• Journal of the Korean Institute of Telematics and Electronics
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• v.25 no.8
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• pp.950-958
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• 1988

We have implemented a RTA system using W-halogen lamps and tried to recrystallize the phosphorus ion implanted amorphous silicon on insultor (SOI) taking advantages of seeding window. The purpose of this study is to investigate the possibility of a typical crystalline orientation occurred during the solidifying process of molten amorphous silicon layer. Experimental results show that several twin boundaries are found on the seeding window region after annealing for 15 sec at 1040\ulcorner. These twin boundaries represent that the recrystallization is partialy possible and when the annealing is done at 1150\ulcorner, (100) etch pits with <110> facets are found on the solidified amorphous silicon layer. Consequently, Hall mobility of recrystallized silicon film is measured and the thermal behavior of grain boundary is also observed by SEM.

• Journal of the Korean Society of Combustion
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• v.11 no.2
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• pp.22-27
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• 2006

This experimental study has been mainly motivated to obtain generally applicable design correlation for the front mixing premix combustor. The design concept of the front mixing premix combustor is to minimize thermal $NO_x$ and prompt $NO_x$ formation by maintaining low peak flame temperature, and nearly uniform flame temperature through rapid mixing process near the ignition point. The present experimental results clearly indicate that the front mixing premix combustor yields the $NO_x$ level lower than 43 ppm $NO_x$ emissions and the nearly uniform temperature distribution.

• Rapid Communication in Photoscience
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• v.1 no.2
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• pp.27-29
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• 2012

Noble diamine monomers containing thiophene moiety were prepared, such as 2,5'''-diamino-2, 2':5', 2'':5'', 2'''-quaterthiophene (4TDA) and 2, 5'''''-diamino-3'', 4'''-dihexyl-2,2':5', 2'':5'', 2''':5''', 2'''':5'''', 2'''''-sexithiophene (6TDA). Then, these monomers were utilized to prepare polyimides with 3,6-diphenylpromellitic dianhydride (DPPMDA), 3,6-di(4'-trifluoro-methylphenyl) pyromellitic dianhydride (6FPMDA) or 3,6-di(3',5'-bis (trifluoromethyl)phenyl) pyromellitic dianhydride (12FPMDA) via a conventional two-step process. The polyimides were characterized by FT-IR, TGA and DSC, and then subjected CV, UV-vis and PL measurements. The polyimides containing thiophene moiety exhibited high glass transition temperatures ($280{\sim}310^{\circ}C$) and excellent thermal stability (> $420^{\circ}C$) in air as well as green emission (535~586 nm).

• Transactions of the Korean Society of Mechanical Engineers A
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• v.24 no.1 s.173
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• pp.1-6
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• 2000

As dies and molds have become more and more complicated in the recent years, the demand for lower cost and shorter production time is also growing stronger. Rapid prototyping and Tooling technologies are expected to be used for more rapid and lower cost tool fabrication. However the rapid tooling methods have not yet reached the level of application to the manufacturing of metallic dies and molds which require high dimensional accuracy. As the rapid tooling technology, there are the slurry casting, the powder casting, the direct laser sintering, and so on. Generally, in the slurry casting, the alumina powder and the water soluble phenol were mainly used. However, the mechanical properties of the phenol were not good enough to apply to molds directly. In this study, pure epoxy and two types of aluminium powder reinforced resin are applied to the slurry casting. The mechanical and thermal properties are better than phenol because the epoxy is the thermosetting resin. And mechanical characteristics such as shrinkage rate, hardness, surface roughness are measured for the sake of comparison. Metal powder reinforced resin molds are better than the resin tool form the viewpoint of shrinkage rate and hardness. Finally, it has been shown that the application possibility of this process is high, because the manufacturing time and cost savings are significant.

• Journal of Ocean Engineering and Technology
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• v.25 no.3
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• pp.28-33
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• 2011

The thermal shock properties of SiC materials were investigated for high temperature applications. In particular, the effect of thermal shock temperature on the flexural strength of SiC materials was evaluated, in conjunction with a detailed analysis of their microstructures. The efficiency of a nondestructive technique using ultrasonic waves was also examined for the characterization of SiC materials suffering from a cyclic thermal shock history. SiC materials were fabricated by a liquid phase sintering process (LPS) associated with hot pressing, using a commercial submicron SiC powder. In the materials, a complex mixture of $Al_2O_3$ and $Y_2O_3$ powders was used as a sintering additive for the densification of the microstructure. Both the microstructure and mechanical properties of the sintered SiC materials were investigated using SEM, XRD, and a three point bending test. The SiC materials had a high density of about 3.12 Mg/m3 and an excellent flexural strength of about 700 MPa, accompanying the creation of a secondary phase in the microstructure. The SiC materials exhibited a rapid propagation of cracks with an increase in the thermal shock temperature. The flexural strength of the SiC materials was greatly decreased at thermal shock temperatures higher than $700^{\circ}C$, due to the creation of microcracks and their propagation. In addition, the SiC materials had a clear tendency for a variation in the attenuation coefficient in ultrasonic waves with an increase in thermal shock cycles.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.4
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• pp.15-22
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• 1999

Generally, many equipments and a long lead time ale required to manufacture the build-up multilayer board through various processes such as etching, plating, drilling etc. Wet process is suitable for mass production, however it is not adequate for manufacturing prototype in developing stage. In this study, a silk screen printing technology is introduced to make a prototype build-up multilayer board. As for the material photo/thermal curable resin and conductive paste are used for forming dielectric and conductor. And conductive paste fills vias for interconnecting each layer, and also is used for circuit patterning by silk screen technology. Finally, the basic concept and the possibility of build-up multilayer board prototype is proposed and verified as a powerful approach, compared with the conventional processes.

