fabrication technology is very simple and produces microlenses and microlens arrays with good surface roughness (less than 1 nm). The molecular weight and glass transition temperature of PMMA is reduced when it is irradiated with deep X-rays. The microlenses is produced through the effects of volume change, surface tension, and reflow during thermal treatment of irradiated PMMA. The geometry of the microlens is determined by parameters such as the X-ray dose applied to the PMMA, the diameter of the microlens, along with the heating temperature, heating time, and cooling rate in the thermal treatment. Microlenses are produced with diameters ranging from 30 to 1500 ${\mu}{\textrm}{m}$. The modified LIGA process is used not only to construct hemispherical microlenses but also structures that are rectangular-shaped, star-shaped, etc.

• Transactions of Materials Processing
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• v.15 no.1 s.82
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• pp.9-14
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• 2006

In the present research, the simultaneous punching of ultra small size hole of $2\~10\;{\mu}m$ in diameter on flat rolled thin metal foils was conducted with elastic polymer punch. Workpiece used in the present investigation were the rolled pure copper of $3{\mu}m$ in thickness and CP titanium of 1.5fm in thickness. The metal foils were punched with the dies and arrays of circular and rectangular holes were made. The process set-up is similar to that of the flexible rubber pad farming or Guerin process. Arrays of holes were punched successfully in one step forming. The punched holes were examined in terms of their dimensions. The effects of the wafer die hole dimension and heat treatment of the workpiece on ultra small size hole formation of the thin foil were discussed. The process condition such as proper die shape, pressure, pressure rate and diameter-thickness ratio (d/t) were also discussed. The results in this paper show that the present method can be successfully applied to the fabrication of ultra small size hole away in a one step operation.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.09a
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• pp.193-197
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• 2005

This paper presents a method by which multiple holes of ultra small size can be punched simultaneously. Silicon wafers were used to fabricate punching die. Workpiece used in the present investigation were the rolled pure copper of $3{\mu}m$ in thickness and CP titanium of $1.5{\mu}m$ in thickness. The metal foils were punched with the dies and arrays of circular and rectangular holes were made. The diameter of holes ranges from $2-10{\mu}m$. The process set-up is similar to that of the flexible rubber pad forming or Guerin process. Arrays of holes were punched successfully in one step forming. The punched holes were examined in terms of their dimensions, surface qualities, and potential defect. The effects of the die hole dimension on ultra small size hole formation of the thin foil were discussed. The optimum process condition such as proper die shape and diameter-thickness ratio (d/t) were also discussed. The results in this paper show that the present method can be successfully applied to the fabrication of ultra small size hole array in a one step operation.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.56 no.1
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• pp.161-166
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• 2007

In this paper, two 4$\times$4 rectangular patch array antennas operating at 20 GHz are implemented for the satellite communication. The sixteen patch antennas and microstrip feeding line are printed on a single-layered substrate. The design goal is to achieve high directivity and gain by optimizing design parameters through permutations in element spacing. The spacing between the array elements is chosen to be 0.736$\lambda$. Numerical simulation results indicate that the HPBW(Half-Power Beam Width) of the 4$\times$4 patch array antenna is 18.78 degrees in the E-plane and 18.48 degrees in the H-plane with a gain of 17.18 dBi. Numerical simulations of a 4$\times$4 recessed patch array antenna yield a HPBW of 18.71 degrees in the E-plane and 17.82 degrees in the H-plane with a gain of 19.43 dBi.

• Journal for History of Mathematics
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• v.23 no.1
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• pp.25-40
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• 2010

We first seek a principle of cognitive development processes by reviewing and summarizing Piaget's cognitive development theory, constructivism and Dubinsky's APOS theory, and also the epistemology on logics of 墨子 and 荀子. We investigate Chapter 8 方程 on the theory of systems of linear equations, of the Nine Chapters, one of the oldest ancient Asian mathematical books, from the viewpoint of our principle of cognitive development processes. We conclude the educational value of the chapter and the value of the research on Asian ancient mathematical works and heritages.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.8 no.2
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• pp.230-239
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• 1996

A multi-faceted experimental investigation has been carried out to study the cooling performance for stacked modules in arrays of heat generating rectangular modules deployed along PCB's in the enclosed cabinet. The main parameters which have an important effect on cooling characteristics are flow velocity, channel spacing, installation of fan unit, attachment of heat sink, and acoustic noise. The results of individual effect are very helpful for the electronic packaging designer. In order to improve the cooling performance, it is certain that the enlargement of channel space is obviously effective, while this id disadvantageous in high density electronic packaging. Each of the paameters is quantitatively examined as cooling performance and the correlation of Reynolds number to Nusselt number is compared with previous study.