• Transactions on Electrical and Electronic Materials
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• 제14권6호
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• pp.308-311
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• 2013

The effect of an electric field on the ac electrical treeing in various epoxy/reactive diluent systems was studied in a needle-plate electrode geometry. Diglycidyl ether of bisphenol A (DGEBA) type epoxy was used as a base resin, and 1,4-butanediol diglycidyl ether (BDGE) or polyglycol (PG) as a reactive diluent was introduced to the DGEBA system, in order to decrease the viscosity of the DGEBA epoxy system. BDGE was acted as a chain extender, and PG acted as a flexibilizer, after the curing reaction. To measure the treeing initiation time and the propagation rate, three constant alternating currents (ac) of 10, 13 and 15 kV/4.2 mm (60 Hz) were applied to the specimen, in a needle-plate electrode arrangement, at $30^{\circ}C$ of insulating oil bath. When 10 kV/4.2 mm (60 Hz) was applied, the treeing initiation time and the propagation rate in the DGEBA system were 356 min and $1.10{\times}10^{-3}$ mm/min, respectively, those in the DGEBA/BDGE system were 150 min and $1.14{\times}10^{-3}$ mm/min, respectively. Those in the DGEBA/PG system were 469 min and $1.05{\times}10^{-3}$ mm/min, respectively. As 15 kV/4.2 mm (60 Hz) was applied, the propagation rate in the DGEBA system was $5.41{\times}10^{-3}$ mm/min, and that in the DGEBA/PG system was $1.42{\times}10^{-3}$ mm/min. These values meant that PG could be used as a reactive diluent in the DGEBA system, without the deterioration of the insulation breakdown property.

• Transactions on Electrical and Electronic Materials
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• 제15권2호
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• pp.77-80
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• 2014

The effect of reactive diluents on the ac electrical treeing in epoxy/nanosilicate systems was studied, in a needle-plate electrode geometry. Diglycidyl ether of bisphenol A (DGEBA) type epoxy was used as a base resin, and layered silicate was used as a nano-sized filler. Polyglycol (PG) or 1,4-butanediol diglycidyl ether (BDGE) was introduced as a reactive diluent to the DGEBA/nanosilicate system, in order to decrease the viscosity of the nanocomposite system. PG acted as a flexibilizer, and BDGE acted as a chain extender, after the curing reaction. To measure the treeing propagation rate, a constant alternating current (ac) of 10 kV/4.2 mm (60 Hz) was applied to the specimen, in a needle-plate electrode arrangement, at $30^{\circ}C$ of insulating oil bath. When 10 kV/4.2 mm (60 Hz) was applied, the treeing propagate rate in the DGEBA system was $1.10{\times}10^{-3}$ mm/min, and that in the DGEBA/PG system was $1.05{\times}10^{-3}$ mm/min. As 1.5 wt% of nanosilicate was added to the DGEGA/PG system, the propagation rate was $0.33{\times}10^{-3}$ mm/min. This meant that the nano-sized layered silicates would act as good barriers to treeing propagation. The effect of chlorine content was also studied, and it was found that chlorine had a bad effect on the electrical insulation property of the epoxy system.

• Transactions on Electrical and Electronic Materials
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• 제15권2호
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• pp.87-90
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• 2014

The effects of electric field frequency on the ac electrical treeing phenomena in an epoxy/reactive diluent/layered silicate (1.5 wt%) were carried out, in needle-plate electrode arrangement. A layered silicate was exfoliated in an epoxy base resin, by using our ac electric field apparatus. To measure the treeing propagation rate, constant alternating current (AC) of 10 kV with three different electric field frequencies (60, 500 and 1,000 Hz) was applied to the specimen, in needle-plate electrode arrangement, at $30^{\circ}C$ of insulating oil bath. As the electric field frequency increased, the treeing propagation rate increased. At 500 Hz, the treeing propagation rate of the epoxy/PG/nanosilicate system was $0.41{\times}10^{-3}$ mm/min, which was 3.4 times slower than that of the epoxy/PG system. The electrical treeing morphology was dense bush type at 60 Hz; however, as the frequency increased, the bush type was changed to branch type, having few branches, with very slow propagation rate.

• Transactions on Electrical and Electronic Materials
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• 제14권6호
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• pp.317-320
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• 2013

Partial discharge resistance for the epoxy systems with two diluents was investigated in the rod-plane electrodes arrangement, and the effect of electric frequency on the partial discharge resistance was also studied. Diglycidyl ether of bisphenol A (DGEBA) type epoxy was used as a base resin, and 1,4-butanediol diglycidyl ether (BDGE) or polyglycol (PG) as a reactive diluent was introduced to the DGEBA system, in order to decrease the viscosity of the DGEBA epoxy system. BDGE was acted as a chain extender, and PG acted as a flexibilizer, after the curing reaction. To measure the partial discharge resistance, 5 kV alternating current (ac) with three different frequencies (60, 500 and 1,000 Hz) was applied to the specimen in a rod-plane electrode arrangement, at $30^{\circ}C$. PG had a good effect, while BDGE had a bad effect on the partial discharge resistance of the DGEBA system, regardless of the electric frequency.

• 한국인쇄학회지
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• 제12권1호
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• pp.69-79
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• 1994

For the vehicle of UV ink formulated with prepolymer and/or reactive diluent, according to change photoinitiator concentration, we measured viscoelasticity of films of bisphenol A diacrylate cured by UV irrdiation, investigated dynamic characteristics and structural changes.