• Transactions of Materials Processing
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• v.14 no.6 s.78
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• pp.502-508
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• 2005

Hypereutectic Al-Si alloys have been regarded attractive for automotive and aerospace application, due to high specific strength, good wear resistance, high thermal stability, low thermal expansion coefficient and good creep resistance. Spray casting of hypereutectic Al-Si alloy has been reported to provide distinct advantages over ingot metallurgy (IM) or rapid solidification/powder metallurgy (RS/PM) process in terms of microstructure refinement. In this study, hypereutectic Al-25Si-2.0Cu-1.0Mg alloy was prepared by OSPREY spray casting process. The change of strain rate sensitivity and Creep transition were analyzed by using the load relaxation test and constant creep test. High temperature deformation behavior of the hypereutectic Al-Si alloy has been investigated by applying the internal variable theory proposed by Chang et al. Especially, the creep resistance of spray casted hypereutectic Al-Si alloy can be enhanced considerably by the accumulation of prestrain.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2004.10a
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• pp.294-297
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• 2004

RTP(Rapid Thermal Pressing) is to fabricate desired pattern on polymer substrate by pressing patterned mold against the substrate heated around glass transition temperature. For a successful RTP process, the whole process including heating, molding, cooling and demolding should be conducted 'rapidly' as possible. As the RTP process is effective in replicating patterns on flat large surface without causing shape distortion after cooling, it is being widely used for fabricating various micro/bio application components, especially with channel-type microstructures on surface. This investigation finally aims to develop a RTP process machine for mass-producing micro/bio application components. As a first step for that purpose, we intended to examine the technological difficulties for realizing mass production by RTP process. Therefore, in the current paper, 4 kinds of RTP machines were examined and then the RTP process was conducted experimentally for PMMA film by using one of the machines, HEX 03. The micro-patterned molds used for RTP experiment was fabricated from silicon wafer by semi-conduct process. The replicated micro patterns on PMMA films were examined using SEM and the causes of defect observed in the replicated patterns were discussed.

• Korean Journal of Materials Research
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• v.14 no.3
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• pp.218-223
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• 2004

P-type $\beta$-FeSi$_2$ with a nominal composition of $Fe_{0.92}Mn_{0.08}Si_2$ powders has been produced by mechanical alloying process. As-milled powders were spray dried and consolidated by atmospheric plasma thermal spraying as a rapid sintering process. As-milled powders were of metastable state and fully transformed to $\beta$-$FeSi_2$ phase by subsequent isothermal annealing. However, as-thermal sprayed $Fe_{0.92}Mn_{0.08}Si_2$ consisted of untransformed mixture of $\alpha$-$Fe_2Si_{5}$ and $\varepsilon$-FeSi phases. Isothermal annealing has been carried out to induce transformation to the thermoelectric semiconducting $\beta$-$FeSi_2$ phase. Isothermal annealing at $845^{\circ}C$ in vacuum gradually led to the thermoelectric semiconducting $\beta$-$FeSi_2$ phase transformation, but some residual metallic $\alpha$ and $\varepsilon$ phases were unavoidable even after prolonged annealing. Thermoelectric properties of $\beta$-$FeSi_2$ materials before and after isothermal annealing were evaluated. Seebeck coefficient increased and electric conductivity decreased with increasing annealing time due to the phase transition from metallic phases to semiconducting phases. Thermoelectric properties showed gradual increment, but overall properties appeared to be inferior to those of vacuum hot pressed specimens.

• Korean Journal of Metals and Materials
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• v.46 no.3
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• pp.159-168
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• 2008

Thermally-evaporated 10 nm-Ni/1 nm-Ru/(30 nm or 70 nm-poly)Si structures were fabricated in order to investigate the thermal stability of Ru-inserted nickel monosilicide. The silicide samples underwent rapid thermal anne aling at $300{\sim}1,100^{\circ}C$ for 40 seconds. Silicides suitable for the salicide process were formed on the top of the single crystal and polycrystalline silicon substrates mimicking actives and gates. The sheet resistance was measured using a four-point probe. High resolution X-ray diffraction and Auger depth profiling were used for phase and chemical composition analysis, respectively. Transmission electron microscope and scanning probe microscope(SPM) were used to determine the cross-sectional structure and surface roughness. The silicide, which formed on single crystal silicon and 30 nm polysilicon substrate, could defer the transformation of $Ni_2Si $i and $NiSi_2 $, and was stable at temperatures up to $1,100^{\circ}C$ and $1,100^{\circ}C$, respectively. Regarding microstructure, the nano-size NiSi preferred phase was observed on single crystalline Si substrate, and agglomerate phase was shown on 30 nm-thick polycrystalline Si substrate, respectively. The silicide, formed on 70 nm polysilicon substrate, showed high resistance at temperatures >$700^{\circ}C$ caused by mixed microstructure. Through SPM analysis, we confirmed that the surface roughness increased abruptly on single crystal Si substrate while not changed on polycrystalline substrate. The Ru-inserted nickel monosilicide could maintain a low resistance in wide temperature range and is considered suitable for the nano-thick silicide process.