• 접착 및 계면
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• 제17권2호
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• pp.67-71
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• 2016

본 연구에서는 반응성 희석제 함량에 따라 접착강도 및 물성을 향상시키기 위해 polyether polyol/polyester polyol, 4,4-dicyclohexylmethane diisocyanate ($H_{12}MDI$), 2-butanone oxime (MEKO)를 사용하여 저점도 폴리우레탄 핫멜트를 합성하였다. 합성된 저점도 폴리우레탄 핫멜트의 물성은 FT-IR, viscosity meter 및 UTM 등을 통해 확인하였다. 반응성 희석제의 함량이 증가하고 NCO-blocked prepolymer가 감소함에 따라 저점도 폴리우레탄 핫멜트 접착제의 점도는 증가하였으며, OH-terminated oligomer, NCO-blocked prepolymer, 반응성 희석제 함량의 비가 1 : 0.5 : 0.5일 때 1.1 kgf/cm 접착강도를 나타내었다.

• Transactions on Electrical and Electronic Materials
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• 제14권4호
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• pp.199-202
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• 2013

In order to study the effect of reactive diluents on the electrical insulation breakdown strength and mechanical properties of, a polyglycol and an aliphatic epoxy were individually introduced to an epoxy system. Reactive diluents were used in order to decrease the viscosity of the epoxy system; polyglycol acted as a flexibilizer and 1,4-butanediol diglycidyl ether (BDGE) acted as an aliphatic epoxy, which then acted as a chain extender after curing reaction. The ac electrical breakdown strength was estimated in sphere-to-sphere electrodes and the electrical breakdown strength was estimated by Weibull statistical analysis. The scale parameters of the electrical breakdown strengths for the epoxy resin, epoxy-polyglycol, and epoxy-BDGE were 45.0, 46.2, and 45.1 kV/mm, respectively. The flexural and tensile strengths for epoxy-BDGE were lower than those of the epoxy resin and those for epoxy-polyglycol were lower than those of the epoxy resin.

• 공업화학
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• 제5권6호
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• pp.1030-1035
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• 1994

에폭시 수지의 성형 가공성을 조절하기 위해 반응성 희석제를 사용했을 때의 경화특성 및 경화 후 유리 전이온도의 변화를 조사하였다. 반응성 희석제로 사용한 Butyl gilcidyl ether(BGE) 및 Phenyl glycidyl ether(PGE)함량의 증가에 따라 경화에 따른 발열량과 경화 후 유리 전이온도는 낮아지는 특성이 관찰되었다. 에폭시 수지는 BGE를 사용한 경우 PGE를 사용한 경우보다 더 낮은 유리 전이온도를 보였으며, 희석제의 첨가에 따른 유리 전이온도 변화는 가교점 사이의 분자량 증가 때문으로 해석하였다. 에폭시 수지의 경화 거동을 자촉매 반응에 대한 속도론식으로 해석한 결과 속도상수 $k_1$, $k_2$는 희석제의 양에 따라 감소하였다.

• 폴리머
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• 제37권1호
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• pp.121-126
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• 2013

4,4'-Thiodibenzenethiol을 기반으로 이관능 에폭시 수지인 4,4'-thiodibenzenethiol diglycidyl ether를 직접합성법으로 합성하였다. 합성된 에폭시 수지가 광경화가 가능하도록 acrylic acid와 반응시켜 광경화형 고굴절 이관능 에폭시 아크릴레이트인 4,4'-thiodibenzenethiol diglycidyl ether diacrylate를 합성하였으며 $^1H$ NMR과 FTIR을 이용하여 화학구조를 확인하였다. 이관능 에폭시 아크릴레이트와 함께 반응성 희석제인 2-phenoxythiol ethyl acrylate를 5, 10, 15, 20, 30 wt% 희석하여 점도와 굴절률과의 상관관계를 확인하였으며 광경화 후 경화필름의 굴절률 변화를 고찰 하였다. 반응성 희석제의 농도가 증가함에 따라 경화물의 경화도가 낮아졌으며, 경화도가 클수록 경화 후 굴절률은 높아지는 경향을 확인하였다.

• 한국분말재료학회지
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• 제10권5호
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• pp.344-347
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• 2003

Pure tantalum powder has been produced by combining Na as a reducing agent, $K_2$TaF$_{7}$ as feed material, KCl and KF as a diluent in a stainless steel (SUS) bomb, using the method of metallothermic reduction. And we examined various types of after-treatment that affect the high purification of powder. A significant amount of impurities contained in recovered powder was removed in various conditions of acid washing. In particular, 20% (HCl + HNO$_3$) was effective in removing heavy metal impurities such as Fe, Cr and Ni, 8% H$_2$SO$_4$ + 8% $Al_2$(SO$_4$)$_3$ in removing fluorides such as K and F from non-reactive feed material, and 2% $H_2O$$_2$ + 1 % HF in removing oxides that formed during reaction. Significant amounts of oxygen and part of light metal impurities could be removed through deoxidation and heat treatment process. On the other hand, because it is difficult to remove completely heavy metal impurities such as Fe, Cr, and Ni through acid washing or heat treatment process if their contents are too high, it is considered desirable to inhibit these impurities from being mixed during the reduction process as much as possible.